Patents by Inventor Shigeyuki Kuroda
Shigeyuki Kuroda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11776754Abstract: An electronic component including a component body, and an external electrode on a surface of the component body. The external electrode includes a layer having an alloy of at least one first metal and at least one second metal, the at least one first metal is selected from the group consisting of metals of Group 9 to Group 11 of the Periodic Table, the at least one second metal has a melting point higher than that of the at least one first metal. In the layer having the alloy, a concentration of the at least one second metal continuously changes in a thickness direction of the external electrode, at least one first portion has the concentration of the at least one second metal increasing in the thickness direction, and at least one second portion has the concentration of the at least one second metal decreasing in the thickness direction.Type: GrantFiled: October 26, 2021Date of Patent: October 3, 2023Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Shigeyuki Kuroda, Yusuke Arakawa, Chiaki Yamamoto, Shinji Otani
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Publication number: 20220044873Abstract: An electronic component including a component body, and an external electrode on a surface of the component body. The external electrode includes a layer having an alloy of at least one first metal and at least one second metal, the at least one first metal is selected from the group consisting of metals of Group 9 to Group 11 of the Periodic Table, the at least one second metal has a melting point higher than that of the at least one first metal. In the layer having the alloy, a concentration of the at least one second metal continuously changes in a thickness direction of the external electrode, at least one first portion has the concentration of the at least one second metal increasing in the thickness direction, and at least one second portion has the concentration of the at least one second metal decreasing in the thickness direction.Type: ApplicationFiled: October 26, 2021Publication date: February 10, 2022Inventors: Shigeyuki Kuroda, Yusuke Arakawa, Chiaki Yamamoto, Shinji Otani
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Patent number: 9536643Abstract: A method for manufacturing a multilayer electronic component includes the steps of preparing a laminate including a plurality of laminated insulating layers and a plurality of internal electrodes disposed along interfaces between the insulating layers, edges of the internal electrodes being exposed at a predetermined surface of the laminate, and forming an external electrode on the predetermined surface to electrically connect exposed the edges of the internal electrodes. The step of forming an external electrode includes a plating step of forming a continuous plating film by depositing plating deposits on the edges of the internal electrodes exposed at the predetermined surface and by performing plating growth to be connected to each other, and a heat treatment step of performing a heat treatment at an oxygen partial pressure of about 5 ppm or less and at a temperature of about 600° C. or more.Type: GrantFiled: February 11, 2014Date of Patent: January 3, 2017Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Akihiro Motoki, Makoto Ogawa, Kenichi Kawasaki, Shunsuke Takeuchi, Shigeyuki Kuroda
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Patent number: 9070498Abstract: A method for manufacturing a multilayer electronic component includes the steps of preparing a laminate including a plurality of laminated insulating layers and a plurality of internal electrodes disposed along interfaces between the insulating layers, edges of the internal electrodes being exposed at a predetermined surface of the laminate, and forming an external electrode on the predetermined surface to electrically connect exposed the edges of the internal electrodes. The step of forming an external electrode includes a plating step of forming a continuous plating film by depositing plating deposits on the edges of the internal electrodes exposed at the predetermined surface and by performing plating growth to be connected to each other, and a heat treatment step of performing a heat treatment at an oxygen partial pressure of about 5 ppm or less and at a temperature of about 600° C. or more.Type: GrantFiled: July 1, 2014Date of Patent: June 30, 2015Assignee: Murata Manufacturing Co., Ltd.Inventors: Akihiro Motoki, Makoto Ogawa, Kenichi Kawasaki, Shunsuke Takeuchi, Shigeyuki Kuroda
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Publication number: 20140312744Abstract: A method for manufacturing a multilayer electronic component includes the steps of preparing a laminate including a plurality of laminated insulating layers and a plurality of internal electrodes disposed along interfaces between the insulating layers, edges of the internal electrodes being exposed at a predetermined surface of the laminate, and forming an external electrode on the predetermined surface to electrically connect exposed the edges of the internal electrodes. The step of forming an external electrode includes a plating step of forming a continuous plating film by depositing plating deposits on the edges of the internal electrodes exposed at the predetermined surface and by performing plating growth to be connected to each other, and a heat treatment step of performing a heat treatment at an oxygen partial pressure of about 5 ppm or less and at a temperature of about 600° C. or more.Type: ApplicationFiled: July 1, 2014Publication date: October 23, 2014Inventors: Akihiro MOTOKI, Makoto OGAWA, Kenichi KAWASAKI, Shunsuke TAKEUCHI, Shigeyuki KURODA
