Patents by Inventor Shigetoshi Ipposhi
Shigetoshi Ipposhi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20180249596Abstract: A cooler configured to cool an electronic device includes: a refrigerant inlet portion configured to guide refrigerant from an outside of a casing to an inside of the casing; a refrigerant outlet portion configured to guide the refrigerant from the inside of the casing to the outside of the casing; and a metal member configured to define a flow path region in which the refrigerant is caused to flow from the refrigerant inlet portion to the refrigerant outlet portion in the inside of the casing. The metal member includes: a plurality of opening portions configured to cause the refrigerant to pass therethrough; and a capture and reduction portion having such a shape as to capture air bubbles, which are generated through a connection surface between the casing and the electronic device, so as to reduce the air bubbles through cooling by the refrigerant when the electronic device is cooled.Type: ApplicationFiled: April 22, 2016Publication date: August 30, 2018Applicant: MITSUBISHI ELECTRIC CORPORATIONInventors: Yugo ASAI, Shigetoshi IPPOSHI, Masaru SHINOZAKI, Hiroyuki HIGASHINO, Kazuki SAKATA, Masakazu TANI
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Publication number: 20180209689Abstract: A heat utilizing apparatus includes a heat pump including a first heat exchanger and a second heat exchanger, a first heat storage unit storing heat exchanged in the first heat exchanger, a second heat storage unit storing heat exchanged in the second heat exchanger, a third heat exchanger exchanging heat with the first heat storage unit, a fourth heat exchanger exchanging heat with the second heat storage unit 8, a measurement unit measuring a heat storage amount of the first heat storage unit, a heat rejection unit reducing the heat storage amount of the first heat storage unit, a determination unit determining, in accordance with a measurement result of the measurement unit, whether to reduce the heat storage amount of the first heat storage unit and a heat storage amount of the second heat storage unit, and a control unit adjusting the amount of heat to be reduced through the heat rejection unit in accordance with a determination result of the determination unit.Type: ApplicationFiled: February 23, 2016Publication date: July 26, 2018Applicant: Mitsubishi Electric CorporationInventors: Shigetoshi IPPOSHI, Yoshikazu YAJI, Shunkei SUZUKI, Toshio SHINOKI
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Publication number: 20180084673Abstract: Provided is a cooling device, a power conversion device, and a cooling system in which bubbles produced by boiling in the cooling device are inhibited from flowing out of the cooling device, and thus, vibration, noise, and damage to pipes and other components can be prevented. A cooling device according to the present invention includes a housing having a hollow interior, the housing having a refrigerant inlet from which refrigerant flows in and a refrigerant outlet from which the refrigerant flows out, and having, in the hollow interior, a refrigerant flow path through which the refrigerant flows, and an opening body provided in the housing, dividing the refrigerant flow path into a first area including a heating surface being at least one of a bottom surface and side surfaces of the housing and heating the refrigerant, and a second area including the refrigerant outlet, and having a plurality of openings.Type: ApplicationFiled: March 25, 2015Publication date: March 22, 2018Applicant: Mitsubishi Electric CorporationInventors: Yugo ASAI, Shigetoshi IPPOSHI, Masaru SHINOZAKI, Hiroyuki HIGASHINO, Kazuki SAKATA, Masakazu TANI
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Patent number: 9915482Abstract: A heat sink including a base section, connection fins, and parallel fins. The base section includes: a first base plate configured to be mounted with a heat generating component on its outer surface; a second base plate disposed to face the first base plate in a parallel manner, configured to be mounted with a heat generating component on its outer surface; and a third base plate disposed perpendicular to the first base plate and the second base plate, which secures the first base plate and the second base plate along a junction line. The base section includes first and second regions arranged in the direction of the junction line. The connection fins are disposed on the first region to connect inner surfaces of the first and second base plates and to be parallel to the third base plate, and the parallel fins are disposed on the second region from an inner surface of the third base plate to be parallel to the first base plate.Type: GrantFiled: March 25, 2011Date of Patent: March 13, 2018Assignee: Mitsubishi Electric CorporationInventors: Kenji Kato, Shigetoshi Ipposhi, Toshiki Tanaka, Shinya Motokawa, Toshio Nakayama, Masafumi Ibushi
