Patents by Inventor Shinichirou Sukata
Shinichirou Sukata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240105653Abstract: A method for forming solder bumps by using a solder paste containing solder particles, a flux, and a volatile dispersion medium, the method including: applying the solder paste on a member having a plurality of electrodes on the surface; heating the member and the solder paste at a temperature below the melting point of solder constituting the solder particles to form a solder particle-containing layer; heating the member and the solder particle-containing layer at a temperature equal to or higher than the melting point of the solder constituting the solder particles to form solder bumps; and removing, by cleaning, a residue of the solder particle-containing layer remaining between adjacent solder bumps, in which the solder particles have an average particle size of 10 ?m or less, and the content of the dispersion medium in the solder paste is 30% by mass or more.Type: ApplicationFiled: February 3, 2021Publication date: March 28, 2024Inventors: Yoshinori EJIRI, Shinichirou SUKATA, Kunihiko AKAI, Masumi SAKAMOTO, Chiaki SHIMIZU, Junichi KAKEHATA, Ayumi YOSHIBA
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Publication number: 20230087229Abstract: A conductive adhesive composition, the composition containing: (A) conductive particles; (B) a thermosetting resin; and (C) a flux activator. The conductive particles contain a metal having a melting point of 200° C. or lower. In a volume-based cumulative particle size distribution of the conductive particles, a cumulative 50% particle diameter D50 is 3 to 10 ?m, and a cumulative 10% particle diameter D10 is 2.4 ?m or more. The flux activator contains a compound having a hydroxyl group and a carboxyl group.Type: ApplicationFiled: February 8, 2021Publication date: March 23, 2023Inventor: Shinichirou SUKATA
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Publication number: 20220230918Abstract: An aspect of the invention is a method for producing a substrate having through-silicon vias, the method including a preparation step of preparing a silicon substrate provided with through-holes, in which the through-holes communicate with both principal surfaces; a copper sintered body formation step of forming a copper sintered body having a porous structure such that the copper sintered body fills at least the through-holes; a resin impregnation step of impregnating the copper sintered body with a curable resin composition; and a resin curing step of curing the curable resin composition impregnated into the copper sintered body to form an electric conductor that includes the copper sintered body having pores filled with a resin cured product, and providing through-silicon vias in the through-holes.Type: ApplicationFiled: April 24, 2019Publication date: July 21, 2022Inventors: Yoshinori EJIRI, Hideo NAKAKO, Yuki KAWANA, Motoki YONEKURA, Shinichirou SUKATA, Manabu ISHII, Masaru FUJITA, Michiko NATORI, Masahiro KIMURA, Ryo HONNA
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Publication number: 20220053647Abstract: One aspect of the present invention is a method for manufacturing an electronic component, the method including: a first step of applying a metal paste containing metal particles onto a polymer compact in a prescribed pattern to form a metal paste layer; a second step of sintering the metal particles to form metal wiring; a third step of applying a solder paste containing solder particles and a resin component onto the metal wiring to form a solder paste layer; a fourth step of disposing an electronic element on the solder paste layer; and a fifth step of heating the solder paste layer so as to form a solder layer bonding the metal wiring and the electronic element, and so as to form a resin layer covering at least a portion of the solder layer.Type: ApplicationFiled: September 5, 2019Publication date: February 17, 2022Applicant: Showa Denko Materials Co., Ltd.Inventors: Yoshinori EJIRI, Shinichirou SUKATA, Masaya TOBA, Hideo NAKAKO, Yuki KAWANA, Kosuke URASHIMA, Motoki YONEKURA, Takaaki NOHDOH, Yoshiaki KURIHARA, Hiroshi MASUDA, Keita SONE