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Patent number: 8804303Abstract: A method for manufacturing a multilayer electronic component includes the steps of preparing a laminate including a plurality of laminated insulating layers and a plurality of internal electrodes disposed along interfaces between the insulating layers, edges of the internal electrodes being exposed at a predetermined surface of the laminate, and forming an external electrode on the predetermined surface to electrically connect exposed the edges of the internal electrodes. The step of forming an external electrode includes a plating step of forming a continuous plating film by depositing plating deposits on the edges of the internal electrodes exposed at the predetermined surface and by performing plating growth to be connected to each other, and a heat treatment step of performing a heat treatment at an oxygen partial pressure of about 5 ppm or less and at a temperature of about 600° C. or more.Type: GrantFiled: April 5, 2012Date of Patent: August 12, 2014Assignee: Murata Manufacturing Co., Ltd.Inventors: Akihiro Motoki, Makoto Ogawa, Kenichi Kawasaki, Shunsuke Takeuchi, Shigeyuki Kuroda
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Publication number: 20140158293Abstract: A method for manufacturing a multilayer electronic component includes the steps of preparing a laminate including a plurality of laminated insulating layers and a plurality of internal electrodes disposed along interfaces between the insulating layers, edges of the internal electrodes being exposed at a predetermined surface of the laminate, and forming an external electrode on the predetermined surface to electrically connect exposed the edges of the internal electrodes. The step of forming an external electrode includes a plating step of forming a continuous plating film by depositing plating deposits on the edges of the internal electrodes exposed at the predetermined surface and by performing plating growth to be connected to each other, and a heat treatment step of performing a heat treatment at an oxygen partial pressure of about 5 ppm or less and at a temperature of about 600° C. or more.Type: ApplicationFiled: February 11, 2014Publication date: June 12, 2014Applicant: MURATA MANUFACTURING CO., LTD.Inventors: Akihiro MOTOKI, Makoto OGAWA, Kenichi KAWASAKI, Shunsuke TAKEUCHI, Shigeyuki KURODA
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Patent number: 8631549Abstract: A method for manufacturing a laminated ceramic capacitor includes a step of preparing a laminate which has a first principal surface, a second principal surface, a first end surface, a second end surface, a first side surface, and a second side surface and which includes insulating layers and internal electrodes having end portions exposed at the first or second end surface; a step of forming external electrodes on the first and second end surfaces such that plating deposits are formed on the exposed end portions of the internal electrodes so as to be connected to each other; and a step of forming thick end electrodes electrically connected to the external electrodes such that a conductive paste is applied onto edge portions of the first and second principal surfaces and first and second side surfaces of the laminate and then baked.Type: GrantFiled: March 18, 2011Date of Patent: January 21, 2014Assignee: Murata Manufacturing Co., Ltd.Inventors: Akihiro Motoki, Kenichi Kawasaki, Makoto Ogawa, Shigeyuki Kuroda, Shunsuke Takeuchi, Hideyuki Kashio
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Publication number: 20130095233Abstract: A method for manufacturing a multilayer electronic component includes the steps of preparing a laminate including a plurality of laminated insulating layers and a plurality of internal electrodes disposed along interfaces between the insulating layers, edges of the internal electrodes being exposed at a predetermined surface of the laminate, and forming an external electrode on the predetermined surface to electrically connect exposed the edges of the internal electrodes. The step of forming an external electrode includes a plating step of forming a continuous plating film by depositing plating deposits on the edges of the internal electrodes exposed at the predetermined surface and by performing plating growth to be connected to each other, and a heat treatment step of performing a heat treatment at an oxygen partial pressure of about 5 ppm or less and at a temperature of about 600° C. or more.Type: ApplicationFiled: April 5, 2012Publication date: April 18, 2013Applicant: MURATA MANUFACTURING CO., LTD.Inventors: Akihiro MOTOKI, Makoto OGAWA, Kenichi KAWASAKI, Shunsuke TAKEUCHI, Shigeyuki KURODA
