Patents by Inventor Shinichiro Adachi

Shinichiro Adachi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220302914
    Abstract: A driver circuit for driving a switching device having a control electrode. The driver circuit includes an ON circuit configured to turn on the switching device in response to a first drive signal, and an OFF circuit configured to discharge a parasitic capacitance of the control electrode of the switching device with a constant current, to turn off the switching device, in response to a second drive signal.
    Type: Application
    Filed: January 26, 2022
    Publication date: September 22, 2022
    Applicant: FUJI ELECTRIC CO., LTD.
    Inventors: Shinichiro ADACHI, Hirohisa ARAI
  • Publication number: 20220122902
    Abstract: A semiconductor apparatus includes a cooler including a bottom plate, a plurality of fins disposed on the bottom plate, and a cover member including a fin cover member and a plate cover member. The fin cover member covers the plurality of fins and has a heat dissipation outer surface. The plate cover member surrounds an outer periphery of the fin cover member, is disposed on the bottom plate, and has a plate cover surface. The apparatus further includes an insulating substrate on the heat dissipation outer surface, a semiconductor element on the insulating substrate, and an insulating member on the plate cover surface, to seal the insulating substrate and the semiconductor element. The plate cover surface is position closer to the bottom plate than is the heat dissipation outer surface with respect to a height direction orthogonal to the bottom plate.
    Type: Application
    Filed: August 30, 2021
    Publication date: April 21, 2022
    Applicant: FUJI ELECTRIC CO., LTD.
    Inventors: Shinichiro ADACHI, Kazuo ENOMOTO
  • Publication number: 20220084901
    Abstract: A semiconductor apparatus includes a cooler including a top plate, a bottom plate having upper and lower surfaces opposite to each other, a plurality of fins, each of which is bonded between the top plate and the upper surface of the bottom plate, and a circumferential wall surrounding the plurality of fins and being bonded between the top plate and the upper surface of the bottom plate. A flow path for cooling water is formed by a space defined by the top plate, the plurality of fins, the circumferential wall and the bottom plate. The apparatus further includes a semiconductor element on the insulating substrate with an insulating substrate interposed therebetween. The lower surface of the bottom plate is a flat surface, and the upper surface of the bottom plate is warped so that a center thereof protrudes with respect to a periphery thereof toward the semiconductor element.
    Type: Application
    Filed: September 1, 2021
    Publication date: March 17, 2022
    Applicant: FUJI ELECTRIC CO., LTD.
    Inventor: Shinichiro ADACHI
  • Patent number: 11107748
    Abstract: A semiconductor module is provided to downsize the module, the semiconductor module including a terminal case made of a resin for housing a semiconductor chip; and a cooling portion including a refrigerant circulating portion through which a refrigerant flows and a joining portion surrounding the refrigerant circulating portion, the refrigerant circulating portion being arranged below the terminal case, and the cooling portion being arranged directly or indirectly in close contact with the terminal case at the joining portion, wherein the terminal case is provided above the joining portion, and has a side wall provided so as to surround the semiconductor chip when seen in a top view, and a temperature sensor for sensing a temperature of the refrigerant is provided on the side wall.
    Type: Grant
    Filed: August 1, 2019
    Date of Patent: August 31, 2021
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventor: Shinichiro Adachi
  • Patent number: 10756001
    Abstract: Provided is a semiconductor module comprising: a semiconductor chip; a cooling portion having a refrigerant passing portion through which a refrigerant passes; and a laminated substrate having: a first metal interconnection layer; a second metal interconnection layer; and an insulation provided between the first metal interconnection layer and the second metal interconnection layer, wherein the cooling portion has: a top plate; a bottom plate; and a plurality of protruding parts which are provided on a surface of the bottom plate, and are separated from each other in a flow direction of the refrigerant, and are respectively provided continuously in a direction orthogonal to the flow direction, wherein the plurality of protruding parts are provided at a position overlapping with one end of the second metal interconnection layer and at a position overlapping with the semiconductor chip in the flow direction.
    Type: Grant
    Filed: November 28, 2018
    Date of Patent: August 25, 2020
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventors: Akio Kitamura, Shinichiro Adachi, Nobuhide Arai
  • Publication number: 20200098667
    Abstract: A semiconductor module is provided to downsize the module, the semiconductor module including a terminal case made of a resin for housing a semiconductor chip; and a cooling portion including a refrigerant circulating portion through which a refrigerant flows and a joining portion surrounding the refrigerant circulating portion, the refrigerant circulating portion being arranged below the terminal case, and the cooling portion being arranged directly or indirectly in close contact with the terminal case at the joining portion, wherein the terminal case is provided above the joining portion, and has a side wall provided so as to surround the semiconductor chip when seen in a top view, and a temperature sensor for sensing a temperature of the refrigerant is provided on the side wall.
