Patents by Inventor Shinichi Sakamoto

Shinichi Sakamoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus, system, and method for wireless connection in integrated circuit packages
    Patent number: 9385094
    Abstract: Some embodiments of the invention include a connecting structure between a support and at least one die attached to the support. The die includes a number of die bond pads on a surface of the die. The connecting structure includes a plurality of via and groove combinations. Conductive material is formed in the via and groove combinations to provide connection between the die bond pads and bond pads on the support. Other embodiments are described and claimed.
    Type: Grant
    Filed: March 16, 2015
    Date of Patent: July 5, 2016
    Assignee: Intel Corporation
    Inventors: Jiamiao Tang, Henry Xu, Shinichi Sakamoto
  • LD MODULE
    Publication number: 20160147025
    Abstract: In an LD module of the present invention, a plurality of laser diodes emit a plurality of laser beams toward a corresponding plurality of mirrors so that intervals between adjacent ones of the laser beams gradually increase, and the plurality of mirrors reflect the plurality of laser beams toward the fast axis focusing lens so that intervals between adjacent ones of the laser beams gradually decrease.
    Type: Application
    Filed: January 28, 2016
    Publication date: May 26, 2016
    Applicant: FUJIKURA LTD.
    Inventor: Shinichi Sakamoto
  • Manufacturing method for optical module
    Patent number: 9335489
    Abstract: A method of manufacturing an optical module 1 in which an optical fiber 10 is fixed to two fixing portions (a fiber mount 30 and a pipe part 51) includes a first fixing step P3 of fixing apart of the optical fiber 10 to the fiber mount 30, and a second fixing step P4 of applying tension by pulling the optical fiber 10 while a base 20 connected to the respective fixing portions has been heated to an upper limit or higher of guaranteed temperature of the optical module 1 and fixing the other part of the optical fiber 10 to the pipe part 51.
    Type: Grant
    Filed: October 11, 2013
    Date of Patent: May 10, 2016
    Assignee: FUJIKURA LTD.
    Inventor: Shinichi Sakamoto
  • MANUFACTURING METHOD OF COIL COMPONENT AND COIL COMPONENT
    Publication number: 20160075058
    Abstract: A manufacturing method of a coil component comprising the steps of: preparing a coil assembly body in which a coil is attached on a magnetic core and a mold body which is formed with a cavity portion in the inside thereof and which includes at least one opening portion, putting a viscous admixture including magnetic powders and thermosetting resin and the coil assembly body in the cavity portion, pushing the put-in viscous admixture in the mold body, and thermally-curing the pushed-in viscous admixture and forming a magnetic exterior body which covers the coil assembly body.
    Type: Application
    Filed: September 4, 2015
    Publication date: March 17, 2016
    Inventors: Motomi TAKAHASHI, Tomohiro KAJIYAMA, Teruaki TANAKA, Shinichi SAKAMOTO, Juichi OKI, Mitsugu KAWARAI, Tsutomu OTSUKA
  • LASER MODULE
    Publication number: 20150303643
    Abstract: A light incidence plane of the core 15 includes a plurality of planes 15a to 15c unparalleled with each other to which a light beam emitted from at least one laser element 21 is entered. When seen on a cross section taken along the longer direction of an optical fiber 10, light beams entered to a core 15 from the inclined planes 15b and 15c inclined to an axis CA of the optical fiber 10 in the plurality of the planes 15a to 15c are propagated from a region surrounded by a line and the inclined planes 15b and 15c forming an acute angle, the line being passed through the incident points of the light beams entered to the inclined planes 15b and 15c and parallel with an axis CA.
    Type: Application
    Filed: October 4, 2013
    Publication date: October 22, 2015
    Applicant: FUJIKURA LTD.
    Inventor: Shinichi Sakamoto
  • MULTIPLEXER, MULTIPLEXING METHOD, AND LD MODULE
    Publication number: 20150280404
    Abstract: A multiplexer includes: an output section outputting a beam bundle made of a plurality of laser beams whose F-axis directions are aligned; and an F-axis converging lens causing the beam bundle outputted from the output section to be converged in the F-axis direction. Optical axes of the plurality of laser beams constituting the beam bundle outputted from the output section intersect with each other at a single point without relying on the F-axis converging lens.
