Abstract: The image evaluation device includes a design data image generation unit that images design data; a machine learning unit that creates a model for generating a design data image from an inspection target image, using the design data image as a teacher and using the inspection target image corresponding to the design data image; a design data prediction image generation unit that predicts the design data image from the inspection target image, using the model created by the machine learning unit; a design data image generation unit that images the design data corresponding to the inspection target image; and a comparison unit that compares a design data prediction image generated by the design data prediction image generation unit and the design data image. As a result, it is possible to detect a systematic defect without using a defect image and generating misinformation frequently.

Abstract: An auxiliary power supply device includes an auxiliary power supply; and an auxiliary power supply control unit configured to switch a mode of the auxiliary power supply to an output mode or a non-output mode when electric power is output from a main power supply to a drive motor. The auxiliary power supply control unit is configured to switch the mode to the non-output mode when a required power value required by the drive motor is equal to or smaller than a predetermined power value and to switch the mode to the output mode when the required power value is larger than the predetermined power value, the predetermined power value being set to a value smaller than outputtable electric power that is electric power outputtable from the main power supply.

Abstract: A rotary electric machine includes an armature unit including an annular rotor configured to be rotatable around an axis and a stator disposed on a radially outer side of the rotor; an input/output shaft coupled at a first end to an external device and extending along an axial direction of the rotor in a central space formed in a central portion of the rotor; and a coupling device disposed closer to a second end of the input/output shaft than an end of the rotor adjacent to the external device is in the axial direction and connecting the input/output shaft and the rotor so as to be able to transmit a torque.

Abstract: A power supply device includes a combination of one power supply module of a plurality of power supply modules having different power supply performances and one controller of a plurality of controllers having different functions, which are selectively combined. Each of the plurality of power supply modules includes a power supply module side connection portion common to the plurality of power supply modules, and each of the plurality of controllers includes a controller side connection portion common to the plurality of controllers and connectable to the power supply module side connection portion, to allow the one power supply module and the one controller are selectively combined.

Abstract: A method of manufacturing a light emitting element includes forming an n-type semiconductor layer that includes an n-type clad layer and AlxGa1-xN (0.1?x?1) as a main component, forming an n-side contact electrode that includes a laminate structure including a Ti layer and a Ru layer, the Ti layer being in contact with the n-type semiconductor layer, and forming an ohmic contact of the n-type semiconductor layer and the Ti layer by a heat treatment.

Abstract: An object of the present invention is to achieve both suppression of data amount of an image processing system that learns a collation image to be used for image identification using a discriminator and improvement of identification performance of the discriminator. In order to achieve the above object, there is proposed an image processing system including a discriminator that identifies an image using a collation image, the image processing system further including a machine learning engine that performs machine learning of collation image data required for image identification. The machine learning engine searches for a successfully identified image using an image for which identification has been failed, and adds information, obtained based on a partial image of the image for which identification has been failed and which has been selected by an input device to the successfully identified image obtained by the search to generate corrected collation image data.

Abstract: A pattern inspection system inspects an image of an inspection target pattern of an electronic device using an identifier constituted by machine learning, based on the image of the inspection target pattern of the electronic device and data used to manufacture the inspection target pattern. The system includes a storage unit which stores a plurality of pattern images of the electronic device and pattern data used to manufacture a pattern of the electronic device, and an image selection unit which selects a learning pattern image used in the machine learning from the plurality of pattern images, based on the pattern data and the pattern image stored in the storage unit.

Abstract: The purpose of the present invention is to provide an exposure condition evaluation device that appropriately evaluates a wafer exposure condition or calculates an appropriate exposure condition, on the basis of information obtained from an FEM wafer, without relying on the formation state of the FEM wafer. In order to achieve the foregoing, the present invention proposes an exposure condition evaluation device which evaluates an exposure condition of a reduction projection exposure device, on the basis of the information of patterns exposed on a sample by the reduction projection exposure device, and which uses a second feature amount of a plurality of patterns formed by making exposure conditions uniform to correct a first feature amount of a plurality of patterns formed by a plurality of different exposure condition settings.

Abstract: An inner coil end portion of a coil includes inner notch portions and that are positioned to respectively overlap inner coil end portions of other coils which are adjacent to the coil in an axial direction as seen in the axial direction, and that are capable of accommodating the inner coil end portions of the other coils in the axial direction. An outer coil end portion of the coil includes outer notch portions and that are positioned to respectively overlap outer coil end portions of the other coils which are adjacent to the coil in the axial direction as seen in the axial direction, and that are capable of accommodating the outer coil end portions of the other coils in the axial direction.

