Patents by Inventor Shih-Hao Liu

Shih-Hao Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190293867
    Abstract: A method includes: forming a first plurality of tiers that each comprises first and second dummy layers over a substrate, wherein within each tier, the second dummy layer is disposed above the first dummy layer; forming a second plurality of recessed regions in the first plurality of tiers, wherein at least one subgroup of the second plurality of recessed regions extend through respective different numbers of the second dummy layers; and performing an etching operation to concurrently forming a third plurality of trenches with respective different depths in the substrate through the at least one subgroup of the second plurality of recessed regions.
    Type: Application
    Filed: April 8, 2019
    Publication date: September 26, 2019
    Inventors: Tao-Cheng LIU, Tsai-Hao Hung, Shih-Chi Kuo
  • Patent number: 10395085
    Abstract: Embodiments of the disclosure relate to a semiconductor device. The semiconductor device includes a semiconductor substrate, a first metal wiring layer disposed on the semiconductor substrate, an interlayer dielectric layer (ILD) disposed on the first metal wiring layer, a second metal wiring layer disposed on the interlayer dielectric layer, and a first via and a second via disposed in the interlayer dielectric layer. The second via is on the first via, and there is not any metal wiring layer in the interlayer dielectric layer.
    Type: Grant
    Filed: December 5, 2017
    Date of Patent: August 27, 2019
    Assignee: VANGUARD INTERNATIONAL SEMICONDUCTOR CORPORATION
    Inventors: Shih-Hao Liu, Leuh Fang, Chih-Cherng Liao, Yun-Chou Wei, Chung-Ren Lao, Wu-Hsi Lu
  • Publication number: 20190235389
    Abstract: Embodiments of the present disclosure generally provide a digital lithography system that can process both large area substrates as well as semiconductor device substrates, such as wafers. Both the large area substrates and the semiconductor device substrates can be processed in the same system simultaneously. Additionally, the system can accommodate different levels of exposure for forming the features over the substrates. For example, the system can accommodate very precise feature patterning as well as less precise feature patterning. The different exposures can occur in the same chamber simultaneously. Thus, the system is capable of processing both semiconductor device substrates and large area substrates simultaneously while also accommodating very precise feature patterning simultaneous with less precise feature patterning.
    Type: Application
    Filed: December 11, 2018
    Publication date: August 1, 2019
    Inventors: Chien-Hua Lai, Ching-Chang Chen, Shih-Hao Kuo, Tsu-Hui Yang, Hsiu-Jen Wang, Yi-Sheng Liu, Chia-Hung Kao
  • Publication number: 20190237847
    Abstract: The disclosure provides an antenna module adapted for an electronic device having a metal casing. The antenna module includes an antenna structure and a slot structure. The antenna structure includes a radiation portion, a feeding portion, a ground portion and an extension portion, wherein the feeding portion, the ground portion and the extension portion are connected to the radiation portion. The slot structure has an open end and a closed end, wherein the open end of the slot structure is adjacent to the extension portion of the antenna structure. The antenna structure is excited and resonates to generate a first antenna resonant mode, and the slot structure is coupled to the antenna structure and resonates to generate a second antenna resonant mode.
    Type: Application
    Filed: January 21, 2019
    Publication date: August 1, 2019
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Chao-Lin Wu, Shih-Chia Liu, Yen-Hao Yu, Li-Chun Lee, Jhin-Ciang Chen, Jui-Hung Lai
  • Publication number: 20190229755
    Abstract: An antenna apparatus, an electronic apparatus and an antenna modification method are provided. The electronic apparatus includes a multiplexer and the antenna apparatus. The multiplexer combines a control signal and a first radio frequency (RF) signal to form a combination signal. The antenna apparatus includes a feeding portion, a de-multiplexer, a modification circuit and a radiation portion. The feeding portion receives the combination signal. The de-multiplexer separates the combination signal into the control signal and the first RF signal. The modification circuit receives the control signal and the first RF signal, and modifies an impedance. The first RF signal is influenced by the impedance to form a second RF signal. The radiation portion receives the second RF signal. Accordingly, merely single cable would be needed for feeding signals into the antenna apparatus.
