Patents by Inventor Shinichiro Ichikawa
Shinichiro Ichikawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11691136Abstract: A method for producing an olefin oligomer is disclosed, in which an olefin oligomerization reaction is performed in the presence of an olefin oligomerization catalyst comprising (A) a chromium compound, (B) an amine compound of the general formula (1): (R1 to R4 represent a group such as a hydrocarbon group, Y represents a structure represented by —CR5R6—, R5 and R6 represent a group such as a hydrogen atom, and Z represents an integer of 1 to 10), and (C) a compound such as an organometal compound; and the olefin oligomerization catalyst.Type: GrantFiled: July 6, 2018Date of Patent: July 4, 2023Assignee: MITSUI CHEMICALS, INC.Inventors: Seiichi Ishii, Shinichiro Ichikawa, Terunori Fujita
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Patent number: 11523515Abstract: A method for manufacturing a wiring substrate includes forming a plating film on a metal foil laminated on a surface of an insulating layer, forming an etching resist on the plating film such that the etching resist has an opening for forming a conductor pattern, conducting a first etching process such that part of the plating film exposed from the opening of the etching resist is removed and that part of the metal foil is exposed, removing the etching resist from the plating film on the metal foil laminated on the surface of an insulating layer, and conducting a second etching process such that the part of the metal foil exposed by the first etching process is removed and that a conductor layer having the conductor pattern is formed on the surface of the insulating layer.Type: GrantFiled: January 22, 2021Date of Patent: December 6, 2022Assignee: IBIDEN CO., LTD.Inventors: Shinichiro Ichikawa, Takanori Doi
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Publication number: 20210235584Abstract: A method for manufacturing a wiring substrate includes forming a plating film on a metal foil laminated on a surface of an insulating layer, forming an etching resist on the plating film such that the etching resist has an opening for forming a conductor pattern, conducting a first etching process such that part of the plating film exposed from the opening of the etching resist is removed and that part of the metal foil is exposed, removing the etching resist from the plating film on the metal foil laminated on the surface of an insulating layer, and conducting a second etching process such that the part of the metal foil exposed by the first etching process is removed and that a conductor layer having the conductor pattern is formed on the surface of the insulating layer.Type: ApplicationFiled: January 22, 2021Publication date: July 29, 2021Applicant: IBIDEN CO., LTD.Inventors: Shinichiro ICHIKAWA, Takanori DOI
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Publication number: 20200222886Abstract: A method for producing an olefin oligomer is disclosed, in which an olefin oligomerization reaction is performed in the presence of an olefin oligomerization catalyst comprising (A) a chromium compound, (B) an amine compound of the general formula (1): (R1 to R4 represent a group such as a hydrocarbon group, Y represents a structure represented by —CR5R6—, R5 and R6 represent a group such as a hydrogen atom, and Z represents an integer of 1 to 10), and (C) a compound such as an organometal compound; and the olefin oligomerization catalyst.Type: ApplicationFiled: July 6, 2018Publication date: July 16, 2020Applicant: MITSUI CHEMICALS, INC.Inventors: Seiichi ISHII, Shinichiro ICHIKAWA, Terunori FUJITA
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Patent number: 10500570Abstract: Provided is a formed body containing at least one carbonate compound (A1) selected from Na2CO3 or K2CO3, the formed body having a volume of pores with a pore diameter of from 0.05 ?m to 10 ?m of from 0.10 mL/g to 0.30 mL/g and a crushing strength of from 1.8 kgf to 10.0 kgf.Type: GrantFiled: December 10, 2014Date of Patent: December 10, 2019Assignee: MITSUI CHEMICALS, INC.Inventors: Shinichiro Ichikawa, Naoya Takahashi, Masami Murakami
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Publication number: 20190188481Abstract: A motion picture distribution system is provided with: an extractor configured to perform an extraction operation of extracting one or a plurality of scenes associated with a particular action of a target person from a motion picture taken by an imager; a generator configured to edit the extracted one or plurality of scenes and to generate a digest motion picture; and a distributor configured to distribute the generated digest motion picture. The extractor is configured to perform machine learning associated with the particular action, by using at least a part of a motion picture including a person as input data, in order to improve the extraction operation.Type: ApplicationFiled: November 1, 2018Publication date: June 20, 2019Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Nobuki HAYASHI, Takeshi BABA, Akinori SATOU, Shinichiro ICHIKAWA
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Publication number: 20160296919Abstract: Provided is a formed body containing at least one carbonate compound (A1) selected from Na2CO3 or K2CO3, the formed body having a volume of pores with a pore diameter of from 0.05 ?m to 10 ?m of from 0.10 mL/g to 0.30 mL/g and a crushing strength of from 1.8 kgf to 10.0 kgf.Type: ApplicationFiled: December 10, 2014Publication date: October 13, 2016Inventors: Shinichiro ICHIKAWA, Naoya TAKAHASHI, Masami MURAKAMI
