Patents by Inventor Shinichi Shinoda

Shinichi Shinoda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10937146
    Abstract: The image evaluation device includes a design data image generation unit that images design data; a machine learning unit that creates a model for generating a design data image from an inspection target image, using the design data image as a teacher and using the inspection target image corresponding to the design data image; a design data prediction image generation unit that predicts the design data image from the inspection target image, using the model created by the machine learning unit; a design data image generation unit that images the design data corresponding to the inspection target image; and a comparison unit that compares a design data prediction image generated by the design data prediction image generation unit and the design data image. As a result, it is possible to detect a systematic defect without using a defect image and generating misinformation frequently.
    Type: Grant
    Filed: January 18, 2019
    Date of Patent: March 2, 2021
    Assignee: Hitachi High-Tech Corporation
    Inventors: Shinichi Shinoda, Masayoshi Ishikawa, Yasutaka Toyoda, Yuichi Abe, Hiroyuki Shindo
  • Publication number: 20200369164
    Abstract: An auxiliary power supply device includes an auxiliary power supply; and an auxiliary power supply control unit configured to switch a mode of the auxiliary power supply to an output mode or a non-output mode when electric power is output from a main power supply to a drive motor. The auxiliary power supply control unit is configured to switch the mode to the non-output mode when a required power value required by the drive motor is equal to or smaller than a predetermined power value and to switch the mode to the output mode when the required power value is larger than the predetermined power value, the predetermined power value being set to a value smaller than outputtable electric power that is electric power outputtable from the main power supply.
    Type: Application
    Filed: May 15, 2020
    Publication date: November 26, 2020
    Applicant: JTEKT CORPORATION
    Inventors: Toyoki SUGIYAMA, Koji NISHI, Shinichi SAWADA, Takumi MIO, Fumihiko SATO, Satoshi SHINODA, Yukihiro KOMATSUBARA
  • Publication number: 20200266681
    Abstract: A rotary electric machine includes an armature unit including an annular rotor configured to be rotatable around an axis and a stator disposed on a radially outer side of the rotor; an input/output shaft coupled at a first end to an external device and extending along an axial direction of the rotor in a central space formed in a central portion of the rotor; and a coupling device disposed closer to a second end of the input/output shaft than an end of the rotor adjacent to the external device is in the axial direction and connecting the input/output shaft and the rotor so as to be able to transmit a torque.
    Type: Application
    Filed: November 7, 2019
    Publication date: August 20, 2020
    Inventors: Akihiko UMEDA, Mikito SASAKI, Shin ASANO, Hiroshi SATO, Hisanobu SHINODA, Shinichi ISOBE, Atsushi YUGE
  • Publication number: 20200266656
    Abstract: A power supply device includes a combination of one power supply module of a plurality of power supply modules having different power supply performances and one controller of a plurality of controllers having different functions, which are selectively combined. Each of the plurality of power supply modules includes a power supply module side connection portion common to the plurality of power supply modules, and each of the plurality of controllers includes a controller side connection portion common to the plurality of controllers and connectable to the power supply module side connection portion, to allow the one power supply module and the one controller are selectively combined.
    Type: Application
    Filed: February 19, 2020
    Publication date: August 20, 2020
    Applicants: JTEKT CORPORATION, KYOHO MACHINE WORKS, LTD.
    Inventors: Takanori ONISHI, Koji NISHI, Shinichi SAWADA, Toyoki SUGIYAMA, Takumi MIO, Yukihiro KOMATSUBARA, Satoshi SHINODA, Masafumi KAWANO
  • Patent number: 10644204
    Abstract: A method of manufacturing a light emitting element includes forming an n-type semiconductor layer that includes an n-type clad layer and AlxGa1-xN (0.1?x?1) as a main component, forming an n-side contact electrode that includes a laminate structure including a Ti layer and a Ru layer, the Ti layer being in contact with the n-type semiconductor layer, and forming an ohmic contact of the n-type semiconductor layer and the Ti layer by a heat treatment.
    Type: Grant
    Filed: September 14, 2017
    Date of Patent: May 5, 2020
    Assignee: TOYODA GOSEI CO., LTD.
