Abstract: A pressure detection element includes a pressure detection chamber for detecting pressure inside, a first electrode, a second electrode, and a first piezoelectric body that is disposed between the first and second electrodes and capacitance of which changes in accordance with the pressure of the pressure detection chamber. The first piezoelectric body includes a first piezoelectric layer positioned on the first electrode side and a second piezoelectric layer positioned on the second electrode side. The second piezoelectric layer is in the tetragonal, cubic, or monoclinic crystal system. The first piezoelectric layer is in the rhombohedral crystal system. Thickness of the second piezoelectric layer is smaller than thickness of the first piezoelectric layer.

Abstract: A flow passage member includes: a supply flow passage through which liquid flows; a filter provided on a path of the supply flow passage, the liquid being configured to pass through the filter; a fixing member which constitutes a part of the supply flow passage and to which the filter is fixed; and a first member which constitutes a part of the supply flow passage and to which the fixing member is fixed; wherein the fixing member is made of thermoplastic resin, and the first member is made of any of thermosetting resin, metal, and ceramic.

Abstract: A liquid ejecting head includes, a pressure chamber substrate that includes a pressure chamber in which pressure for ejecting the liquid from the nozzle is applied to the liquid, and an absorption chamber that is adjacent to the pressure chamber in a second direction and absorbs vibration of the liquid generated when the pressure is applied to the liquid in the pressure chamber, a first vibration plate that is provided corresponding to the pressure chamber and vibrates to apply the pressure to the liquid, a second vibration plate that is provided corresponding to the absorption chamber and vibrates to absorb the pressure of the liquid, a second wiring portion that is provided at a position corresponding to the absorption chamber, and a pressure acquisition portion that acquires the pressure of the absorption chamber based on a resistance value of the second wiring portion.

Abstract: A liquid ejecting head includes a nozzle substrate that is provided with a nozzle for ejecting a liquid, a pressure chamber substrate that includes a pressure chamber in which pressure for ejecting the liquid from the nozzle is applied to the liquid, and an absorption chamber that is adjacent to the pressure chamber and absorbs vibration of the liquid generated when the pressure is applied to the liquid in the pressure chamber, a first piezoelectric member that is provided corresponding to the pressure chamber and applies pressure to the pressure chamber when a voltage is applied, a second piezoelectric member that is provided corresponding to the absorption chamber, and a pressure acquisition portion that acquires pressure of the absorption chamber based on a voltage applied to the second piezoelectric member.

Abstract: A liquid ejecting head includes: a plurality of head chips having a nozzle surface; a thermally conductive holder holding the plurality of head chips; a thermally conductive flow path structure provided with a flow path of a liquid supplied to the plurality of head chips; and a planar heater disposed between the holder and the flow path structure and along a direction parallel to the nozzle surface, in which the heater overlaps the plurality of head chips in a plan view.

Abstract: A liquid ejecting head supported by a support body includes: a first head chip; a holder having a holding portion holding the first head chip and a flange portion; and a heater heating the holding portion, in which the holding portion has a heat receiving portion receiving heat from the heater, and a shortest path of heat transferred through the holder from the heat receiving portion to the flange portion is bent or curved at two or more points.

Abstract: A liquid ejecting head includes: head chips including a first-head-chip and a second-head-chip; a holder holding the head chips; and a heater along a direction parallel to a nozzle surface. The first-head-chip and the second-head-chip are disposed to be offset from each other in both a first-direction and a second-direction parallel to the nozzle surface and intersecting with each other. When a first-side is one of the four sides of a virtual rectangle circumscribing the aggregate of the head chips and a second-side and a third-side are coupled to both ends of the first-side, the first-head-chip is in contact with the first-side and the third-side and the second-head chip is in contact with the second-side. The heater overlaps the head chips. A first-region surrounded by the first-side, the second-side, the first-head-chip, and the second-head-chip includes a first-outside-part positioned outside the outer edge of the heater.

Abstract: A liquid ejecting apparatus includes a liquid ejecting head including head chips each including a nozzle plate, a holder that is formed of resin, holds the head chips, and includes a flow path for supplying the liquid to each of the head chips, a holder cover that is formed of a material having a higher thermal conductivity than a thermal conductivity of the holder and houses the head chips and the holder, and a fixing plate that is formed of metal and to which the holder cover and the head chips are fixed, a carriage on which the liquid ejecting head is mounted, and a heater that is mounted on the carriage and heats the liquid inside each of the head chips via the holder cover and the fixing plate.

Abstract: A liquid ejecting head includes a first-positioning-portion into which a first-positioning-pin of a support body is inserted. When a virtual cylinder inserted to a deepest position of the first-positioning-portion and having a maximum cross-sectional area when viewed in a first-direction which is a depth direction of the first-positioning-portion is defined as a first-virtual-cylinder, a side surface of the first-virtual-cylinder includes a first-region, a second-region, and a third-region disposed between the first-region and the second-region. The first-region contacts with the first-positioning-portion on a first-side which is one side in a second-direction orthogonal to the first-direction, and does not contact with the first-positioning-portion on a second-side which is the other side in the second-direction. The second-region does not contact with the first-positioning-portion on the first-side, and contacts with the first-positioning-portion on the second-side.

