Patents by Inventor Shinichirou Sukata

Shinichirou Sukata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210114145
    Abstract: The present invention relates to solder particles, each of which partially has a flat portion in the surface. By using these solder particles, electrodes facing each other are able to be appropriately connected, thereby achieving an anisotropic conductive material that exhibits excellent conduction reliability and excellent insulation reliability.
    Type: Application
    Filed: June 26, 2019
    Publication date: April 22, 2021
    Applicant: Showa Denko Materials Co., Ltd.
    Inventors: Kunihiko AKAI, Yoshinori EJIRI, Yuuhei OKADA, Toshimitsu MORIYA, Shinichirou SUKATA, Masayuki MIYAJI
  • Publication number: 20210114147
    Abstract: A method for producing an anisotropic conductive film, which includes: a preparation step wherein a base material that has a plurality of recesses and solder fine particles are prepared; an accommodation step wherein at least some of the solder fine particles are accommodated in the recesses; a fusing step wherein the solder fine particles accommodated in the recesses are fused, thereby forming solder particles within the recesses; a transfer step wherein an insulating resin material is brought into contact with the recess opening side of the base material that includes the solder particles in the recesses, thereby obtaining a first resin layer on which the solder particles have been transferred; and a layering step wherein a second resin layer that is configured from an insulating resin material is formed on the surface of the first resin layer, on which the solder particles have been transferred, thereby obtaining an anisotropic conductive film.
    Type: Application
    Filed: June 26, 2019
    Publication date: April 22, 2021
    Applicant: Showa Denko Materials Co., Ltd.
    Inventors: Kunihiko AKAI, Yoshinori EJIRI, Yuuhei OKADA, Toshimitsu MORIYA, Shinichirou SUKATA, Masayuki MIYAJI
  • Patent number: 9862866
    Abstract: An electrically conductive adhesive composition comprising electrically conductive particles containing a metal of which melting point is 220° C. or less, a thermosetting resin, and a thermal cationic polymerization initiator.
    Type: Grant
    Filed: March 6, 2015
    Date of Patent: January 9, 2018
    Assignee: HITACHI CHEMICAL COMPANY, LTD.
    Inventor: Shinichirou Sukata
  • Patent number: 9837572
    Abstract: Provided is a method of manufacturing a solar cell module including: a step (A) of applying a conductive adhesive composition comprising conductive particles having metal, or the like; a step (B) of disposing wiring members so as to face with electrodes of the solar battery cells with the applied conductive adhesive composition interposed therebetween; a step (C) of heating the solar battery cells with the wiring members obtained in the step (B); and a step (D) of laminating sealing resins onto both surfaces of the solar battery cells with the wiring members obtained in the step (C), laminating protection glass onto a light-receiving surface of the solar battery cell and a protection film onto a rear surface of the solar battery cell, and performing heating, in which a melting point of the metal in the conductive particles is or lower than the heating temperature in the step (C).
    Type: Grant
    Filed: January 11, 2012
    Date of Patent: December 5, 2017
    Assignee: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Aya Momozaki, Shigeki Katogi, Hiroki Hayashi, Michiko Natori, Shinichirou Sukata
  • Publication number: 20150255633
    Abstract: An electrically conductive adhesive composition comprising electrically conductive particles containing a metal of which melting point is 220° C. or less, a thermosetting resin, and a thermal cationic polymerization initiator.
    Type: Application
    Filed: March 6, 2015
    Publication date: September 10, 2015
    Inventor: Shinichirou SUKATA
  • Patent number: 8962986
    Abstract: A conductive adhesive comprising conductive particles including metal, a thermosetting resin, a flux activator, and preferably a rheology control agent is provided. A melting point of the conductive particles is preferably 220° C. or lower. The conductive adhesive is used for electrically connecting and adhering wiring members 4a, 4b to electrodes 3a, 3b connected to a solar battery cell 6.
    Type: Grant
    Filed: October 14, 2010
    Date of Patent: February 24, 2015
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Hiroki Hayashi, Shigeki Katogi, Shinichirou Sukata, Michiko Natori, Aya Momozaki
  • Publication number: 20140144481
    Abstract: Provided is a solar cell module in which a plurality of solar cells and a wiring member for electrically connecting the solar cells are connected via connecting portions and, wherein a plurality of finger electrodes are formed on a light receiving surface of a photoelectric conversion body of the solar cell, the wiring member is arranged so as to intersect with the plurality of finger electrodes, and the connecting portion on a light receiving surface side comprises a metal portion which is formed by allowing conductive particles containing a metal having a melting temperature of 200° C. or less to melt and aggregate in a resin and connects the individual finger electrodes and the wiring member; and a resin portion which is composed of the resin and surrounds the metal portion to bond the photoelectric conversion body and the wiring member.
    Type: Application
    Filed: September 30, 2011
    Publication date: May 29, 2014
    Applicant: Hitachi Chemical Company, Ltd.
    Inventors: Hiroki Hayashi, Shigeki Katogi, Shinichirou Sukata, Aya Momozaki
  • Publication number: 20130340813
    Abstract: Provided is a method of manufacturing a solar cell module including: a step (A) of applying a conductive adhesive composition comprising conductive particles having metal, or the like; a step (B) of disposing wiring members so as to face with electrodes of the solar battery cells with the applied conductive adhesive composition interposed therebetween; a step (C) of heating the solar battery cells with the wiring members obtained in the step (B); and a step (D) of laminating sealing resins onto both surfaces of the solar battery cells with the wiring members obtained in the step (C), laminating protection glass onto a light-receiving surface of the solar battery cell and a protection film onto a rear surface of the solar battery cell, and performing heating, in which a melting point of the metal in the conductive particles is or lower than the heating temperature in the step (C).
    Type: Application
    Filed: January 11, 2012
    Publication date: December 26, 2013
    Applicant: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Aya Momozaki, Shigeki Katogi, Hiroki Hayashi, Michiko Natori, Shinichirou Sukata
  • Publication number: 20130340806
    Abstract: Provided is an electrically conductive adhesive composition including: electrically conductive particles (A) containing metal having a melting point of equal to or lower than 220° C.; a thermosetting resin (B); a flux activator (C); and a curing catalyst (D), in which a reaction start temperature of the thermosetting resin (B) and the curing catalyst (D) is 130 to 200° C.
    Type: Application
    Filed: January 11, 2012
    Publication date: December 26, 2013
    Applicant: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Shinichirou Sukata, Hiroki Hayashi, Aya Momozaki
  • Publication number: 20120227786
    Abstract: A conductive adhesive comprising conductive particles including metal, a thermosetting resin, a flux activator, and preferably a rheology control agent is provided. A melting point of the conductive particles is preferably 220° C. or lower. The conductive adhesive is used for electrically connecting and adhering wiring members 4a, 4b to electrodes 3a, 3b connected to a solar battery cell 6.
    Type: Application
    Filed: October 14, 2010
    Publication date: September 13, 2012
    Applicant: Hitachi Chemical Company, Ltd.
    Inventors: Hiroki Hayashi, Shigeki Katogi, Shinichirou Sukata, Michiko Natori, Aya Momozaki