    Inventors: Yasuhiro Takenaka, Yoshiki Saito, Shinichi Matsui, Daisuke Shinoda, Takashi Hodota, Hironao Shinohara
  • Publication number: 20200134355
    Abstract: An object of the present invention is to achieve both suppression of data amount of an image processing system that learns a collation image to be used for image identification using a discriminator and improvement of identification performance of the discriminator. In order to achieve the above object, there is proposed an image processing system including a discriminator that identifies an image using a collation image, the image processing system further including a machine learning engine that performs machine learning of collation image data required for image identification. The machine learning engine searches for a successfully identified image using an image for which identification has been failed, and adds information, obtained based on a partial image of the image for which identification has been failed and which has been selected by an input device to the successfully identified image obtained by the search to generate corrected collation image data.
    Type: Application
    Filed: March 15, 2018
    Publication date: April 30, 2020
    Inventors: Shinichi SHINODA, Yasutaka TOYODA, Shigetoshi SAKIMURA, Masayoshi ISHIKAWA, Hiroyuki SHINDO, Hitoshi SUGAHARA
  • Publication number: 20200074611
    Abstract: A pattern inspection system inspects an image of an inspection target pattern of an electronic device using an identifier constituted by machine learning, based on the image of the inspection target pattern of the electronic device and data used to manufacture the inspection target pattern. The system includes a storage unit which stores a plurality of pattern images of the electronic device and pattern data used to manufacture a pattern of the electronic device, and an image selection unit which selects a learning pattern image used in the machine learning from the plurality of pattern images, based on the pattern data and the pattern image stored in the storage unit.
    Type: Application
    Filed: August 30, 2019
    Publication date: March 5, 2020
    Applicant: HITACHI HIGH-TECHNOLOGIES CORPORATION
    Inventors: Shuyang DOU, Shinichi SHINODA, Yasutaka TOYODA, Hiroyuki SHINDO
  • Patent number: 10558127
    Abstract: The purpose of the present invention is to provide an exposure condition evaluation device that appropriately evaluates a wafer exposure condition or calculates an appropriate exposure condition, on the basis of information obtained from an FEM wafer, without relying on the formation state of the FEM wafer. In order to achieve the foregoing, the present invention proposes an exposure condition evaluation device which evaluates an exposure condition of a reduction projection exposure device, on the basis of the information of patterns exposed on a sample by the reduction projection exposure device, and which uses a second feature amount of a plurality of patterns formed by making exposure conditions uniform to correct a first feature amount of a plurality of patterns formed by a plurality of different exposure condition settings.
    Type: Grant
    Filed: December 18, 2015
    Date of Patent: February 11, 2020
    Assignee: Hitachi High-Technologies Corporation
    Inventors: Shinichi Shinoda, Yasutaka Toyoda, Hiroyuki Ushiba, Hitoshi Sugahara
  • Publication number: 20190386551
    Abstract: An inner coil end portion of a coil includes inner notch portions and that are positioned to respectively overlap inner coil end portions of other coils which are adjacent to the coil in an axial direction as seen in the axial direction, and that are capable of accommodating the inner coil end portions of the other coils in the axial direction. An outer coil end portion of the coil includes outer notch portions and that are positioned to respectively overlap outer coil end portions of the other coils which are adjacent to the coil in the axial direction as seen in the axial direction, and that are capable of accommodating the outer coil end portions of the other coils in the axial direction.
    Type: Application
    Filed: May 29, 2019
    Publication date: December 19, 2019
    Inventors: Mikito SASAKI, Shinichi ISOBE, Masayuki SAKAI, Hisanobu SHINODA, Keisuke Ota, Ryoji OKABE
  • Publication number: 20190228522
    Abstract: The image evaluation device includes a design data image generation unit that images design data; a machine learning unit that creates a model for generating a design data image from an inspection target image, using the design data image as a teacher and using the inspection target image corresponding to the design data image; a design data prediction image generation unit that predicts the design data image from the inspection target image, using the model created by the machine learning unit; a design data image generation unit that images the design data corresponding to the inspection target image; and a comparison unit that compares a design data prediction image generated by the design data prediction image generation unit and the design data image. As a result, it is possible to detect a systematic defect without using a defect image and generating misinformation frequently.