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Patent number: 8341815Abstract: A laminate is prepared in which adjacent internal electrodes are electrically insulated from each other at an end surface at which the internal electrodes are exposed, a space between the adjacent internal electrodes, which is measured in the thickness direction of insulating layers, is about 10 ?m or less when a withdrawn distance of the adjacent internal electrodes from the end surface is about 1 ?m or less, and is about 20 ?m or less when a protruding length of the adjacent internal electrodes from the end surface is at least about 0.1 ?m. In an electroplating step, electroplating deposits deposited on the ends of the adjacent internal electrodes are grown so as to be connected to each other.Type: GrantFiled: June 9, 2010Date of Patent: January 1, 2013Assignee: Murata Manufacturing Co., Ltd.Inventors: Tatsuo Kunishi, Yoshihiko Takano, Shigeyuki Kuroda, Akihiro Motoki, Hideyuki Kashio, Takashi Noji
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Patent number: 8184424Abstract: A multilayer electronic component includes a laminate including insulating layers that are laminated to each other and internal electrodes provided along interfaces between the insulating layers, edges of the internal electrodes being exposed at a predetermined surface of the laminate and an external electrode provided on the predetermined surface. The external electrode includes a plated film which is directly provided on the predetermined surface of the laminate so as to electrically connect edges of the internal electrodes exposed at the predetermined surface of the laminate, and at a boundary portion between each of the internal electrodes and the plated film, a counter diffusion layer is provided, in which a metal component in the plated film and a metal component in the internal electrodes are both detectable, and extend to both sides of the internal electrodes and the plated film, and, at a side of the internal electrodes.Type: GrantFiled: April 28, 2008Date of Patent: May 22, 2012Assignee: Murata Manufacturing Co., Ltd.Inventors: Akihiro Motoki, Makoto Ogawa, Kenichi Kawasaki, Shunsuke Takeuchi, Shigeyuki Kuroda
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Patent number: 8154849Abstract: A laminate is prepared in which adjacent internal electrodes are electrically insulated from each other at an end surface at which the internal electrodes are exposed, a space between the adjacent internal electrodes, which is measured in the thickness direction of insulating layers, is about 10 ?m or less, and a withdrawn distance of the adjacent internal electrodes from the end surface is about 1 ?m or less. In an electroplating step, electroplating deposits deposited on the ends of the adjacent internal electrodes are grown so as to be connected to each other.Type: GrantFiled: February 13, 2008Date of Patent: April 10, 2012Assignee: Murata Manufacturing Co. Ltd.Inventors: Tatsuo Kunishi, Yoshihiko Takano, Shigeyuki Kuroda, Akihiro Motoki, Hideyuki Kashio, Takashi Noji
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Publication number: 20110162180Abstract: A method for manufacturing a laminated ceramic capacitor includes a step of preparing a laminate which has a first principal surface, a second principal surface, a first end surface, a second end surface, a first side surface, and a second side surface and which includes insulating layers and internal electrodes having end portions exposed at the first or second end surface; a step of forming external electrodes on the first and second end surfaces such that plating deposits are formed on the exposed end portions of the internal electrodes so as to be connected to each other; and a step of forming thick end electrodes electrically connected to the external electrodes such that a conductive paste is applied onto edge portions of the first and second principal surfaces and first and second side surfaces of the laminate and then baked.Type: ApplicationFiled: March 18, 2011Publication date: July 7, 2011Applicant: MURATA MANUFACTURING CO., LTD.Inventors: Akihiro MOTOKI, Kenichi KAWASAKI, Makoto OGAWA, Shigeyuki KURODA, Shunsuke TAKEUCHI, Hideyuki KASHIO
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Patent number: 7933113Abstract: A method for manufacturing a laminated ceramic capacitor includes a step of preparing a laminate which has a first principal surface, a second principal surface, a first end surface, a second end surface, a first side surface, and a second side surface and which includes insulating layers and internal electrodes having end portions exposed at the first or second end surface; a step of forming external electrodes on the first and second end surfaces such that plating deposits are formed on the exposed end portions of the internal electrodes so as to be connected to each other; and a step of forming thick end electrodes electrically connected to the external electrodes such that a conductive paste is applied onto edge portions of the first and second principal surfaces and first and second side surfaces of the laminate and then baked.Type: GrantFiled: March 26, 2008Date of Patent: April 26, 2011Assignee: Murata Manufacturing Co., Ltd.Inventors: Akihiro Motoki, Kenichi Kawasaki, Makoto Ogawa, Shigeyuki Kuroda, Shunsuke Takeuchi, Hideyuki Kashio
