Abstract: In some implementations, a control device may determine a spacing measurement in a first dimension between a wafer on a susceptor and a pre-heat ring of a semiconductor processing tool and/or a gapping measurement in a second dimension between the wafer and the pre-heat ring, using one or more images captured in situ during a process by at least one optical sensor. Accordingly, the control device may generate a command based on a setting associated with the process being performed by the semiconductor processing tool and the spacing measurement and/or the gapping measurement. The control device may provide the command to at least one motor to move the susceptor.

Abstract: An integrated circuit includes a semiconductor substrate, an isolation region extending into, and overlying a bulk portion of, the semiconductor substrate, a buried conductive track comprising a portion in the isolation region, and a transistor having a source/drain region and a gate electrode. The source/drain region or the gate electrode is connected to the buried conductive track.

Abstract: An integrated circuit includes a semiconductor substrate, an isolation region extending into, and overlying a bulk portion of, the semiconductor substrate, a buried conductive track comprising a portion in the isolation region, and a transistor having a source/drain region and a gate electrode. The source/drain region or the gate electrode is connected to the buried conductive track.

Abstract: A manufacturing method of a gate structure includes steps of forming a mask oxide layer on the substrate, performing a photolithography process on the mask oxide layer and the substrate to form a trench, etching the trench, removing the mask oxide layer, forming a bottom oxide layer on a surface of the substrate and a trench surface of the trench, forming a silicon nitride layer on the trench, removing a part of the bottom oxide layer, removing the silicon nitride layer, forming a gate oxide layer on the surface and a part of the trench surface, and forming a poly layer on the trench. Therefore, the advantages of simplifying the gate structure process and reducing the production cost are achieved.

Abstract: A manufacturing method of a split gate structure includes steps of forming a mask oxide layer on the substrate, performing photolithography and etching on the mask oxide layer and the substrate, forming a trench, removing the mask oxide layer, forming a bottom oxide layer on a bottom part and a side wall of the trench and a surface of the substrate, forming a silicon nitride layer on the trench, removing a part of the bottom oxide layer, forming a gate oxide layer on part of the side wall and the surface, forming a gate poly layer on the trench, removing the silicon nitride layer, forming an inter-poly oxide layer on the gate poly layer, and forming a shield poly layer on the trench, thereby benefiting the increasing of the thickness of the inter-poly oxide layer, so that the advantages of improving the characteristics of the split gate structure are achieved.

Abstract: A manufacturing method of a split gate structure includes steps of forming a mask oxide layer on the substrate, performing photolithography and etching on the mask oxide layer and the substrate, forming a trench, removing the mask oxide layer, forming a bottom oxide layer on a bottom part and a side wall of the trench and a surface of the substrate, forming a silicon nitride layer on the trench, removing a part of the bottom oxide layer, forming a gate oxide layer on part of the side wall and the surface, forming a gate poly layer on the trench, removing the silicon nitride layer, forming an inter-poly oxide layer on the gate poly layer, and forming a shield poly layer on the trench, thereby benefiting the increasing of the thickness of the inter-poly oxide layer, so that the advantages of improving the characteristics of the split gate structure are achieved.

Abstract: A manufacturing method of a gate structure includes steps of forming a mask oxide layer on the substrate, performing a photolithography process on the mask oxide layer and the substrate to form a trench, etching the trench, removing the mask oxide layer, forming a bottom oxide layer on a surface of the substrate and a trench surface of the trench, forming a silicon nitride layer on the trench, removing a part of the bottom oxide layer, removing the silicon nitride layer, forming a gate oxide layer on the surface and a part of the trench surface, and forming a poly layer on the trench. Therefore, the advantages of simplifying the gate structure process and reducing the production cost are achieved.