    Type: Application
    Filed: January 18, 2019
    Publication date: July 25, 2019
    Inventors: Shinichi SHINODA, Masayoshi ISHIKAWA, Yasutaka TOYODA, Yuichi ABE, Hiroyuki SHINDO
  • Patent number: 10190875
    Abstract: The purpose of the present invention is to provide a pattern measurement condition setting device which appropriately sets a measurement condition for finding out an appropriate exposure condition.
    Type: Grant
    Filed: June 17, 2015
    Date of Patent: January 29, 2019
    Assignee: Hitachi High-Technologies Corporation
    Inventors: Shinichi Shinoda, Yasutaka Toyoda, Hiroyuki Ushiba, Hitoshi Sugahara
  • Patent number: 9858659
    Abstract: Provided is a pattern inspecting and measuring device that decreases the influence of noise and the like and increases the reliability of an inspection or measurement result during inspection or measurement using the position of an edge extracted from image data obtained by imaging a pattern as the object of inspection or measurement. For this purpose, in the pattern inspecting and measuring device in which inspection or measurement of an inspection or measurement object pattern is performed using the position of the edge extracted, with the use of an edge extraction parameter, from the image data obtained by imaging the inspection or measurement object pattern, the edge extraction parameter is generated using a reference pattern having a shape as an inspection or measurement reference and the image data.
    Type: Grant
    Filed: October 11, 2013
    Date of Patent: January 2, 2018
    Assignee: Hitachi High-Technologies Corporation
    Inventors: Tsuyoshi Minakawa, Takashi Hiroi, Takeyuki Yoshida, Taku Ninomiya, Takuma Yamamoto, Hiroyuki Shindo, Fumihiko Fukunaga, Yasutaka Toyoda, Shinichi Shinoda
  • Patent number: 9830705
    Abstract: Provided are an image evaluation method and an image evaluation apparatus to evaluate a two-dimensional shape and a change in shape of a pattern side wall of a semiconductor pattern based on a SEM image, thus estimating an exposure condition. To this end, a method and a device include a storage unit that stores a model indicating a relationship between a feature amount that is obtained by creating a plurality of outlines from a SEM image and an exposure condition, and outline creation parameter information corresponding to the model; an outline creation unit that creates a plurality of outlines from a SEM image using the outline creation parameter information; and an estimation unit that uses a feature amount that is found based on the plurality of outlines created by the outline creation unit and the model to find an exposure condition.
    Type: Grant
    Filed: February 12, 2013
    Date of Patent: November 28, 2017
    Assignee: HITACHI HIGH-TECHNOLOGIES CORPORATION
    Inventors: Shinichi Shinoda, Yasutaka Toyoda, Tsuyoshi Minakawa, Ryoichi Matsuoka
  • Publication number: 20170336717
    Abstract: The purpose of the present invention is to provide an exposure condition evaluation device that appropriately evaluates a wafer exposure condition or calculates an appropriate exposure condition, on the basis of information obtained from an FEM wafer, without relying on the formation state of the FEM wafer. In order to achieve the foregoing, the present invention proposes an exposure condition evaluation device which evaluates an exposure condition of a reduction projection exposure device, on the basis of the information of patterns exposed on a sample by the reduction projection exposure device, and which uses a second feature amount of a plurality of patterns formed by making exposure conditions uniform to correct a first feature amount of a plurality of patterns formed by a plurality of different exposure condition settings.
    Type: Application
    Filed: December 18, 2015
    Publication date: November 23, 2017
    Applicant: Hitachi High-Technologies Corporation
    Inventors: Shinichi SHINODA, Yasutaka TOYODA, Hiroyuki USHIBA, Hitoshi SUGAHARA
  • Publication number: 20170160082
    Abstract: The purpose of the present invention is to provide a pattern measurement condition setting device which appropriately sets a measurement condition for finding out an appropriate exposure condition.