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Publication number: 20180027704Abstract: The power conversion device of the invention includes: a cooling unit that is a prism, the interior of which is hollow, and that has a refrigerant inlet portion and a refrigerant outlet portion the cooling unit having in the interior thereof a refrigerant channel through which a refrigerant flows from the refrigerant inlet portion towards the refrigerant outlet portion; electronic devices that are respectively disposed on three or more surfaces on the outside of side surfaces of the cooling unit, excluding a refrigerant inlet surface, in which the refrigerant inlet portion is disposed, and a refrigerant outlet surface, in which the refrigerant outlet portion is disposed, the electronic devices being cooled by boiling of the refrigerant; and a hollow outer case 4 that covers the electronic devices.Type: ApplicationFiled: March 25, 2015Publication date: January 25, 2018Applicant: MITSUBISHI ELECTRIC CORPORATIONInventors: Masaru SHINOZAKI, Shigetoshi IPPOSHI, Hiroyuki HIGASHINO, YUGO ASAI, Hiroyuki YANO, Haruyuki MATSUO
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Patent number: 9863302Abstract: A cooling device includes a base plate to a rear surface side of which an under-floor device is attached. A heat radiating unit is attached to a front surface side of the base plate and radiating heat is conducted from the under-floor device via the base plate. A cover surrounding the heat radiating unit and including a side opening is capable of causing traveling wind to flow therein and thereout, in opposite side surfaces facing a traveling direction of a vehicle. A guide plate guides traveling wind flowing in from the side opening to the heat radiating unit by blocking at least part of a gap area between a surface connecting the opposite side surfaces and the heat radiating unit, the guide plate being provided in a side gap area between a side surface of the cover and the heat radiating unit on a traveling-wind flow-in side.Type: GrantFiled: November 22, 2012Date of Patent: January 9, 2018Assignee: Mitsubishi Electric CorporationInventors: Hiroyuki Higashino, Yukio Nakashima, Shigetoshi Ipposhi
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Patent number: 9557045Abstract: A light source device includes an outer housing, a partitioning member for forming a multi-stage structure in the outer housing, thereby partitioning each stage, a plurality of light source units disposed in respective stages of the outer housing, each of which has light source members and a heat pump unit for cooling the light source members, an opening portion for taking air acting as cooling air to be supplied to a cooling body from an outer part of the outer housing into an inner part thereof, and an opening portion formed along arrangement of the light source units in the partitioning member.Type: GrantFiled: February 28, 2013Date of Patent: January 31, 2017Assignee: MITSUBISHI ELECTRIC CORPORATIONInventors: Yukio Sato, Mitoru Yabe, Shigetoshi Ipposhi
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Publication number: 20160276895Abstract: In a mechanically and electrically integrated driving apparatus, a common coolant flow channel for cooling a motor unit and an inverter unit is disposed inside a wall portion of a frame unit. Power modules are placed in close contact with an inner wall surface of the frame unit. A bracket that is separate from the frame unit is fitted into the frame unit. A space inside the frame unit is divided by the bracket into: a space in which the motor unit is housed; and a space in which the inverter unit is housed.Type: ApplicationFiled: October 20, 2014Publication date: September 22, 2016Applicant: MITSUBISHI ELECTRIC CORPORATIONInventors: Junichi AIZAWA, Yoshihiro MIYAMA, Akihiro DAIKOKU, Norihiro WATANABE, Hideaki ARITA, Shota HANIOKA, Shigetoshi IPPOSHI
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Publication number: 20140318736Abstract: A cooling device includes a base plate to a rear surface side of which an under-floor device is attached; a heat radiating unit attached to a front surface side of the base plate and radiating heat conducted from the under-floor device via the base plate; a cover surrounding the heat radiating unit and including a side opening capable of causing traveling wind to flow therein and thereout, in opposite side surfaces facing a traveling direction of a vehicle; and an guide plate guiding traveling wind flowing in from the side opening to the heat radiating unit by blocking at least part of a gap area between a surface connecting the opposite side surfaces and the heat radiating unit, the guide plate being provided in a side gap area between a side surface of the cover and the heat radiating unit on a traveling-wind flow-in side.Type: ApplicationFiled: November 22, 2012Publication date: October 30, 2014Applicant: Mitsubishi Electric CorporationInventors: Hiroyuki Higashino, Yukio Nakashima, Shigetoshi Ipposhi
