Patents by Inventor Shinichi Awano

Shinichi Awano has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20170245373
    Abstract: There is provided a method of manufacturing an electronic unit that includes an electronic component having a rectangular plate shape and generating heat during operation, and a heat dissipation gel covering the electronic component. The method includes a side surface coating step of coating opposite two side surfaces of four side surfaces of the electronic component with the heat dissipation gel by discharging the heat dissipation gel from a flat-shaped opening of a nozzle, and a top surface coating step of coating a top surface of the electronic component by discharging the heat dissipation gel from the opening of the nozzle after completion of the side surface coating step.
    Type: Application
    Filed: February 16, 2017
    Publication date: August 24, 2017
    Inventors: Akito IWAMA, Shinichi AWANO, Seiji TACHIBANA
  • Patent number: 8272119
    Abstract: The method of manufacturing a coil assembly for a stator formed with slots includes a coil wire combination forming step of forming a band-like coil wire combination by overlapping a plurality of coil wires while forming them with in-slot portions to be accommodated in the slots and turn portions each connecting each adjacent two of the in-slot portions, and a shaping step of shaping the band-like coil wire combination into a cylindrical shape by helically winding the band-like coil wire combination. The coil wire combination forming step is carried out by performing an interlaced part forming step of forming an interlaced part by overlapping the coil wires with each adjacent two of the coil wires intersecting with each other and a non-interlace part forming step of forming an interlaced part by overlapping the coil wires with each adjacent two of the coil wires not intersecting with each other.
    Type: Grant
    Filed: November 18, 2009
    Date of Patent: September 25, 2012
    Assignee: Denso Corporation
    Inventors: Shinichi Awano, Yoshiteru Kashihara, Takuji Harada, Yoshinobu Yanagisawa, Atsuo Ishizuka
  • Patent number: 8122588
    Abstract: The method is for manufacturing a coil assembly of a stator of an electric rotating machine constituted by a plurality of interlaced coil wires each including a plurality of in-slot portions and a plurality of turn portions each of which connects adjacent two of the in-slot portions. The method includes a setting step of setting coil wires such that they are located on a circle and extend in parallel, and a plurality of shaping steps performed repeatedly for interlacing the coil wires into a doughnut shape.
    Type: Grant
    Filed: June 23, 2009
    Date of Patent: February 28, 2012
    Assignee: Denso Corporation
    Inventors: Shinichi Awano, Akito Akimoto, Atsuo Ishizuka
  • Patent number: 8053685
    Abstract: A metal wiring plate includes a soldering portion to which an electronic device is soldered and a wiring portion extending from the soldering portion and configured to electrically connect the electronic device to other device. The wiring portion includes a narrow portion located adjacent to the soldering portion. The width of the narrow portion is less than the width of the soldering portion so that the narrow portion helps prevent melted solder applied to the soldering portion from spreading to areas outside the soldering portion. The narrow portion allows the electronic apparatus to be surely soldered to the soldering portion without using solder resist.
    Type: Grant
    Filed: April 22, 2008
    Date of Patent: November 8, 2011
    Assignee: Denso Corportion
    Inventors: Tatsuya Watanabe, Masahiko Imoto, Hideyuki Iiboshi, Shinichi Awano
  • Publication number: 20100125999
    Abstract: The method of manufacturing a coil assembly for a stator formed with slots includes a coil wire combination forming step of forming a band-like coil wire combination by overlapping a plurality of coil wires while forming them with in-slot portions to be accommodated in the slots and turn portions each connecting each adjacent two of the in-slot portions, and a shaping step of shaping the band-like coil wire combination into a cylindrical shape by helically winding the band-like coil wire combination. The coil wire combination forming step is carried out by performing an interlaced part forming step of forming an interlaced part by overlapping the coil wires with each adjacent two of the coil wires intersecting with each other and a non-interlace part forming step of forming an interlaced part by overlapping the coil wires with each adjacent two of the coil wires not intersecting with each other.
    Type: Application
    Filed: November 18, 2009
    Publication date: May 27, 2010
    Applicant: DENSO CORPORATION
    Inventors: Shinichi AWANO, Yoshiteru Kashihara, Takuji Harada, Yoshinobu Yanagisawa, Atsuo Ishizuka
  • Publication number: 20090313810
    Abstract: The method is for manufacturing a coil assembly of a stator of an electric rotating machine constituted by a plurality of interlaced coil wires each including a plurality of in-slot portions and a plurality of turn portions each of which connects adjacent two of the in-slot portions. The method includes a setting step of setting coil wires such that they are located on a circle and extend in parallel, and a plurality of shaping steps performed repeatedly for interlacing the coil wires into a doughnut shape.
    Type: Application
    Filed: June 23, 2009
    Publication date: December 24, 2009
    Applicant: DENSO CORPORATION
    Inventors: Shinichi AWANO, Akito Akimoto, Atsuo Ishizuka
  • Publication number: 20080264683
    Abstract: A metal wiring plate includes a soldering portion to which an electronic device is soldered and a wiring portion extending from the soldering portion and configured to electrically connect the electronic device to other device. The wiring portion includes a narrow portion located adjacent to the soldering portion. The width of the narrow portion is less than the width of the soldering portion so that the narrow portion helps prevent melted solder applied to the soldering portion from spreading to areas outside the soldering portion. The narrow portion allows the electronic apparatus to be surely soldered to the soldering portion without using solder resist.
    Type: Application
    Filed: April 22, 2008
    Publication date: October 30, 2008
    Applicant: DENSO CORPORATION
    Inventors: Tatsuya Watanabe, Masahiko Imoto, Hideyuki Iiboshi, Shinichi Awano