Patents by Inventor Shigeyuki Sekine

Shigeyuki Sekine has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10391589
    Abstract: A flux applying device for applying flux to a surface of solder, wherein the flux applying device includes: a dipping means that applies the flux to the surface of the solder by dipping the solder into the flux; a load applying means that applies a predetermined load to the solder, the load applying means being provided at a upstream side of the dipping means; a constant speed conveying means that conveys the solder at a predetermined speed with being under load by the load applying means; a drying means that dries the solder to which the flux is applied; a cooling means that cools the dried solder; a conveying speed measurement means that measures a conveying speed of the solder; and a control means that controls the conveying speed of the solder.
    Type: Grant
    Filed: March 30, 2015
    Date of Patent: August 27, 2019
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Manabu Muraoka, Takeo Saitoh, Shigeyuki Sekine, Takashi Obayashi, Kaichi Tsuruta, Takashi Hagiwara, Hiroyuki Yamasaki, Kota Kikuchi, Naoto Kameda
  • Patent number: 10137538
    Abstract: In the flux applying device, a control portion controls conveying rollers or the like so that thickness of flux applied to solder is controlled. The winding roller rotates so that the solder is conveyed at the conveying speed. The drawing-out roller applies any load (back tension) to the solder backward along the conveying direction of the solder when drawing out the solder. The solder is conveyed at the predetermined speed and dipped into the flux tank containing flux. The solder is pulled up from the flux tank at the conveying speed vertically. By pulling up the solder from the flux tank at the constant conveying speed vertically, the interfacial tension acts on the solder 9a and the flux, so that the flux having a uniform thickness according to the conveying speed remains on the surface and back surface of the solder.
    Type: Grant
    Filed: May 26, 2016
    Date of Patent: November 27, 2018
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Manabu Muraoka, Takeo Saitoh, Shigeyuki Sekine, Takashi Obayashi, Kaichi Tsuruta, Takashi Hagiwara, Hiroyuki Yamasaki, Kota Kikuchi, Naoto Kameda
  • Publication number: 20180185967
    Abstract: A flux applying device for applying flux to a surface of solder, wherein the flux applying device includes: a dipping means that applies the flux to the surface of the solder by dipping the solder into the flux; a load applying means that applies a predetermined load to the solder, the load applying means being provided at a upstream side of the dipping means; a constant speed conveying means that conveys the solder at a predetermined speed with being under load by the load applying means; a drying means that dries the solder to which the flux is applied; a cooling means that cools the dried solder; a conveying speed measurement means that measures a conveying speed of the solder; and a control means that controls the conveying speed of the solder.
    Type: Application
    Filed: March 30, 2015
    Publication date: July 5, 2018
    Inventors: Manabu Muraoka, Takeo Saitoh, Shigeyuki Sekine, Takashi Obayashi, Kaichi Tsuruta, Takashi Hagiwara, Hiroyuki Yamasaki, Kota Kikuchi, Naoto Kameda
  • Publication number: 20160346878
    Abstract: In the flux applying device, a control portion controls conveying rollers or the like so that thickness of flux applied to solder is controlled. The winding roller rotates so that the solder is conveyed at the conveying speed. The drawing-out roller applies any load (back tension) to the solder backward along the conveying direction of the solder when drawing out the solder. The solder is conveyed at the predetermined speed and dipped into the flux tank containing flux. The solder is pulled up from the flux tank at the conveying speed vertically. By pulling up the solder from the flux tank at the constant conveying speed vertically, the interfacial tension acts on the solder 9a and the flux, so that the flux having a uniform thickness according to the conveying speed remains on the surface and back surface of the solder.
    Type: Application
    Filed: May 26, 2016
    Publication date: December 1, 2016
    Inventors: Manabu Muraoka, Takeo Saitoh, Shigeyuki Sekine, Takashi Obayashi, Kaichi Tsuruta, Takashi Hagiwara, Hiroyuki Yamasaki, Kota Kikuchi, Naoto Kameda
  • Publication number: 20070176056
    Abstract: The pipe arrangement for feeding fluid to a fluid-receiver from a fluid-supplier through a pipe, includes a wire tensioned between a first support and a second support, a hollow fluid-feeding pipe extending between the first and second supports, and a device for allowing the fluid-feeding pipe to hang from the wire. The fluid-feeding pipe is comprised of a plurality of fundamental pipes capable of being connected to one another. A second fundamental pipe connected to a first fundamental pipe can extend and contract axially thereof relative to the first fundamental pipe, and can further bend obliquely relative to the first fundamental pipe.
    Type: Application
    Filed: January 16, 2007
    Publication date: August 2, 2007
    Applicant: PIPE SYSTEM JAPAN Limited Liability Partnership
    Inventor: Shigeyuki Sekine