Abstract: A chip structure for mounting on a clearance area of a printed circuit board includes a packaged chip and a monopole coupling antenna. The packaged chip has an insulating body, an electronic component embedded in the insulating body, and a plurality of grounding pads electrically connected to the electronic component. The monopole coupling antenna has a grounding radiating metal and a monopole radiating metal. The packaged chip is electrically connected to the grounding radiating metal by the grounding pads. The monopole radiating metal is disposed on the insulating body and spaced apart from the electronic component and the grounding radiating metal. The monopole radiating metal is configured to couple the grounding radiating metal and the electronic component by using a feeding circuit to connect the packaged chip and the monopole radiating metal and using a grounding circuit to connect the grounding radiating metal and the printed circuit board.

Abstract: A communication device includes a housing and a first connector, an antenna module, and a feeding cable, which are disposed in the housing. The housing has a metal portion arranged on one side thereof, and the metal portion has a first hole and an elongated slot. The position of the first connector corresponds to the first hole. The antenna module has an insulating base and a monopole antenna disposed on the base. The base is fixed on the first connector and arranged adjacent to the slot, so part of the base exposes from the slot. The position of the monopole antenna corresponds to the slot, and the length of the monopole antenna is smaller or identical to the length of the slot. The monopole antenna is configured to couple the metal portion by the slot. The feeding cable is electrically connected to the monopole antenna.

Abstract: A communication device includes a housing and a first connector, an antenna module, and a feeding cable, which are disposed in the housing. The housing has a metal portion arranged on one side thereof, and the metal portion has a first hole and an elongated slot. The position of the first connector corresponds to the first hole. The antenna module has an insulating base and a monopole antenna disposed on the base. The base is fixed on the first connector and arranged adjacent to the slot, so part of the base exposes from the slot. The position of the monopole antenna corresponds to the slot, and the length of the monopole antenna is smaller or identical to the length of the slot. The monopole antenna is configured to couple the metal portion by the slot. The feeding cable is electrically connected to the monopole antenna.

Abstract: A spring antenna structure integrally formed by bending a metallic sheet includes a supporting portion, a grounding radiating portion, and an antenna radiating portion. Two opposite ends of the supporting portion are respectively connected to the grounding and antenna radiating portion. The grounding and antenna radiating portion are formed by bending the supporting portion in a rotating direction. A first angle (?1) is defined between the grounding radiating portion and the supporting portion, and a second angle (?2) is defined between the antenna radiating portion and the supporting portion. 0°<?1<90° and 0°<?2<?1+90°. When the spring antenna structure is pressed and deformed by an external force, the spring antenna structure generates a returning force for returning to the original shape.

Abstract: The present disclosure provides a wireless charging storage stand comprising a body and a power control circuit. The body has a plurality of containing portions. Each containing portion comprises a wireless charging unit, a wireless charging indication unit and a sensing circuit. The wireless charging unit is coupled to the wireless charging indication unit. The containing portion is for accommodating an electronic device with wireless charging capability which is charged by the wireless charging unit. The wireless charging indication unit generates a charging indication signal according to the charging status of the wireless charging unit. The power control circuit is disposed in the body and the power control circuit is coupled to the plurality of wireless charging units and the plurality of wireless charging indication units. The power control circuit provides electric power to the plurality of wireless charging units and the plurality of wireless charging indication units.

Abstract: A spring antenna structure integrally formed by bending a metallic sheet includes a supporting portion, a grounding radiating portion, and an antenna radiating portion. Two opposite ends of the supporting portion are respectively connected to the grounding and antenna radiating portion. The grounding and antenna radiating portion are formed by bending the supporting portion in a rotating direction. A first angle (?1) is defined between the grounding radiating portion and the supporting portion, and a second angle (?2) is defined between the antenna radiating portion and the supporting portion. 0°<?1<90° and 0°<?2<?1+90°. When the spring antenna structure is pressed and deformed by an external force, the spring antenna structure generates a returning force for returning to the original shape.