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Publication number: 20100243133Abstract: A laminate is prepared in which adjacent internal electrodes are electrically insulated from each other at an end surface at which the internal electrodes are exposed, a space between the adjacent internal electrodes, which is measured in the thickness direction of insulating layers, is about 10 ?m or less, and a withdrawn distance of the adjacent internal electrodes from the end surface is about 1 ?m or less. In an electroplating step, electroplating deposits deposited on the ends of the adjacent internal electrodes are grown so as to be connected to each other.Type: ApplicationFiled: June 9, 2010Publication date: September 30, 2010Applicant: MURATA MANUFACTURING CO., LTD.Inventors: Tatsuo KUNISHI, Yoshihiko TAKANO, Shigeyuki KURODA, Akihiro MOTOKI, Hideyuki KASHIO, Takashi NOJI
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Patent number: 7719819Abstract: A method for manufacturing a laminated electronic component is performed such that a water-repellent agent is applied to end surfaces at which ends of internal electrodes are exposed so as to be filled in spaces along interfaces between insulating layers and the internal electrodes. Subsequently, an abrading step is performed such that the internal electrodes are sufficiently exposed at the end surfaces and an excess water-repellent agent is removed therefrom to enable plating films to be directly formed on the end surfaces.Type: GrantFiled: March 6, 2008Date of Patent: May 18, 2010Assignee: Murata Manufacturing Co., Ltd.Inventors: Akihiro Motoki, Makoto Ogawa, Tatsuo Kunishi, Jun Nishikawa, Yoshihiko Takano, Shigeyuki Kuroda
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Patent number: 7589952Abstract: A multilayer electronic device includes a laminate and an external electrode that is formed on an end surface of the laminate after a plurality of conductive particles having a particle diameter of about 1 ?m or more is adhered to the end surface of the laminate, for example, by a sandblast method or a brush polishing method. The external electrode is defined by a plating film that is formed by electroplating or electroless plating.Type: GrantFiled: April 25, 2008Date of Patent: September 15, 2009Assignee: Murata Manufacturing Co., Ltd.Inventors: Akihiro Motoki, Kenichi Kawasaki, Makoto Ogawa, Shigeyuki Kuroda, Tatsuo Kunishi
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Publication number: 20080239617Abstract: A method for manufacturing a laminated ceramic capacitor includes a step of preparing a laminate which has a first principal surface, a second principal surface, a first end surface, a second end surface, a first side surface, and a second side surface and which includes insulating layers and internal electrodes having end portions exposed at the first or second end surface; a step of forming external electrodes on the first and second end surfaces such that plating deposits are formed on the exposed end portions of the internal electrodes so as to be connected to each other; and a step of forming thick end electrodes electrically connected to the external electrodes such that a conductive paste is applied onto edge portions of the first and second principal surfaces and first and second side surfaces of the laminate and then baked.Type: ApplicationFiled: March 26, 2008Publication date: October 2, 2008Applicant: MURATA MANUFACTURING CO., LTD.Inventors: Akihiro MOTOKI, Kenichi KAWASAKI, Makoto OGAWA, Shigeyuki KURODA, Shunsuke TAKEUCHI, Hideyuki KASHIO
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Publication number: 20080225462Abstract: A multilayer electronic device includes a laminate and an external electrode that is formed on an end surface of the laminate after a plurality of conductive particles having a particle diameter of about 1 ?m or more is adhered to the end surface of the laminate, for example, by a sandblast method or a brush polishing method. The external electrode is defined by a plating film that is formed by electroplating or electroless plating.Type: ApplicationFiled: April 25, 2008Publication date: September 18, 2008Applicant: MURATA MANUFACTURING CO., LTD.Inventors: Akihiro MOTOKI, Kenichi KAWASAKI, Makoto OGAWA, Shigeyuki KURODA, Tatsuo KUNISHI
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Publication number: 20080210564Abstract: A method for manufacturing a multilayer electronic component, includes the steps of preparing a laminate including a plurality of insulating layers laminated to each other and a plurality of internal electrodes formed along interfaces between the insulating layers, edges of the internal electrodes being exposed at a predetermined surface of the laminate, and forming an external electrode on the predetermined surface so as to electrically connect the edges of the internal electrodes, which are exposed at the predetermined surface of the laminate.Type: ApplicationFiled: April 28, 2008Publication date: September 4, 2008Applicant: MURATA MANUFACTURING CO., LTD.Inventors: Akihiro MOTOKI, Makoto OGAWA, Kenichi KAWASAKI, Shunsuke TAKEUCHI, Shigeyuki KURODA