    Type: Application
    Filed: September 25, 2013
    Publication date: October 1, 2015
    Applicant: FUJIKURA LTD.
    Inventors: Yohei Kasai, Susumu Nakaya, Shinichi Sakamoto
  • METHOD FOR MANUFACTURING ELECTRONIC COMPONENT WITH COIL
    Publication number: 20150270064
    Abstract: A method for manufacturing an electronic component for avoiding electromagnetic interference includes: (a) placing a T-shaped core and an air-core coil in a metal mold; (b) injecting a mixture of a composite magnetic material and a resin into the metal mold so that the T-shaped core and the air-core coil are embedded by the mixture; (c) heating the mixture at a first temperature; (d) adjusting an outer shape while removing excessive mixture; and (e) hardening the mixture. The method may further include a process of polishing an outside of the hardened mixture. The method may further include a process of applying a pressure of 0.1 to 20.0 kg/cm2 to the mixture for adjusting an outer shape of the mixture by a movable punch of a press machine before the hardening process.
    Type: Application
    Filed: June 9, 2015
    Publication date: September 24, 2015
    Inventors: Shinichi SAKAMOTO, Douglas James MALCOLM
  • Industrial machine
    Patent number: 9127441
    Abstract: An industrial machine includes a power converter. The power converter includes: at least one power module; a capacitor; and a bus bar provided between any two among a load to be driven, the power module, and the capacitor. The bus bar includes: a first plate; a second plate; a first spacer configured to support respective corresponding first ends of the first plate and the second plate with a predetermined distance therebetween and to electrically connect the respective first ends of the first plate and the second plate with each other; and a second spacer configured to support respective corresponding second ends of the first plate and the second plate with a predetermined distance therebetween and to electrically connect the respective second ends of the first plate and the second plate with each other.
    Type: Grant
    Filed: July 22, 2014
    Date of Patent: September 8, 2015
    Assignee: SUMITOMO HEAVY INDUSTRIES, LTD.
    Inventors: Shinichi Sakamoto, Hideaki Yuasa
  • LIGHT GUIDING DEVICE, METHOD FOR PRODUCING SAME, AND LD MODULE
    Publication number: 20150219890
    Abstract: A light-guiding device that converts an input beam bundle made of a plurality of laser beams that have respectively been emitted from a plurality of LD elements, to an output beam bundle made of a plurality of output beams, includes a plurality of double mirrors each corresponding to a corresponding one of the LD elements LDi, the double mirrors being separated from one another. The double mirrors Mi each are made of a first mirror Mi1 that is mounted on a top surface of a base plate B and a second mirror Mi2 that is mounted on a top surface the first mirror Mi1. The first mirror has a first reflective surface whose normal makes an angle of 45° with a normal of the top surface of the base plate. The second mirror has a second reflective surface whose normal makes an angle of 135° with the normal of the top surface of the base plate.
    Type: Application
    Filed: August 13, 2013
    Publication date: August 6, 2015
    Applicant: FUJIKURA LTD.
    Inventors: Shohei Kumeta, Shinichi Sakamoto
  • Method for manufacturing electronic component with coil
    Patent number: 9087634
    Abstract: A method for manufacturing an electronic component for avoiding electromagnetic interference includes: (a) placing a T-shaped core and an air-core coil in a metal mold; (b) injecting a mixture of a composite magnetic material and a resin into the metal mold so that the T-shaped core and the air-core coil are embedded by the mixture; (c) heating the mixture at a first temperature; (d) adjusting an outer shape while removing excessive mixture; and (e) hardening the mixture. The method may further include a process of polishing an outside of the hardened mixture. The method may further include a process of applying a pressure of 0.1 to 20.0 kg/cm2 to the mixture for adjusting an outer shape of the mixture by a movable punch of a press machine before the hardening process.