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Publication number: 20210229222Abstract: A method for producing solder particles, which includes: a preparation step wherein a base material that has a plurality of recesses and solder fine particles are prepared; an accommodation step wherein at least some of the solder fine particles are accommodated in the recesses; and a fusing step wherein the solder fine particles accommodated in the recesses are fused, thereby forming solder particles within the recesses. With respect to this method for producing solder particles, the average particle diameter of the solder particles is from 1 ?m to 30 ?m; and the C.V. value of the solder particles is 20% or less.Type: ApplicationFiled: June 26, 2019Publication date: July 29, 2021Applicant: Showa Denko Materials Co., Ltd.Inventors: Kunihiko AKAI, Yoshinori EJIRI, Yuuhei OKADA, Toshimitsu MORIYA, Shinichirou SUKATA, Masayuki MIYAJI
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Publication number: 20210114145Abstract: The present invention relates to solder particles, each of which partially has a flat portion in the surface. By using these solder particles, electrodes facing each other are able to be appropriately connected, thereby achieving an anisotropic conductive material that exhibits excellent conduction reliability and excellent insulation reliability.Type: ApplicationFiled: June 26, 2019Publication date: April 22, 2021Applicant: Showa Denko Materials Co., Ltd.Inventors: Kunihiko AKAI, Yoshinori EJIRI, Yuuhei OKADA, Toshimitsu MORIYA, Shinichirou SUKATA, Masayuki MIYAJI
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Publication number: 20210114147Abstract: A method for producing an anisotropic conductive film, which includes: a preparation step wherein a base material that has a plurality of recesses and solder fine particles are prepared; an accommodation step wherein at least some of the solder fine particles are accommodated in the recesses; a fusing step wherein the solder fine particles accommodated in the recesses are fused, thereby forming solder particles within the recesses; a transfer step wherein an insulating resin material is brought into contact with the recess opening side of the base material that includes the solder particles in the recesses, thereby obtaining a first resin layer on which the solder particles have been transferred; and a layering step wherein a second resin layer that is configured from an insulating resin material is formed on the surface of the first resin layer, on which the solder particles have been transferred, thereby obtaining an anisotropic conductive film.Type: ApplicationFiled: June 26, 2019Publication date: April 22, 2021Applicant: Showa Denko Materials Co., Ltd.Inventors: Kunihiko AKAI, Yoshinori EJIRI, Yuuhei OKADA, Toshimitsu MORIYA, Shinichirou SUKATA, Masayuki MIYAJI
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Patent number: 9862866Abstract: An electrically conductive adhesive composition comprising electrically conductive particles containing a metal of which melting point is 220° C. or less, a thermosetting resin, and a thermal cationic polymerization initiator.Type: GrantFiled: March 6, 2015Date of Patent: January 9, 2018Assignee: HITACHI CHEMICAL COMPANY, LTD.Inventor: Shinichirou Sukata
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Patent number: 9837572Abstract: Provided is a method of manufacturing a solar cell module including: a step (A) of applying a conductive adhesive composition comprising conductive particles having metal, or the like; a step (B) of disposing wiring members so as to face with electrodes of the solar battery cells with the applied conductive adhesive composition interposed therebetween; a step (C) of heating the solar battery cells with the wiring members obtained in the step (B); and a step (D) of laminating sealing resins onto both surfaces of the solar battery cells with the wiring members obtained in the step (C), laminating protection glass onto a light-receiving surface of the solar battery cell and a protection film onto a rear surface of the solar battery cell, and performing heating, in which a melting point of the metal in the conductive particles is or lower than the heating temperature in the step (C).Type: GrantFiled: January 11, 2012Date of Patent: December 5, 2017Assignee: HITACHI CHEMICAL COMPANY, LTD.Inventors: Aya Momozaki, Shigeki Katogi, Hiroki Hayashi, Michiko Natori, Shinichirou Sukata
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Publication number: 20150255633Abstract: An electrically conductive adhesive composition comprising electrically conductive particles containing a metal of which melting point is 220° C. or less, a thermosetting resin, and a thermal cationic polymerization initiator.Type: ApplicationFiled: March 6, 2015Publication date: September 10, 2015Inventor: Shinichirou SUKATA