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Patent number: 8533943Abstract: A method of manufacturing a multilayer printed circuit board includes preparing a substrate having a first conductor circuit, forming on first circuit formed over substrate a film including cycloolefin resin such that an insulating layer including the resin is formed on substrate and first circuit, forming in insulating layer an opening exposing at least portion of first circuit, forming an electroless plating film covering surface of insulating layer including surface of insulating layer inside opening, forming on electroless film a plating resist layer having pattern exposing selected portions of electroless film, selected portions of electroless film including a second conductor circuit and a portion of electroless film covering opening, and forming an electrolytic plating film covering selected portions of electroless film such that a filled via conductor including an electrolytic material filling space in opening and that first circuit is connected to second circuit via conductor.Type: GrantFiled: March 24, 2009Date of Patent: September 17, 2013Assignee: Ibiden Co., Ltd.Inventors: Honchin En, Masayuki Hayashi, Dongdong Wang, Kenichi Shimada, Motoo Asai, Koji Sekine, Tohru Nakai, Shinichiro Ichikawa, Yukihiko Toyoda
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Publication number: 20130158328Abstract: The invention provides a process for producing an unsaturated hydrocarbon by dehydrogenating a hydrocarbon into a corresponding unsaturated hydrocarbon with use of a nontoxic catalyst having a long catalytic life. The process for producing unsaturated hydrocarbons includes a step of dehydrogenating a hydrocarbon into a corresponding unsaturated hydrocarbon by contacting the hydrocarbon with a catalyst A that is obtained by supporting zinc and a Group VIIIA metal on a silicate obtained by removing at least part of the boron atoms from a borosilicate.Type: ApplicationFiled: August 9, 2011Publication date: June 20, 2013Inventors: Phala Heng, Shinichiro Ichikawa, Junichi Ishikawa, Hirokazu Ikenaga, Jun Kawahara, Yoshida Goa
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Patent number: 8093507Abstract: A multilayer printed circuit board including a substrate board having a lower conductor circuit, a resin insulating layer formed over the substrate board and lower conductor circuit, and a conductor circuit formed over the resin insulating layer. The resin insulating layer has a via hole filled up with plating and is formed of a linear polyolefin resin formed by hot-pressing a film shaped resin.Type: GrantFiled: April 8, 2009Date of Patent: January 10, 2012Assignee: Ibiden Co., Ltd.Inventors: Honchin En, Masayuki Hayashi, Dongdong Wang, Kenichi Shimada, Motoo Asai, Koji Sekine, Tohru Nakai, Shinichiro Ichikawa, Yukihiko Toyoda
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Patent number: 8030577Abstract: The present invention has for its object to provide a multilayer printed circuit board which is very satisfactory in facture toughness, dielectric constant, adhesion and processability, among other characteristics. The present invention is directed to a multilayer printed circuit board comprising a substrate board, a resin insulating layer formed on said board and a conductor circuit constructed on said resin insulating layer, wherein said resin insulating layer comprises a polyolefin resin.Type: GrantFiled: June 25, 2008Date of Patent: October 4, 2011Assignee: Ibiden Co., Ltd.Inventors: Honchin En, Masayuki Hayashi, Dongdong Wang, Kenichi Shimada, Motoo Asai, Koji Sekine, Tohru Nakai, Shinichiro Ichikawa, Yukihiko Toyoda
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Patent number: 8020291Abstract: The present invention has for its object to provide a multilayer printed circuit board which is very satisfactory in facture toughness, dielectric constant, adhesion and processability, among other characteristics. The present invention is directed to a multilayer printed circuit board comprising a substrate board, a resin insulating layer formed on said board and a conductor circuit constructed on said resin insulating layer, wherein said resin insulating layer comprises a polyolefin resin.Type: GrantFiled: June 25, 2008Date of Patent: September 20, 2011Assignee: Ibiden Co., Ltd.Inventors: Honchin En, Masayuki Hayashi, Dongdong Wang, Kenichi Shimada, Motoo Asai, Koji Sekine, Tohru Nakai, Shinichiro Ichikawa, Yukihiko Toyoda
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Patent number: 8018045Abstract: The present invention has for its object to provide a multilayer printed circuit board which is very satisfactory in facture toughness, dielectric constant, adhesion and processability, among other characteristics. The present invention is directed to a multilayer printed circuit board comprising a substrate board, a resin insulating layer formed on said board and a conductor circuit constructed on said resin insulating layer, wherein said resin insulating layer comprises a polyolefin resin.Type: GrantFiled: June 25, 2008Date of Patent: September 13, 2011Assignee: Ibiden Co., Ltd.Inventors: Honchin En, Masayuki Hayashi, Dongdong Wang, Kenichi Shimada, Motoo Asai, Koji Sekine, Tohru Nakai, Shinichiro Ichikawa, Yukihiko Toyoda