    Type: Grant
    Filed: March 14, 2013
    Date of Patent: July 21, 2015
    Assignee: Sumida Corporation
    Inventors: Shinichi Sakamoto, Douglas James Malcolm
  • APPARATUS, SYSTEM, AND METHOD FOR WIRELESS CONNECTION IN INTEGRATED CIRCUIT PACKAGES
    Publication number: 20150187713
    Abstract: Some embodiments of the invention include a connecting structure between a support and at least one die attached to the support. The die includes a number of die bond pads on a surface of the die. The connecting structure includes a plurality of via and groove combinations. Conductive material is formed in the via and groove combinations to provide connection between the die bond pads and bond pads on the support. Other embodiments are described and claimed.
    Type: Application
    Filed: March 16, 2015
    Publication date: July 2, 2015
    Inventors: Jiamiao Tang, Henry Xu, Shinichi Sakamoto
  • Apparatus, system, and method for wireless connection in integrated circuit packages
    Patent number: 8981573
    Abstract: Some embodiments of the invention include a connecting structure between a support and at least one die attached to the support. The die includes a number of die bond pads on a surface of the die. The connecting structure includes a plurality of via and groove combinations. Conductive material is formed in the via and groove combinations to provide connection between the die bond pads and bond pads on the support. Other embodiments are described and claimed.
    Type: Grant
    Filed: August 19, 2013
    Date of Patent: March 17, 2015
    Assignee: Intel Corporation
    Inventors: Jiamiao Tang, Henry Xu, Shinichi Sakamoto
  • Apparatus, system, and method for wireless connection in integrated circuit packages
    Patent number: 8963333
    Abstract: Some embodiments of the invention include a connecting structure between a support and at least one die attached to the support. The die includes a number of die bond pads on a surface of the die. The connecting structure includes a plurality of via and groove combinations. Conductive material is formed in the via and groove combinations to provide connection between the die bond pads and bond pads on the support. Other embodiments are described and claimed.
    Type: Grant
    Filed: August 19, 2013
    Date of Patent: February 24, 2015
    Assignee: Intel Corporation
    Inventors: Jiamiao Tang, Henry Xu, Shinichi Sakamoto
  • Heat exchanger and thermoacoustic device using the same
    Patent number: 8931286
    Abstract: A thermoacoustic device 1 for improving heat exchange efficiency is provided which has a first stack 3a including stack constituent elements 3eL and 3eH laminated together, and a first high-temperature side heat exchanger 4 and a first low-temperature side heat exchanger 5, which are provided at two ends of the first stack 3a, in which a self-excited acoustic wave is generated by a temperature difference between the first high-temperature side heat exchanger 4 and the first low-temperature side heat exchanger 5 and is then converted to thermal energy in a stack 3b provided between a second high-temperature side heat exchanger 6 and a second low-temperature side heat exchanger 7.
    Type: Grant
    Filed: April 22, 2005
    Date of Patent: January 13, 2015
    Assignee: The Doshisha
    Inventors: Yoshiaki Watanabe, Shinichi Sakamoto
  • Optical fiber-type optical element, laser diode module, and fiber laser
    Patent number: 8934508
    Abstract: There are provided: a core section provided so as to extend in a light-guiding direction in which incident light propagates; a photosensitive layer provided so as to extend in the light-guiding direction and peripherally enclose the core section, the photosensitive layer including a grating formed therein by irradiation of ultraviolet light having a predetermined wavelength; and a first cladding section provided between the core section and the photosensitive layer, the first cladding section having a lower refractive index than the core section and a lower photosensitivity than the photosensitive layer, the photosensitivity being a property in which a refractive index changes in response to irradiation with the ultraviolet light.
    Type: Grant
    Filed: September 19, 2012
    Date of Patent: January 13, 2015
    Assignee: Fujikura Ltd.
    Inventor: Shinichi Sakamoto
  • INDUSTRIAL MACHINE
    Publication number: 20140330489
    Abstract: An industrial machine includes a power converter. The power converter includes: at least one power module; a capacitor; and a bus bar provided between any two among a load to be driven, the power module, and the capacitor. The bus bar includes: a first plate; a second plate; a first spacer configured to support respective corresponding first ends of the first plate and the second plate with a predetermined distance therebetween and to electrically connect the respective first ends of the first plate and the second plate with each other; and a second spacer configured to support respective corresponding second ends of the first plate and the second plate with a predetermined distance therebetween and to electrically connect the respective second ends of the first plate and the second plate with each other.