Abstract: A liquid ejecting head includes: a plurality of head chips having nozzles; a holder holding the plurality of head chips; and a planar heater disposed on the holder and heating the holder, in which the heater includes an outer peripheral region along an outer edge of the holder and a middle region positioned inside the outer peripheral region in a plan view, and a heat generation amount per unit time of the outer peripheral region is larger than a heat generation amount per unit time of the middle region.

Abstract: A plurality of head chips including: a nozzle plate having a plurality of nozzles configured to eject a liquid in a first direction, and a case having one or more first flow paths communicating with at least a part of the plurality of nozzles; a holder to which the plurality of head chips are fixed, which includes metal or ceramics, and which has a plurality of second flow paths communicating with at least one of the plurality of first flow paths; and a heater configured to heat the holder.

Abstract: A liquid ejecting head includes: a plurality of head chips having nozzles; a holder holding the plurality of head chips; and a planar heater disposed on the holder and heating the holder, in which the heater includes an outer peripheral region along an outer edge of the holder and a middle region positioned inside the outer peripheral region in a plan view, and a heat generation amount per unit time of the outer peripheral region is larger than a heat generation amount per unit time of the middle region.

Abstract: A liquid ejecting apparatus includes a liquid ejecting head including head chips each including a nozzle plate, a holder that is formed of resin, holds the head chips, and includes a flow path for supplying the liquid to each of the head chips, a holder cover that is formed of a material having a higher thermal conductivity than a thermal conductivity of the holder and houses the head chips and the holder, and a fixing plate that is formed of metal and to which the holder cover and the head chips are fixed, a carriage on which the liquid ejecting head is mounted, and a heater that is mounted on the carriage and heats the liquid inside each of the head chips via the holder cover and the fixing plate.

Abstract: A liquid ejecting head includes: a plurality of head chips having a nozzle surface; a thermally conductive holder holding the plurality of head chips; a thermally conductive flow path structure provided with a flow path of a liquid supplied to the plurality of head chips; and a planar heater disposed between the holder and the flow path structure and along a direction parallel to the nozzle surface, in which the heater overlaps the plurality of head chips in a plan view.

Abstract: A liquid ejecting head supported by a support body includes: a first head chip; a holder having a holding portion holding the first head chip and a flange portion; and a heater heating the holding portion, in which the holding portion has a heat receiving portion receiving heat from the heater, and a shortest path of heat transferred through the holder from the heat receiving portion to the flange portion is bent or curved at two or more points.

Abstract: A liquid ejecting head includes: head chips including a first-head-chip and a second-head-chip; a holder holding the head chips; and a heater along a direction parallel to a nozzle surface. The first-head-chip and the second-head-chip are disposed to be offset from each other in both a first-direction and a second-direction parallel to the nozzle surface and intersecting with each other. When a first-side is one of the four sides of a virtual rectangle circumscribing the aggregate of the head chips and a second-side and a third-side are coupled to both ends of the first-side, the first-head-chip is in contact with the first-side and the third-side and the second-head chip is in contact with the second-side. The heater overlaps the head chips. A first-region surrounded by the first-side, the second-side, the first-head-chip, and the second-head-chip includes a first-outside-part positioned outside the outer edge of the heater.

Abstract: A plurality of head chips including: a nozzle plate having a plurality of nozzles configured to eject a liquid in a first direction, and a case having one or more first flow paths communicating with at least a part of the plurality of nozzles; a holder to which the plurality of head chips are fixed, which includes metal or ceramics, and which has a plurality of second flow paths communicating with at least one of the plurality of first flow paths; and a heater configured to heat the holder.

Abstract: A flow passage member includes: a supply flow passage through which liquid flows; a filter provided on a path of the supply flow passage, the liquid being configured to pass through the filter; a fixing member which constitutes a part of the supply flow passage and to which the filter is fixed; and a first member which constitutes a part of the supply flow passage and to which the fixing member is fixed; wherein the fixing member is made of thermoplastic resin, and the first member is made of any of thermosetting resin, metal, and ceramic.

Abstract: There is provided a liquid discharge head including a first wiring through which a drive signal is input to a wiring substrate, in which the wiring substrate has a substrate having a first surface and a second surface that opposes the first surface, a second wiring formed on the first surface, a third wiring formed on the second surface, a fourth wiring and a fifth wiring that pass through the substrate and electrically couples the second wiring with the third wiring, and an electrode provided on the second wiring and electrically couples the second wiring with the first wiring, and the electrode is positioned between a first coupling point at which the fourth wiring is electrically coupled to the second wiring and a second coupling point at which the fifth wiring is electrically coupled to the second wiring, in the second wiring.

Abstract: A liquid ejecting head including a head unit including a mounting surface on which a plurality of first terminals, to which a signal to eject ink from a nozzle is supplied, are formed, and a flexible wiring substrate including a plurality of second terminals that supply the signal to the head unit, the flexible wiring substrate bonded to the head unit with nonconductive paste while the second terminals and the first terminals are in an electrically coupled state, in which the plurality of second terminals are arranged at pitches of 50 ?m or less, and in which protrusions in contact with surfaces of the first terminals are formed on surfaces of the second terminals, the protrusions protruding at a height exceeding a surface roughness of the second terminals.