    Type: Application
    Filed: August 1, 2019
    Publication date: March 26, 2020
    Inventor: Shinichiro ADACHI
  • Publication number: 20190148265
    Abstract: Provided is a semiconductor module comprising: a semiconductor chip; a cooling portion having a refrigerant passing portion through which a refrigerant passes; and a laminated substrate having: a first metal interconnection layer; a second metal interconnection layer; and an insulation provided between the first metal interconnection layer and the second metal interconnection layer, wherein the cooling portion has: a top plate; a bottom plate; and a plurality of protruding parts which are provided on a surface of the bottom plate, and are separated from each other in a flow direction of the refrigerant, and are respectively provided continuously in a direction orthogonal to the flow direction, wherein the plurality of protruding parts are provided at a position overlapping with one end of the second metal interconnection layer and at a position overlapping with the semiconductor chip in the flow direction.
    Type: Application
    Filed: November 28, 2018
    Publication date: May 16, 2019
    Inventors: Akio KITAMURA, Shinichiro ADACHI, Nobuhide ARAI
  • Patent number: 10156482
    Abstract: A semiconductor chip temperature estimation device that estimates the temperature of a semiconductor chip incorporated together with a thermistor in a semiconductor module includes a first estimation unit which calculates a first estimation value of a chip loss of the chip, a memory which stores in advance a correlation between a temperature rise of the temperature sensor and the chip loss of the chip, a second estimation unit which calculates a second estimation value of the temperature rise of the temperature sensor, and a third estimation unit which calculates a third estimation value of the temperature of the cooling element. The temperature of the semiconductor chip is estimated by using the third estimation value as a base temperature.
    Type: Grant
    Filed: April 6, 2015
    Date of Patent: December 18, 2018
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventors: Akihiro Imakiire, Akihiro Odaka, Shinichiro Adachi
  • Patent number: 10014236
    Abstract: A semiconductor device includes an insulating substrate, semiconductor elements and a cooling device. The cooling device includes a heat radiation substrate, fins, and a cooling case of a box-like shape that accommodates the fins and has a bottom wall and side walls. An introducing port and a discharge port for a cooling liquid are provided diagonally in a pair of side walls provided along the longitudinal direction of the assembly of the fins, among the side walls of the cooling case. A diffusion wall facing the introducing port is provided inside the cooling case.
    Type: Grant
    Filed: October 10, 2014
    Date of Patent: July 3, 2018
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventor: Shinichiro Adachi
  • Patent number: 9536875
    Abstract: An IGBT is disposed in an IGBT portion, and an FWD is disposed in an FWD portion. A p-type base region and an n?-type drift region are alternately exposed in a trench longitudinal direction in a substrate front surface in a mesa portion between neighboring trenches in the IGBT portion. A p-type anode region and the n?-type drift region are alternately exposed in the trench longitudinal direction in the substrate front surface in a mesa portion in the FWD portion, and a repetitive structure is formed with a portion of the n?-type drift region sandwiched between p-type anode regions and one p-type anode region in contact with the portion as one unit region. The proportion occupied by the p-type anode region in one unit region (an anode ratio) (?) is 50% to 100%.
    Type: Grant
    Filed: October 13, 2015
    Date of Patent: January 3, 2017
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventors: Masaki Tamura, Souichi Yoshida, Shinichiro Adachi
  • Patent number: 9412680
    Abstract: A semiconductor module includes a first semiconductor element, a second semiconductor element, a first heat spreader electrically and thermally connected to the first semiconductor element, a second heat spreader electrically and thermally connected to the second semiconductor element, a DCB substrate including a first metal foil on a top surface of a ceramic insulating substrate and including a second metal foil on a bottom surface, the first metal foil being electrically and thermally joined to the first heat spreader and the second heat spreader, and a cooler thermally connected to the second metal foil of the DCB substrate. The first semiconductor element is disposed on an upstream side, and the second semiconductor element is disposed on a downstream side with respect to a flowing direction of a refrigerant of the cooler. An area of the second heat spreader is greater than an area of the first heat spreader.
    Type: Grant
    Filed: December 14, 2015
    Date of Patent: August 9, 2016
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventors: Hiromichi Gohara, Nobuhide Arai, Shinichiro Adachi, Yoshitaka Nishimura
  • Publication number: 20160099194
    Abstract: A semiconductor module includes a first semiconductor element, a second semiconductor element, a first heat spreader electrically and thermally connected to the first semiconductor element, a second heat spreader electrically and thermally connected to the second semiconductor element, a DCB substrate including a first metal foil on a top surface of a ceramic insulating substrate and including a second metal foil on a bottom surface, the first metal foil being electrically and thermally joined to the first heat spreader and the second heat spreader, and a cooler thermally connected to the second metal foil of the DCB substrate. The first semiconductor element is disposed on an upstream side, and the second semiconductor element is disposed on a downstream side with respect to a flowing direction of a refrigerant of the cooler. An area of the second heat spreader is greater than an area of the first heat spreader.