    Type: Application
    Filed: July 22, 2014
    Publication date: November 6, 2014
    Inventors: Shinichi SAKAMOTO, Hideaki YUASA
  • ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT
    Publication number: 20140266541
    Abstract: An electronic component includes a magnetic core member, a winding and a magnetic exterior body. The magnetic core member has a flat base and a core. The flat base has a top surface, a bottom surface, a first side surface and a second side surface opposite to the first side surface. The core is located on the top surface of the flat base. A winding has an edgewise coil and two non-wound flat wires that extend from the edgewise coil. A magnetic exterior body covers at least the core and the edgewise coil. The two non-wound flat wires continuously extend along the top surface, the first side surface, the bottom surface and the second side surface of the flat base in this order. The two non-wound flat wires located on the bottom surface work as electrodes.
    Type: Application
    Filed: March 13, 2014
    Publication date: September 18, 2014
    Applicant: SUMIDA Corporation
    Inventors: Shinichi SAKAMOTO, Zhigang CHENG, Fernando Chan Mock, Mitsugu KAWARAI
  • METHOD FOR MANUFACTURING ELECTRONIC COMPONENT WITH COIL
    Publication number: 20140259640
    Abstract: A method for manufacturing an electronic component for avoiding electromagnetic interference includes: (a) placing a T-shaped core and an air-core coil in a metal mold; (b) injecting a mixture of a composite magnetic material and a resin into the metal mold so that the T-shaped core and the air-core coil are embedded by the mixture; (c) heating the mixture at a first temperature; (d) adjusting an outer shape while removing excessive mixture; and (e) hardening the mixture. The method may further include a process of polishing an outside of the hardened mixture. The method may further include a process of applying a pressure of 0.1 to 20.0 kg/cm2 to the mixture for adjusting an outer shape of the mixture by a movable punch of a press machine before the hardening process.
    Type: Application
    Filed: March 14, 2013
    Publication date: September 18, 2014
    Applicant: SUMIDA CORPORATION
    Inventors: Shinichi SAKAMOTO, Douglas James MALCOLM
  • Optical fiber-type optical element, laser diode module, and fiber laser
    Patent number: 8817828
    Abstract: There are provided: a core section provided so as to extend in a light-guiding direction in which incident light propagates; a photosensitive layer provided so as to extend in the light-guiding direction and peripherally enclose the core section, the photosensitive layer including a grating formed therein by irradiation of ultraviolet light having a predetermined wavelength; and a first cladding section provided between the core section and the photosensitive layer, the first cladding section having a lower refractive index than the core section and a lower photosensitivity than the photosensitive layer, the photosensitivity being a property in which a refractive index changes in response to irradiation with the ultraviolet light.
    Type: Grant
    Filed: September 19, 2012
    Date of Patent: August 26, 2014
    Assignee: Fujikura Ltd.
    Inventor: Shinichi Sakamoto
  • Thermoacoustic device with suppressor
    Patent number: 8806875
    Abstract: There is provided a thermoacoustic device 1 which has in a loop tube 2, a first stack 3a between a first high-temperature side heat exchanger 4 and a first low-temperature side heat exchanger 5, and a second stack 3b provided between a second high-temperature side heat exchanger 6 and a second low-temperature side heat exchanger 7, so that heat at the first stack side is prevented from being transported to the second stack side even when a large acoustic wave is generated in the tube. In the device, self-excited standing and traveling waves are generated by heating the first high-temperature side heat exchanger 4, and by the standing and traveling waves, the second low-temperature side heat exchanger 7 is cooled. a piezoelectric film 81 is provided to suppress an acoustic streaming and/or a direct-current type flow of a working fluid.
    Type: Grant
    Filed: April 22, 2005
    Date of Patent: August 19, 2014
    Assignee: The Doshisha
    Inventors: Yoshiaki Watanabe, Shinichi Sakamoto