Abstract: A liquid crystal module includes a housing, a light guide plate, at least one optical film, a liquid crystal panel, and a light bar. The housing includes a bottom plate with a bearing surface and a frame wall connected to the bottom plate. The light guide plate is disposed on the bearing surface and has a light emitting surface and a light incident side surface. The frame wall surrounds the light guide plate. The optical film is disposed above the light emitting surface. The liquid crystal panel is disposed above the optical film. The light bar includes a first circuit board and at least one light emitting element mounted on the first circuit board. The light emitting element is located opposite to the light incident side surface. The first circuit board located between the liquid crystal panel and the light emitting surface partially covers the light emitting surface.

Abstract: The present invention discloses an LED light bar structure, which includes at least one LED and a circuit board. Each LED has two or an even number of pins. The circuit board has at least one receiving space and at least two recesses, in which the LED is disposed in the receiving space, and each of the pins is engaged in the recess. The present invention solves drawbacks of the LED shifting when being conventionally welded and the LED is difficult to replace.

Abstract: An optical touch display device is provided. The optical touch display device includes a front frame, a light guide strip, a photosensitive element, and a light source. The front frame includes a body portion having a display opening, at least one positioning board located on a corner of the body portion, and a protecting cover located on the body portion. An end of the protecting cover is adjacent to the positioning board. An opening groove is defined between the protecting cover and the body portion. The body portion, the positioning board, and the protecting cover are integrally formed. The light guide strip is placed in the opening groove. The photosensitive element is fixed on the positioning board. The light source is located between the photosensitive element and the light guide strip, and a light-emitting side of the light source faces a light inlet side of the light guide strip.

Abstract: A liquid crystal module includes a housing, a light guide plate, at least one optical film, a liquid crystal panel, and a light bar. The housing includes a bottom plate with a bearing surface and a frame wall connected to the bottom plate. The light guide plate is disposed on the bearing surface and has a light emitting surface and a light incident side surface. The frame wall surrounds the light guide plate. The optical film is disposed above the light emitting surface. The liquid crystal panel is disposed above the optical film. The light bar includes a first circuit board and at least one light emitting element mounted on the first circuit board. The light emitting element is located opposite to the light incident side surface. The first circuit board located between the liquid crystal panel and the light emitting surface partially covers the light emitting surface.

Abstract: A backlight module is disclosed. A flexible printed circuit (FPC) is prevented detaching from a connector in the backlight module. The backlight module includes a mold frame, an FPC, a stiffener, a connector and a fastener. The stiffener has a first part and a second part, that the first part is attached on a first end of the FPC. The first end of the FPC together with the stiffener is electrically coupled to the connector. The fastener which is disposed on the mold frame has a slot, and the second part of the stiffener is inserted into the said slot of the fastener so that the FPC is firmly inserted into the connector by the stiffener.

Abstract: A multi-channel fluid conveying apparatus, for delivering a fluid, includes a valve seat, a valve cover, a valve membrane, a plurality of temporary-deposit chambers, and an actuating device. The valve seat includes at least one inlet channel and at least one outlet channel. The valve cover is arranged on the valve seat. The valve membrane is interposed between the valve seat and the valve cover and includes a plurality of valve structures made of the same material with the same thickness, wherein at least one of the valve structures has a rigidity different from those of other valve structures. The plurality of temporary-deposit chambers is interposed between the valve membrane and the valve cover and between the valve membrane and the valve seat. The actuating device is, having a periphery, fixed to the valve cover.

Abstract: A backlight module including a frame, a reflective adhesive tape, a fixing adhesive tape, a reflective plate, a light-guiding plate and at least one of light source, is provided. The frame has a groove at one side. The reflective adhesive tape is disposed in the groove. The fixing adhesive tape is disposed at the side of the frame, and is disposed on the reflective adhesive tape. The reflective plate is disposed in the frame, wherein a gap is formed between the reflective plate and the fixing adhesive tape, and the gap is above the reflective adhesive tape. The light-guiding plate is disposed in the frame, and is disposed on the reflective plate and the fixing adhesive tape. The light-guiding plate has at least one light-incident surface. The light source is disposed beside the light-incident surface of the light-guiding plate. The backlight module is adapted for providing uniform surface light source.

Abstract: A radio frequency identification (RFID) device comprising a transmitter on a first surface of a substrate, a receiver on the first surface of the substrate, a ground area on a second surface of the substrate, a first antenna on the first surface of the substrate, the first antenna being electrically connected to the ground area and capable of transmitting outgoing signals, and a second antenna on the first surface of the substrate, the second antenna being electrically connected to the ground area and capable of receiving incoming signals.

Abstract: A backlight module including a frame, a reflective adhesive tape, a fixing adhesive tape, a reflective plate, a light-guiding plate and at least one of light source, is provided. The frame has a groove at one side. The reflective adhesive tape is disposed in the groove. The fixing adhesive tape is disposed at the side of the frame, and is disposed on the reflective adhesive tape. The reflective plate is disposed in the frame, wherein a gap is formed between the reflective plate and the fixing adhesive tape, and the gap is above the reflective adhesive tape. The light-guiding plate is disposed in the frame, and is disposed on the reflective plate and the fixing adhesive tape. The light-guiding plate has at least one light-incident surface. The light source is disposed beside the light-incident surface of the light-guiding plate. The backlight module is adapted for providing uniform surface light source.

Abstract: A strained silicon layer fabrication employs a substrate having successively formed thereover: (1) a first silicon-germanium alloy material layer; (2) a first silicon layer; (3) a second silicon-germanium alloy material layer; and (4) a second silicon layer. Within the fabrication each of the first silicon-germanium alloy layer and the second silicon-germanium alloy layer is formed of a thickness less than a threshold thickness for dislocation defect formation, such as to provide attenuated dislocation defect formation within the strained silicon layer fabrication.

Abstract: A strained silicon layer fabrication employs a substrate having successively formed thereover: (1) a first silicon-germanium alloy material layer; (2) a first silicon layer; (3) a second silicon-germanium alloy material layer; and (4) a second silicon layer. Within the fabrication each of the first silicon-germanium alloy layer and the second silicon-germanium alloy layer is formed of a thickness less than a threshold thickness for dislocation defect formation, such as to provide attenuated dislocation defect formation within the strained silicon layer fabrication.

Abstract: The present disclosure provides a method for forming and manufacturing a silicon germanium (SiGe) based device. After forming a substrate of the device and forming one or more layers of semiconductor processing materials in one or more predetermined locations to establish an opening for depositing one or more SiGe material layers, a pre-baking process is applied to the device under a low pressure not to exceed 79 torr and 900° C. Once completed, the one or more SiGe material layers are deposited and other conventional steps are taken to complete the manufacturing of the device.