    Type: Application
    Filed: January 21, 2019
    Publication date: July 25, 2019
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Li-Chun Lee, Shih-Chia Liu, Yen-Hao Yu, Jhin-Ciang Chen, Chao-Lin Wu, Jui-Hung Lai
  • Patent number: 10361139
    Abstract: A semiconductor package includes an encapsulated semiconductor device, a redistribution structure, and a protection layer. The encapsulated semiconductor device includes a semiconductor device and an encapsulating material encapsulating the semiconductor device. The redistribution structure is disposed on the encapsulated semiconductor device and includes a dielectric layer and a redistribution circuit layer electrically connected to the semiconductor device. The protection layer at least covers the dielectric layer, wherein an oxygen permeability or a water vapor permeability of the protection layer is substantially lower than an oxygen permeability or a vapor permeability of the dielectric layer.
    Type: Grant
    Filed: January 31, 2018
    Date of Patent: July 23, 2019
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Shih-Hao Tseng, Hung-Jui Kuo, Ming-Che Ho, Chia-Hung Liu
  • Patent number: 10352966
    Abstract: A method for utilizing a probe card includes steps as follows. Providing a probe card having three alignment marks on a reference plane of a circuit board; moving the circuit board to be oriented to a wafer-loading plane of a wafer stage with the reference plane; determining whether a geometric plane defined by the alignment marks is parallel to the wafer-loading plane; and when the geometric plane is not parallel to the wafer-loading plane, adjusting a levelness of the circuit board until the reference plane is parallel to the wafer-loading plane.
    Type: Grant
    Filed: September 1, 2016
    Date of Patent: July 16, 2019
    Assignees: GLOBAL UNICHIP CORPORATION, TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chang-Ming Liu, Chien-Hao Lin, Shih-Hua Hsu, Ning-Chun Hsu
  • Publication number: 20190191439
    Abstract: A communication system, a coordinator and an interference controlling method are provided. The communication system includes at least two user equipments, at least two remote radio heads (RRHs) and the coordinator. Each of the RRHs electrically connects a plurality of antennas. The coordinator includes a scanning unit, a storing unit and a scheduling unit. The scanning unit operates the measurement of a performance of each of the antennas used for each of the user equipments by antenna sweeping. The RRHs are classified into at least one group. The scheduling unit schedules the communication of the user equipments. At least some of the user equipments using the same one of the at least one group are scheduled in different time slots to prevent from interference.
    Type: Application
    Filed: December 28, 2017
    Publication date: June 20, 2019
    Inventors: Shih-Hao Fang, Jen-Yuan Hsu, Jiun-You Lai, Chun-Nan Liu
  • Publication number: 20190171857
    Abstract: Embodiments of the disclosure relate to a semiconductor device. The semiconductor device includes a semiconductor substrate, a first metal wiring layer disposed on the semiconductor substrate, an interlayer dielectric layer (ILD) disposed on the first metal wiring layer, a second metal wiring layer disposed on the interlayer dielectric layer, and a first via and a second via disposed in the interlayer dielectric layer. The second via is on the first via, and there is not any metal wiring layer in the interlayer dielectric layer.
    Type: Application
    Filed: December 5, 2017
    Publication date: June 6, 2019
    Applicant: Vanguard International Semiconductor Corporation
    Inventors: Shih-Hao LIU, Leuh Fang, Chih-Cherng Liao, Yun-Chou Wei, Chung-Ren Lao, Wu-Hsi Lu
  • Publication number: 20190162692
    Abstract: An array sensing electrode includes an electric insulating base plate, a plurality of electric conductive assemblies, a reference sensing layer, at least a chemical sensing layer, and an electrolyte layer. The electric insulating base plate has a plurality of perforations. Each electric conductive assembly includes an electric conductive filler, a first electric conductive part, and a second electric conductive part. The electric conductive filler is penetrated through the perforation, and the first electric conductive part and the second electric conductive part are disposed on a first plane and a second plane of the electric conductive filler, respectively. The reference sensing layer and the chemical sensing layer are disposed on different first electric conductive parts, and the electrolyte layer is disposed on the reference sensing layer and the chemical sensing layer to cover thereon. Therefore, the advantages of decreasing the manufacture cost and being conductive to packaging are achieved.