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Patent number: 8807760Abstract: The present invention is directed to provide a light source apparatus that includes space-saving LED cooling unit, and a projector type image display apparatus including the same. The light source apparatus of the present invention includes a plurality of LEDs, a plurality of heatsinks that are respectively thermally coupled to the LEDs and that are disposed in series with an interval between each other, and a cooler mechanism that sends a cooling airflow into the heatsinks along their disposition direction. A heatsink included in the plurality of heatsinks that dissipates the heat of an LED having a greater heat generating amount out of the plurality of LEDs is disposed downstream in the cooling airflow from the other heatsink.Type: GrantFiled: January 7, 2011Date of Patent: August 19, 2014Assignee: Mitsubishi Electric CorporationInventors: Naoki Kanno, Shigenori Shibue, Takuya Kodama, Shigetoshi Ipposhi
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Publication number: 20130258666Abstract: A light source device includes an outer housing, a partitioning member for forming a multi-stage structure in the outer housing, thereby partitioning each stage, a plurality of light source units disposed in respective stages of the outer housing, each of which has light source members and a heat pump unit for cooling the light source members, an opening portion for taking air acting as cooling air to be supplied to a cooling body from an outer part of the outer housing into an inner part thereof, and an opening portion formed along arrangement of the light source units in the partitioning member.Type: ApplicationFiled: February 28, 2013Publication date: October 3, 2013Applicant: Mitsubishi Electric CorporationInventors: Yukio SATO, Mitoru YABE, Shigetoshi IPPOSHI
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Publication number: 20130081798Abstract: A heat sink including a base section, connection fins, and parallel fins. The base section includes: a first base plate configured to be mounted with a heat generating component on its outer surface; a second base plate disposed to face the first base plate in a parallel manner, configured to be mounted with a heat generating component on its outer surface; and a third base plate disposed perpendicular to the first base plate and the second base plate, which secures the first base plate and the second base plate along a junction line. The base section includes first and second regions arranged in the direction of the junction line. The connection fins are disposed on the first region to connect inner surfaces of the first and second base plates and to be parallel to the third base plate, and the parallel fins are disposed on the second region from an inner surface of the third base plate to be parallel to the first base plate.Type: ApplicationFiled: March 25, 2011Publication date: April 4, 2013Applicant: Mitsubishi Electric CorporationInventors: Kenji Kato, Shigetoshi Ipposhi, Toshiki Tanaka, Shinya Motokawa, Toshio Nakayama, Masafumi Ibushi
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Patent number: 8107241Abstract: In a conventional cooling device, a heat pipe or a circulation-type liquid cooler provided with a pump is used and therefore, a large space is needed for the cooling device. There is provided a cooling device which includes a plurality of cooling modules having cooling units for cooling heat-generating elements by coolant and radiation units for radiating heat from the coolant heated in the cooling units, the plurality of cooling modules being bubble-pump-type ones in which the coolant is circulated between the radiation units and the cooling units by the coolant being boiled in the cooling units, the radiation units being arranged side by side, and a cooling fan for generating wind blowing the radiation units.Type: GrantFiled: March 31, 2006Date of Patent: January 31, 2012Assignee: Mitsubishi Electric CorporationInventors: Tetsuya Takahashi, Kazuyoshi Toya, Akihiro Murahashi, Yasushi Nakayama, Shigetoshi Ipposhi, Kenichi Hayashi
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Publication number: 20110181842Abstract: The present invention is directed to provide a light source apparatus that includes space-saving LED cooling unit, and a projector type image display apparatus including the same. The light source apparatus of the present invention includes a plurality of LEDs, a plurality of heatsinks that are respectively thermally coupled to the LEDs and that are disposed in series with an interval between each other, and a cooler mechanism that sends a cooling airflow into the heatsinks along their disposition direction. A heatsink included in the plurality of heatsinks that dissipates the heat of an LED having a greater heat generating amount out of the plurality of LEDs is disposed downstream in the cooling airflow from the other heatsink.Type: ApplicationFiled: January 7, 2011Publication date: July 28, 2011Inventors: Naoki KANNO, Shigenori SHIBUE, Takuya KODAMA, Shigetoshi IPPOSHI