    Type: Application
    Filed: December 14, 2015
    Publication date: April 7, 2016
    Inventors: Hiromichi GOHARA, Nobuhide ARAI, Shinichiro ADACHI, Yoshitaka NISHIMURA
  • Publication number: 20160043073
    Abstract: An IGBT is disposed in an IGBT portion, and an FWD is disposed in an FWD portion. A p-type base region and an n?-type drift region are alternately exposed in a trench longitudinal direction in a substrate front surface in a mesa portion between neighboring trenches in the IGBT portion. A p-type anode region and the n?-type drift region are alternately exposed in the trench longitudinal direction in the substrate front surface in a mesa portion in the FWD portion, and a repetitive structure is formed with a portion of the n?-type drift region sandwiched between p-type anode regions and one p-type anode region in contact with the portion as one unit region. The proportion occupied by the p-type anode region in one unit region (an anode ratio) (?) is 50% to 100%.
    Type: Application
    Filed: October 13, 2015
    Publication date: February 11, 2016
    Applicant: FUJI ELECTRIC CO., LTD.
    Inventors: Masaki TAMURA, Souichi YOSHIDA, Shinichiro ADACHI
  • Publication number: 20150211938
    Abstract: A semiconductor chip temperature estimation device that estimates the temperature of a semiconductor chip incorporated together with a thermistor in a semiconductor module includes a first estimation unit which calculates a first estimation value of a chip loss of the chip, a memory which stores in advance a correlation between a temperature rise of the temperature sensor and the chip loss of the chip, a second estimation unit which calculates a second estimation value of the temperature rise of the temperature sensor, and a third estimation unit which calculates a third estimation value of the temperature of the cooling element. The temperature of the semiconductor chip is estimated by using the third estimation value as a base temperature.
    Type: Application
    Filed: April 6, 2015
    Publication date: July 30, 2015
    Applicant: FUJI ELECTRIC CO., LTD.
    Inventors: Akihiro IMAKIIRE, Akihiro ODAKA, Shinichiro ADACHI
  • Publication number: 20150097281
    Abstract: A semiconductor device is disclosed. The semiconductor device is a power semiconductor module of a liquid-cooled type, which substantially prevents a cooling liquid from leaking out without providing additional working on a casing and without a providing high precision in a process for forming a sealing member and a groove for fitting the sealing member. The semiconductor device has a groove for fitting a sealing member that is formed not at the casing but at the base plate. The sealing member and the groove have widths that bring the sealing member made of an elastic material into contact with side surfaces of the groove intermittently.
    Type: Application
    Filed: September 9, 2014
    Publication date: April 9, 2015
    Applicant: FUJI ELECTRIC CO., LTD.
    Inventor: Shinichiro ADACHI
  • Publication number: 20150021756
    Abstract: A semiconductor device includes an insulating substrate, semiconductor elements and a cooling device. The cooling device includes a heat radiation substrate, fins, and a cooling case of a box-like shape that accommodates the fins and has a bottom wall and side walls. An introducing port and a discharge port for a cooling liquid are provided diagonally in a pair of side walls provided along the longitudinal direction of the assembly of the fins, among the side walls of the cooling case. A diffusion wall facing the introducing port is provided inside the cooling case.
    Type: Application
    Filed: October 10, 2014
    Publication date: January 22, 2015
    Applicant: FUJI ELECTRIC CO., LTD.
    Inventor: Shinichiro ADACHI
  • Patent number: 4102033
    Abstract: A method of producing layer-like clad metal materials is disclosed. The layer-like clad metal material is produced by applying an organic substance consisting mainly of carbon and hydrogen to the surface of a metallic core material having at its surface substantially no oxide film to form a coating film having a thickness of 50-3,000 .mu.m, placing said core material in a casting mold, pouring a molten metal having the same or different composition around said core material into said mold by a bottom pouring process to form a clad metal ingot, subjecting said ingot to slab rolling or forging to form an intermediate product, and then subjecting said intermediate product to a hot working and, if necessary, a cold working.
    Type: Grant
    Filed: March 21, 1977
    Date of Patent: July 25, 1978
    Assignee: Kawasaki Steel Corporation
    Inventors: Toshihiko Emi, Masashi Kawana, Katsuo Kinoshita, Shinichiro Adachi