    Type: Application
    Filed: February 26, 2018
    Publication date: May 30, 2019
    Inventors: Kuan-Jung Chen, Yu-Cheng Liu, Pin-Hsuan Lin, Shih-Hao Ko, Hsiao-Han Yu
  • Patent number: 10304700
    Abstract: A semiconductor device and method that comprise a first dielectric layer over a encapsulant that encapsulates a via and a semiconductor die is provided. A redistribution layer is over the first dielectric layer, and a second dielectric layer is over the redistribution layer, and the second dielectric layer comprises a low-temperature polyimide material.
    Type: Grant
    Filed: June 1, 2016
    Date of Patent: May 28, 2019
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Zi-Jheng Liu, Yu-Hsiang Hu, Jo-Lin Lan, Shih-Hao Liao, Chen-Cheng Kuo, Hung-Jui Kuo, Chung-Shi Liu, Chen-Hua Yu, Meng-Wei Chou
  • Publication number: 20190148255
    Abstract: A semiconductor package includes an encapsulated semiconductor device, a redistribution structure, and a protection layer. The encapsulated semiconductor device includes a semiconductor device and an encapsulating material encapsulating the semiconductor device. The redistribution structure is disposed on the encapsulated semiconductor device and includes a dielectric layer and a redistribution circuit layer electrically connected to the semiconductor device. The protection layer at least covers the dielectric layer, wherein an oxygen permeability or a water vapor permeability of the protection layer is substantially lower than an oxygen permeability or a vapor permeability of the dielectric layer.
    Type: Application
    Filed: January 31, 2018
    Publication date: May 16, 2019
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Shih-Hao Tseng, Hung-Jui Kuo, Ming-Che Ho, Chia-Hung Liu
  • Publication number: 20190005550
    Abstract: A computer program product enables an advertisement audience dynamical detection circuit to conduct an advertisement audience quantity detecting operation. The advertisement audience quantity detecting operation includes: receiving a probe request frame transmitted from other wireless communication device; recording the arrival time of the probe request frame; inspecting the frame field configuration of the probe request frame; allocating the probe request to a corresponding data group according to the arrival time and frame field configuration of the probe request frame and a sequence control value in the header of the probe request frame while ensuring all probe request frames in the same data group have same frame field configuration; and calculating an estimated quantity of advertisement audiences passing through a specific location in a specific time period based on a total quantity of resulting data groups.
    Type: Application
    Filed: June 29, 2018
    Publication date: January 3, 2019
    Applicant: AirTag Technology Co., Ltd.
    Inventors: Shih-Hao LIU, Chang-Hung KU, Shao-Chi CHANG
  • Patent number: 8819400
    Abstract: A computer apparatus is disclosed. The computer apparatus mentioned above includes a main board and an external sub-board. The main board includes a connector, a management chip, a first basic input output system and a selector. The external sub-board includes an external input output system. The management chip detects a coupling state of the main board and the external sub-board, and generates a detecting signal. The selector enables one of the first basic input output system and the external input output system and disables the other one.
    Type: Grant
    Filed: April 7, 2009
    Date of Patent: August 26, 2014
    Assignee: Inventec Corporation
    Inventors: Lan-Lan Fang, Shih-Hao Liu
  • Patent number: 8774061
    Abstract: A method for managing geographical information of a plurality of Voice over Internet Protocol (VoIP) terminal devices using a VoIP server receives location information of the VoIP terminal devices from the VoIP terminal devices, stores geographical information of the VoIP terminal devices into a data sheet stored in a storage device of the VoIP server. The method detects a query from one of the VoIP terminal devices, retrieves the geographical information from the data sheet according to the query, and obtains an electronic map from the storage device. The method further populates the retrieved geographical information on the electronic map, and sends the electronic map to the VoIP terminal device corresponding to the location information.