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Patent number: 8006377Abstract: The present invention has for its object to provide a multilayer printed circuit board which is very satisfactory in facture toughness, dielectric constant, adhesion and processability, among other characteristics. The present invention is directed to a multilayer printed circuit board comprising a substrate board, a resin insulating layer formed on said board and a conductor circuit constructed on said resin insulating layer, wherein said resin insulating layer comprises a polyolefin resin.Type: GrantFiled: June 25, 2008Date of Patent: August 30, 2011Assignee: Ibiden Co., Ltd.Inventors: Honchin En, Masayuki Hayashi, Dongdong Wang, Kenichi Shimada, Motoo Asai, Koji Sekine, Tohru Nakai, Shinichiro Ichikawa, Yukihiko Toyoda
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Patent number: 7994433Abstract: A multilayer printed circuit board including a substrate board and a built-up structure formed over the substrate board. The built-up structure includes conductor circuits and resin insulating layers. The built-up structure has via holes interconnecting the conductor circuits through one or more resin insulating layers. The via holes are filled up with plating, and the resin insulating layers is formed of a cycloolefin resin.Type: GrantFiled: March 24, 2009Date of Patent: August 9, 2011Assignee: Ibiden Co., Ltd.Inventors: Honchin En, Masayuki Hayashi, Dongdong Wang, Kenichi Shimada, Motoo Asai, Koji Sekine, Tohru Nakai, Shinichiro Ichikawa, Yukihiko Toyoda
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Publication number: 20090205857Abstract: A multilayer printed circuit board including a substrate board having a lower conductor circuit, a resin insulating layer formed over the substrate board and lower conductor circuit, and a conductor circuit formed over the resin insulating layer. The resin insulating layer has a via hole filled up with plating and is formed of a linear polyolefin resin formed by hot-pressing a film shaped resin.Type: ApplicationFiled: April 8, 2009Publication date: August 20, 2009Applicant: IBIDEN CO., LTDInventors: Honchin EN, Masayuki Hayashi, Dongdong Wang, Kenichi Shimada, Motoo Asai, Koji Sekine, Tohru Nakai, Shinichiro Ichikawa, Yukihiko Toyoda
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Publication number: 20090188708Abstract: A method of manufacturing a multilayer printed circuit board including preparing a substrate board having a conductor circuit formed over the substrate board, forming an interlayer resin insulating layer on the conductor circuit formed over the substrate board by press laminating on the conductor circuit a film comprising a cycloolefin resin under vacuum or reduced pressure, and forming a via hole connecting to the conductor circuit through the resin insulating layer, the forming of the via hole including plating the via hole to fill up.Type: ApplicationFiled: March 24, 2009Publication date: July 30, 2009Applicant: IBIDEN CO., LTDInventors: Honchin EN, Masayuki Hayashi, Dongdong Wang, Kenichi Shimada, Motoo Asai, Koji Sekine, Tohru Nakai, Shinichiro Ichikawa, Yukihiko Toyoda
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Publication number: 20090183904Abstract: A multilayer printed circuit board including a substrate board and a built-up structure formed over the substrate board. The built-up structure includes conductor circuits and resin insulating layers. The built-up structure has via holes interconnecting the conductor circuits through one or more resin insulating layers. The via holes are filled up with plating, and the resin insulating layers is formed of a cycloolefin resin.Type: ApplicationFiled: March 24, 2009Publication date: July 23, 2009Applicant: IBIDEN CO., LTD.Inventors: Honchin EN, Masayuki Hayashi, Dongdong Wang, Kenichi Shimada, Motoo Asai, Koji Sekine, Tohru Nakai, Shinichiro Ichikawa, Yukihiko Toyoda
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Patent number: 7535095Abstract: The present invention has for its object to provide a multilayer printed circuit board which is very satisfactory in fracture toughness, dielectric constant, adhesion and processability, among other characteristics. The present invention is directed to a multilayer printed circuit board comprising a substrate board, a resin insulating layer formed on said board and a conductor circuit constructed on said resin insulating layer, wherein said resin insulating layer comprises a polyolefin resin.Type: GrantFiled: September 28, 1999Date of Patent: May 19, 2009Assignee: Ibiden Co., Ltd.Inventors: Honchin En, Masayuki Hayashi, Dongdong Wang, Kenichi Shimada, Motoo Asai, Koji Sekine, Tohru Nakai, Shinichiro Ichikawa, Yukihiko Toyoda
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Publication number: 20090090003Abstract: The present invention has for its object to provide a multilayer printed circuit board which is very satisfactory in facture toughness, dielectric constant, adhesion and processability, among other characteristics. The present invention is directed to a multilayer printed circuit board comprising a substrate board, a resin insulating layer formed on said board and a conductor circuit constructed on said resin insulating layer, wherein said resin insulating layer comprises a polyolefin resin.Type: ApplicationFiled: June 25, 2008Publication date: April 9, 2009Applicant: IBIDEN CO., LTDInventors: Honchin En, Masayuki Hayashi, Dongdong Wang, Kenichi Shimada, Motoo Asai, Koji Sekine, Tohru Nakai, Shinichiro Ichikawa, Yukihiko Toyoda