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Patent number: 8962986Abstract: A conductive adhesive comprising conductive particles including metal, a thermosetting resin, a flux activator, and preferably a rheology control agent is provided. A melting point of the conductive particles is preferably 220° C. or lower. The conductive adhesive is used for electrically connecting and adhering wiring members 4a, 4b to electrodes 3a, 3b connected to a solar battery cell 6.Type: GrantFiled: October 14, 2010Date of Patent: February 24, 2015Assignee: Hitachi Chemical Company, Ltd.Inventors: Hiroki Hayashi, Shigeki Katogi, Shinichirou Sukata, Michiko Natori, Aya Momozaki
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Publication number: 20140144481Abstract: Provided is a solar cell module in which a plurality of solar cells and a wiring member for electrically connecting the solar cells are connected via connecting portions and, wherein a plurality of finger electrodes are formed on a light receiving surface of a photoelectric conversion body of the solar cell, the wiring member is arranged so as to intersect with the plurality of finger electrodes, and the connecting portion on a light receiving surface side comprises a metal portion which is formed by allowing conductive particles containing a metal having a melting temperature of 200° C. or less to melt and aggregate in a resin and connects the individual finger electrodes and the wiring member; and a resin portion which is composed of the resin and surrounds the metal portion to bond the photoelectric conversion body and the wiring member.Type: ApplicationFiled: September 30, 2011Publication date: May 29, 2014Applicant: Hitachi Chemical Company, Ltd.Inventors: Hiroki Hayashi, Shigeki Katogi, Shinichirou Sukata, Aya Momozaki
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Publication number: 20130340813Abstract: Provided is a method of manufacturing a solar cell module including: a step (A) of applying a conductive adhesive composition comprising conductive particles having metal, or the like; a step (B) of disposing wiring members so as to face with electrodes of the solar battery cells with the applied conductive adhesive composition interposed therebetween; a step (C) of heating the solar battery cells with the wiring members obtained in the step (B); and a step (D) of laminating sealing resins onto both surfaces of the solar battery cells with the wiring members obtained in the step (C), laminating protection glass onto a light-receiving surface of the solar battery cell and a protection film onto a rear surface of the solar battery cell, and performing heating, in which a melting point of the metal in the conductive particles is or lower than the heating temperature in the step (C).Type: ApplicationFiled: January 11, 2012Publication date: December 26, 2013Applicant: HITACHI CHEMICAL COMPANY, LTD.Inventors: Aya Momozaki, Shigeki Katogi, Hiroki Hayashi, Michiko Natori, Shinichirou Sukata
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Publication number: 20130340806Abstract: Provided is an electrically conductive adhesive composition including: electrically conductive particles (A) containing metal having a melting point of equal to or lower than 220° C.; a thermosetting resin (B); a flux activator (C); and a curing catalyst (D), in which a reaction start temperature of the thermosetting resin (B) and the curing catalyst (D) is 130 to 200° C.Type: ApplicationFiled: January 11, 2012Publication date: December 26, 2013Applicant: HITACHI CHEMICAL COMPANY, LTD.Inventors: Shinichirou Sukata, Hiroki Hayashi, Aya Momozaki
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Publication number: 20120227786Abstract: A conductive adhesive comprising conductive particles including metal, a thermosetting resin, a flux activator, and preferably a rheology control agent is provided. A melting point of the conductive particles is preferably 220° C. or lower. The conductive adhesive is used for electrically connecting and adhering wiring members 4a, 4b to electrodes 3a, 3b connected to a solar battery cell 6.Type: ApplicationFiled: October 14, 2010Publication date: September 13, 2012Applicant: Hitachi Chemical Company, Ltd.Inventors: Hiroki Hayashi, Shigeki Katogi, Shinichirou Sukata, Michiko Natori, Aya Momozaki