    Type: Grant
    Filed: May 30, 2012
    Date of Patent: July 8, 2014
    Assignees: GDS Software (ShenZhen) Co., Ltd, Hon Hai Precision Industry Co., Ltd.
    Inventors: Ming-Chuan Kao, Sen-Cai Yang, Shih-Hao Liu, Jen-Hsiung Charng
  • Patent number: 8438384
    Abstract: A system and method for performing mutual authentication verifies a username and a password of a handheld device by a server, and verifies an identity of the server by the handheld device if the handheld device passes the username and password verification. The system and method further verifies an identity of the handheld device by the server if the identity of the server is valid, and gives an access authority to the handheld device if the identity of the handheld device is valid.
    Type: Grant
    Filed: January 25, 2011
    Date of Patent: May 7, 2013
    Assignees: GDS Software (ShenZhen) Co., Ltd, Hon Hai Precision Industry Co., Ltd.
    Inventors: Ming-Chuan Kao, Qing-Hua Li, Shih-Hao Liu, Li-Na Dai, Kai-Ying Hu, Zhong-Wei Li
  • Publication number: 20130083194
    Abstract: A video monitoring server and method are provided. The video monitoring server generates a monitoring list and controls a streaming media server to convert video captured by a camera into streaming media. The video monitoring server downloads the streaming media from the streaming media server and selects a picture from the downloaded streaming media as an icon of a monitoring record corresponding to the camera. The video monitoring server sends the monitoring list to an electronic device, and notifies the streaming media server to send the streaming media to the electronic device when a user clicks the icon of the monitoring record corresponding to the camera.
    Type: Application
    Filed: September 14, 2012
    Publication date: April 4, 2013
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: JEN-HSIUNG CHARNG, CHIEN-MING CHANG, SHIH-HAO LIU, YU-HSIANG TSAO
  • Publication number: 20130003721
    Abstract: A method for managing geographical information of a plurality of Voice over Internet Protocol (VoIP) terminal devices using a VoIP server receives location information of the VoIP terminal devices from the VoIP terminal devices, stores geographical information of the VoIP terminal devices into a data sheet stored in a storage device of the VoIP server. The method detects a query from one of the VoIP terminal devices, retrieves the geographical information from the data sheet according to the query, and obtains an electronic map from the storage device. The method further populates the retrieved geographical information on the electronic map, and sends the electronic map to the VoIP terminal device corresponding to the location information.
    Type: Application
    Filed: May 30, 2012
    Publication date: January 3, 2013
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., GDS SOFTWARE (SHENZHEN) CO.,LTD
    Inventors: MING-CHUAN KAO, SEN-CAI YANG, SHIH-HAO LIU, JEN-HSIUNG CHARNG
  • Patent number: 8209555
    Abstract: A computer system including a first and second main boards, a judgment unit, a power supply, a first switch and second switch is provided. The judgment unit receives a first and second power start signals from the first and second main boards, and outputs a total power start signal. The power supply outputs a power reply signal according to the total power start signal. The first and second switches determine whether to output a power good signal individually according to the first and second power start signals. When one of the first and second power start signals is available, the total power start signal and the power reply signal are available, and the power supply outputs an operating voltage. When the first and second power start signals are unavailable, the total power start signal and the power reply signal are unavailable, and the power supply stops outputting the operating voltage.
    Type: Grant
    Filed: March 10, 2009
    Date of Patent: June 26, 2012
    Assignee: Inventec Corporation
    Inventors: Li-Hong Huang, Shih-Hao Liu
  • Patent number: 8190929
    Abstract: A computer system including a power supply and N main boards is provided, herein N is an integer greater than 1. The power supply generates a main power and a standby power. The N main boards respectively correspond to one standby voltage. The 1st to the (N?1)th main boards respectively generate the corresponding standby voltage by the main power in a power-on state, and respectively generate the corresponding standby voltage by the standby power in a power-off state. The Nth main board generates the corresponding standby voltage by the main power in the power-on and power-off state.
    Type: Grant
    Filed: March 10, 2009
    Date of Patent: May 29, 2012
    Assignee: Inventec Corporation
    Inventors: Li-Hong Huang, Shih-Hao Liu