    Type: Application
    Filed: June 17, 2015
    Publication date: June 8, 2017
    Inventors: Shinichi SHINODA, Yasutaka TOYODA, Hiroyuki USHIBA, Hitoshi SUGAHARA
  • Publication number: 20150287201
    Abstract: Provided are an image evaluation method and an image evaluation apparatus to evaluate a two-dimensional shape and a change in shape of a pattern side wall of a semiconductor pattern based on a SEM image, thus estimating an exposure condition. To this end, a method and a device include a storage unit that stores a model indicating a relationship between a feature amount that is obtained by creating a plurality of outlines from a SEM image and an exposure condition, and outline creation parameter information corresponding to the model; an outline creation unit that creates a plurality of outlines from a SEM image using the outline creation parameter information; and an estimation unit that uses a feature amount that is found based on the plurality of outlines created by the outline creation unit and the model to find an exposure condition.
    Type: Application
    Filed: February 12, 2013
    Publication date: October 8, 2015
    Inventors: Shinichi Shinoda, Yasutaka Toyoda, Tsuyoshi Minakawa, Ryoichi Matsuoka
  • Publication number: 20150228063
    Abstract: Provided is a pattern inspecting and measuring device that decreases the influence of noise and the like and increases the reliability of an inspection or measurement result during inspection or measurement using the position of an edge extracted from image data obtained by imaging a pattern as the object of inspection or measurement. For this purpose, in the pattern inspecting and measuring device in which inspection or measurement of an inspection or measurement object pattern is performed using the position of the edge extracted, with the use of an edge extraction parameter, from the image data obtained by imaging the inspection or measurement object pattern, the edge extraction parameter is generated using a reference pattern having a shape as an inspection or measurement reference and the image data.
    Type: Application
    Filed: October 11, 2013
    Publication date: August 13, 2015
    Inventors: Tsuyoshi Minakawa, Takashi Hiroi, Takeyuki Yoshida, Taku Ninomiya, Takuma Yamamoto, Hiroyuki Shindo, Fumihiko Fukunaga, Yasutaka Toyoda, Shinichi Shinoda
  • Patent number: 8705841
    Abstract: A pattern inspection apparatus for detecting an abnormality includes a storage, a compensator and an abnormality judger. The storage stores data based on a reference pattern associated with an object pattern as an object to detect an abnormality and including a first pattern edge portion and a second pattern edge portion. The compensator partially compensates a location of the first pattern edge portion to be shrunk or expanded based on the reference pattern such that the first pattern edge portion is to be placed at a location of a third pattern edge portion while the second pattern edge portion maintains the same size. The abnormality judger sets a tolerance based on the location compensated based on the reference pattern, and judges the object pattern as abnormal when an outline of the object pattern is fallen outside of the tolerance.
    Type: Grant
    Filed: June 5, 2009
    Date of Patent: April 22, 2014
    Assignee: Hitachi High-Technologies Corporation
    Inventors: Shinichi Shinoda, Yasutaka Toyoda, Ryoichi Matsuoka
  • Patent number: 8687921
    Abstract: It is an object of the present invention is to provide an image processing technique that can detect the rotation of an observation image of a specimen with high accuracy. An image processing apparatus according to the present invention indirectly corrects a rotation gap between measurement image data and reference image data through wide-angle image data including a measurement part of a specimen (FIG. 1).
    Type: Grant
    Filed: March 25, 2011
    Date of Patent: April 1, 2014
    Assignee: Hitachi High-Technologies Corporation
    Inventors: Shinichi Shinoda, Yasutaka Toyoda, Ryoichi Matsuoka
  • Patent number: 8577125
    Abstract: The present invention provides a technique to generate an accurate connected image even in a monotonous pattern using design data as constrained conditions. A reference position is roughly determined through matching between the design data and image data, matching between neighboring images is performed using the amount of mismatch from the design data as a searching range and a connected image is generated at high speed and accurately.
    Type: Grant
    Filed: December 24, 2008
    Date of Patent: November 5, 2013
    Assignee: Hitachi High-Technologies Corporation
    Inventors: Shinichi Shinoda, Yasutaka Toyoda, Ryoichi Matsuoka