Abstract: A chip structure for mounting on a clearance area of a printed circuit board includes a packaged chip and a monopole coupling antenna. The packaged chip has an insulating body, an electronic component embedded in the insulating body, and a plurality of grounding pads electrically connected to the electronic component. The monopole coupling antenna has a grounding radiating metal and a monopole radiating metal. The packaged chip is electrically connected to the grounding radiating metal by the grounding pads. The monopole radiating metal is disposed on the insulating body and spaced apart from the electronic component and the grounding radiating metal. The monopole radiating metal is configured to couple the grounding radiating metal and the electronic component by using a feeding circuit to connect the packaged chip and the monopole radiating metal and using a grounding circuit to connect the grounding radiating metal and the printed circuit board.

Abstract: The present disclosure provides a wireless charging storage stand comprising a body and a power control circuit. The body has a plurality of containing portions. Each containing portion comprises a wireless charging unit, a wireless charging indication unit and a sensing circuit. The wireless charging unit is coupled to the wireless charging indication unit. The containing portion is for accommodating an electronic device with wireless charging capability which is charged by the wireless charging unit. The wireless charging indication unit generates a charging indication signal according to the charging status of the wireless charging unit. The power control circuit is disposed in the body and the power control circuit is coupled to the plurality of wireless charging units and the plurality of wireless charging indication units. The power control circuit provides electric power to the plurality of wireless charging units and the plurality of wireless charging indication units.

Abstract: The present disclosure provides a metal plate antenna comprising a radiating portion and at least two grounding pins. The radiating portion is a metal plate and the two ends of the radiating portion are a first end and a second end respectively. The first end and the second end are bended towards the same direction and are perpendicular to the radiating portion. One of the first end and the second end is for the feeding end. At least one of the first end and the second end has at least a plug-foot. The plug-foot is used for plugging into the inserting hole of a circuit board. At least two grounding pins are vertical connected to the radiating portion and one of the grounding pins is used to be connected with the grounding of the circuit board.

Abstract: An antenna structure includes a portable electronic apparatus and an antenna. The portable electronic apparatus includes a housing. At least a metal block is arranged at a corner of the housing. The antenna is arranged in an accommodating space of the housing. The antenna includes a radiator. The radiator includes a rear end and a signal feed-in contact. A distance between the rear end, the signal feed-in contact, and the metal block is about one-fourth wavelength of communication signals, wherein the rear end faces the metal block. Therefore, the SAR of the antenna is reduced.

Abstract: A multi-frequency antenna includes a microwave substrate, a first antenna unit, a second antenna unit, a third antenna unit and a grounding unit. The first antenna unit, the second antenna unit, and the third antenna unit are disposed on the microwave substrate surface. The grounding unit is disposed at an edge on the surface of the microwave substrate. The grounding unit is in connection with the second antenna unit. The second antenna unit and the third antenna unit are bent to form perpendicular structures to the microwave substrate. The compact arrangement reduces the physical footprint of the antenna module to enable fitment in a wide range of products having tight special constraint.

Abstract: A multi-frequency antenna includes a microwave substrate, a first antenna unit, a second antenna unit, a third antenna unit and a grounding unit. The first antenna unit, the second antenna unit, and the third antenna unit are disposed on the microwave substrate surface. The grounding unit is disposed at an edge on the surface of the microwave substrate. The grounding unit is in connection with the second antenna unit. The second antenna unit and the third antenna unit are bent to form perpendicular structures to the microwave substrate. The compact arrangement reduces the physical footprint of the antenna module to enable fitment in a wide range of products having tight special constraint.

Abstract: A multi-band antenna includes an insulative carrier board arranged on the top side of the display screen of a notebook computer, a main antenna which has the top metal strip thereof disposed at the top edge of the insulative carrier board and the grounding metal strip thereon arranged on the insulative carrier board, an inverted L antenna arranged on the insulative carrier board, a first capacitor, a second capacitor, an antenna feed-in terminal and/or an inductor set between the inverted L antenna and the main antenna to achieve optimal matching subject to adjustment of the capacitance values of the first and second capacitors and the inductance value and position of the inductor.