Abstract: The image evaluation device includes a design data image generation unit that images design data; a machine learning unit that creates a model for generating a design data image from an inspection target image, using the design data image as a teacher and using the inspection target image corresponding to the design data image; a design data prediction image generation unit that predicts the design data image from the inspection target image, using the model created by the machine learning unit; a design data image generation unit that images the design data corresponding to the inspection target image; and a comparison unit that compares a design data prediction image generated by the design data prediction image generation unit and the design data image. As a result, it is possible to detect a systematic defect without using a defect image and generating misinformation frequently.

Abstract: The purpose of the present invention is to provide a pattern measurement condition setting device which appropriately sets a measurement condition for finding out an appropriate exposure condition.

Abstract: Provided is a pattern inspecting and measuring device that decreases the influence of noise and the like and increases the reliability of an inspection or measurement result during inspection or measurement using the position of an edge extracted from image data obtained by imaging a pattern as the object of inspection or measurement. For this purpose, in the pattern inspecting and measuring device in which inspection or measurement of an inspection or measurement object pattern is performed using the position of the edge extracted, with the use of an edge extraction parameter, from the image data obtained by imaging the inspection or measurement object pattern, the edge extraction parameter is generated using a reference pattern having a shape as an inspection or measurement reference and the image data.

Abstract: Provided are an image evaluation method and an image evaluation apparatus to evaluate a two-dimensional shape and a change in shape of a pattern side wall of a semiconductor pattern based on a SEM image, thus estimating an exposure condition. To this end, a method and a device include a storage unit that stores a model indicating a relationship between a feature amount that is obtained by creating a plurality of outlines from a SEM image and an exposure condition, and outline creation parameter information corresponding to the model; an outline creation unit that creates a plurality of outlines from a SEM image using the outline creation parameter information; and an estimation unit that uses a feature amount that is found based on the plurality of outlines created by the outline creation unit and the model to find an exposure condition.

Abstract: The purpose of the present invention is to provide an exposure condition evaluation device that appropriately evaluates a wafer exposure condition or calculates an appropriate exposure condition, on the basis of information obtained from an FEM wafer, without relying on the formation state of the FEM wafer. In order to achieve the foregoing, the present invention proposes an exposure condition evaluation device which evaluates an exposure condition of a reduction projection exposure device, on the basis of the information of patterns exposed on a sample by the reduction projection exposure device, and which uses a second feature amount of a plurality of patterns formed by making exposure conditions uniform to correct a first feature amount of a plurality of patterns formed by a plurality of different exposure condition settings.

Abstract: The purpose of the present invention is to provide a pattern measurement condition setting device which appropriately sets a measurement condition for finding out an appropriate exposure condition.

Abstract: Provided are an image evaluation method and an image evaluation apparatus to evaluate a two-dimensional shape and a change in shape of a pattern side wall of a semiconductor pattern based on a SEM image, thus estimating an exposure condition. To this end, a method and a device include a storage unit that stores a model indicating a relationship between a feature amount that is obtained by creating a plurality of outlines from a SEM image and an exposure condition, and outline creation parameter information corresponding to the model; an outline creation unit that creates a plurality of outlines from a SEM image using the outline creation parameter information; and an estimation unit that uses a feature amount that is found based on the plurality of outlines created by the outline creation unit and the model to find an exposure condition.

Abstract: Provided is a pattern inspecting and measuring device that decreases the influence of noise and the like and increases the reliability of an inspection or measurement result during inspection or measurement using the position of an edge extracted from image data obtained by imaging a pattern as the object of inspection or measurement. For this purpose, in the pattern inspecting and measuring device in which inspection or measurement of an inspection or measurement object pattern is performed using the position of the edge extracted, with the use of an edge extraction parameter, from the image data obtained by imaging the inspection or measurement object pattern, the edge extraction parameter is generated using a reference pattern having a shape as an inspection or measurement reference and the image data.

Abstract: A pattern inspection apparatus for detecting an abnormality includes a storage, a compensator and an abnormality judger. The storage stores data based on a reference pattern associated with an object pattern as an object to detect an abnormality and including a first pattern edge portion and a second pattern edge portion. The compensator partially compensates a location of the first pattern edge portion to be shrunk or expanded based on the reference pattern such that the first pattern edge portion is to be placed at a location of a third pattern edge portion while the second pattern edge portion maintains the same size. The abnormality judger sets a tolerance based on the location compensated based on the reference pattern, and judges the object pattern as abnormal when an outline of the object pattern is fallen outside of the tolerance.

Abstract: It is an object of the present invention is to provide an image processing technique that can detect the rotation of an observation image of a specimen with high accuracy. An image processing apparatus according to the present invention indirectly corrects a rotation gap between measurement image data and reference image data through wide-angle image data including a measurement part of a specimen (FIG. 1).

Abstract: The present invention provides a technique to generate an accurate connected image even in a monotonous pattern using design data as constrained conditions. A reference position is roughly determined through matching between the design data and image data, matching between neighboring images is performed using the amount of mismatch from the design data as a searching range and a connected image is generated at high speed and accurately.