Abstract: A method of testing semiconductor devices using a probe card having a plurality of needles thereon comprising intermittently raising a stage on which a semiconductor wafer with a metal film formed on a chip area is deposited, calculating the difference in distance between the position of the stage when the tip of at least one needle among the plurality of needles provided on a probe card disposed above the stage is first brought into contact with the metal film and the position of the stage when all the needles are brought into contact with the metal film, measuring the contact resistance between each of the needles and the metal film when all the needles are brought into contact with the metal film, and performing a probe test when the difference in distance and the contact resistance both satisfy respective predetermined conditions.