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Publication number: 20110179806Abstract: Disclosed is a cooling apparatus including: a heat receiving plate to which a plurality of heating elements are attached; a radiator plate to which a plurality of Peltier devices are attached; a thermal transport heat pipe that couples the heat receiving plate with the radiator plate; and a heat dissipating device being provided on an exothermic side of the Peltier devices; wherein the plurality of heating elements are arranged along a longitudinal direction of the thermal transport heat pipe, and the plurality of Peltier devices are arranged along the longitudinal direction of the thermal transport heat pipe, whereby, when using a plurality of Peltier devices, reducing power consumption thereof by equalizing each operation of the respective Peltier devices.Type: ApplicationFiled: October 22, 2010Publication date: July 28, 2011Applicant: MITSUBISHI ELECTRIC CORPORATIONInventors: Shigetoshi Ipposhi, Tatsuro Hirose, Kazuo Kadowaki, Takumi Kijima, Takayuki Nakao
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Publication number: 20100051240Abstract: A variable conductance heat pipe is provided. The variable conductance heat pipe includes a sealed container in which a working fluid and a noncondensable gas are sealed, the sealed container extending in an axial direction. The sealed container includes one end to be connected to a heating source and a part to be connected to a heat sink. On a cross section of the sealed container along a direction orthogonal to the axial direction, a portion having water conveying property better than other portions is provided. The portion having the better water conveying property extends in the axial direction.Type: ApplicationFiled: August 27, 2009Publication date: March 4, 2010Applicant: MITSUBISHI ELECTRIC CORPORATIONInventors: Shigetoshi IPPOSHI, Tetsuya Nagayasu, Shingo Hironaka, Kuraki Kitazaki, Yukio Sato
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Publication number: 20100051254Abstract: A variable conductance heat pipe is provided. The variable conductance heat pipe includes a sealed container in which a working fluid and a noncondensable gas are sealed. The sealed container includes a heat receiving portion to which an element to be cooled is provided, and heat radiating portion. An amount of heat is supplied to the heat receiving portion when the element to be cooled is in a waiting state.Type: ApplicationFiled: August 27, 2009Publication date: March 4, 2010Applicant: MITSUBISHI ELECTRIC CORPORATIONInventors: Shigetoshi IPPOSHI, Tetsuya Nagayasu, Shingo Hironaka, Kuraki Kitazaki, Yukio Sato
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Publication number: 20090080155Abstract: In a conventional cooling device, a heat pipe or a circulation-type liquid cooler provided with a pump is used and therefore, a large space is needed for the cooling device. There is provided a cooling device which includes a plurality of cooling modules 6 having cooling units 6A for cooling heat-generating elements 7 by coolant and radiation units 6C for radiating heat from the coolant heated in the cooling units 6A, the plurality of cooling modules being bubble-pump-type ones in which the coolant is circulated between the radiation units 6C and the cooling units 6A by the coolant being boiled in the cooling units 6A, the radiation units 6C being arranged side by side, and a cooling fan 2 for generating wind blowing the radiation units 6C.Type: ApplicationFiled: March 31, 2006Publication date: March 26, 2009Applicant: Mitsubishi Electric CorporationInventors: Tetsuya Takahashi, Kazuyoshi Toya, Akihiro Murahashi, Yasushi Nakayama, Shigetoshi Ipposhi, Kenichi Hayashi
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Publication number: 20090065182Abstract: There is provided a cooling device which includes a plurality of cooling modules 6 having cooling units 6A for cooling heat-generating elements 7 by coolant and radiation units 6C for radiating heat from the coolant heated in the cooling units 6A, the plurality of cooling modules being bubble-pump-type ones in which the coolant is circulated between the radiation units 6C and the cooling units 6A by the coolant being boiled in the cooling units 6A, the radiation units 6C being arranged side by side, and a cooling fan 2 for generating wind blowing the radiation units 6C.Type: ApplicationFiled: March 31, 2006Publication date: March 12, 2009Applicant: MITSUBISHI ELECTRIC CORPORATIONInventors: Tetsuya Takahashi, Kazuyoshi Toya, Akihiro Murahashi, Yasushi Nakayama, Shigetoshi Ipposhi, Kenichi Hayashi