Patents by Inventor Shinji Kochi

Shinji Kochi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220243051
    Abstract: The problem is solved by the present invention, which aims to provide a prepreg that allows continuous laying-up of prepreg layers while preventing the reinforcing fibers or the matrix resin from being partly deposited on the automated lay-up device, when such a device is used with the aim of producing a fiber-reinforced composite material having a high toughness and impact resistance.
    Type: Application
    Filed: June 30, 2020
    Publication date: August 4, 2022
    Applicant: TORAY Industries, Inc.
    Inventors: Shinji KOCHI, Daisuke KIDO, Aya KOMORIYA
  • Patent number: 11377531
    Abstract: A prepreg contains components [A] to [E], wherein 85% by mass or more of the component [E] is present in a range within 9% of the average thickness of the prepreg from each surface of the prepreg, and a range within 7% of the average thickness of the prepreg from each surface of the prepreg is composed of a first resin composition containing components [B] to [E]. [A] a carbon fiber, [B] an epoxy resin having two or more glycidyl groups in one molecule, [C] an aromatic amine compound, [D] a thermoplastic resin having a polyarylether skeleton, and [E] particles having a number average primary particle size of 5 to 50 ?m, having a content ratio (% by mass) of thermoplastic resin and thermosetting resin of 95:5 to 70:30.
    Type: Grant
    Filed: November 14, 2018
    Date of Patent: July 5, 2022
    Assignee: TORAY INDUSTRIES, INC.
    Inventors: Bon Aizawa, Ryuichi Kitahara, Takahiro Nishimura, Shinji Kochi, Naoya Takeda
  • Publication number: 20200299476
    Abstract: In the case of producing a fiber-reinforced composite material having excellent impact resistance by using an automatic lay up device, to provide a prepreg that can be layed up without adhesion and deposition of a part of the reinforced fibers or matrix resin in the device.
    Type: Application
    Filed: November 14, 2018
    Publication date: September 24, 2020
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Bon AIZAWA, Ryuichi KITAHARA, Takahiro NISHIMURA, Shinji KOCHI, Naoya TAKEDA
  • Patent number: 10597503
    Abstract: A prepreg containing at least the following components [A]-[F], wherein the ratio Ne/Nd of the number of structures Ne of component [F] present in a range of outside 110% of the particle diameter of component [E] and the number of structures Nd of component [F] present in a range outside 110% of the particle diameter of component [D] is 0.25 or higher. [A]: Carbon fibers, [B] thermosetting resin, [C]: curing agent, [D]: particles composed mainly of thermoplastic resin having a primary particle number-average particle size of 5-50 ?m, [E]: conductive particles different from component [D] and having a primary particle number-average particle size in the range of a specific expression, [F]: filler comprising a carbon material.
    Type: Grant
    Filed: March 19, 2015
    Date of Patent: March 24, 2020
    Assignee: TORAY INDUSTRIES, INC.
    Inventors: Atsuhito Arai, Koji Furukawa, Naofumi Yamashita, Shinji Kochi, Yumi Kunimitsu, Yui Fujioka, Hiroshi Taiko
  • Patent number: 10538637
    Abstract: Disclosed herein are an epoxy resin composition for fiber-reinforced composite materials which has low viscosity, high Tg, high elastic modulus, and excellent fracture toughness and a fiber-reinforced composite material using such an epoxy resin composition which has excellent thermal properties, compressive strength, impact resistance, fatigue resistance, and open-hole tensile strength and which is suitable for producing structural parts of aircraft and the like. The epoxy resin composition comprises at least a given bifunctional epoxy resin as a component (A), a liquid aromatic diamine curing agent as a component (B), and core-shell polymer particles as a component (C), wherein the core-shell polymer particles as the component (C) contain epoxy groups in their shell and have a volume-average particle size of 50 to 300 nm.
    Type: Grant
    Filed: February 5, 2016
    Date of Patent: January 21, 2020
    Assignee: TORAY INDUSTRIES, INC.
    Inventors: Toshiya Kamae, Shinji Kochi, Masayuki Miyoshi, Kenichi Yoshioka
  • Publication number: 20160159993
    Abstract: Disclosed herein are an epoxy resin composition for fiber-reinforced composite materials which has low viscosity, high Tg, high elastic modulus, and excellent fracture toughness and a fiber-reinforced composite material using such an epoxy resin composition which has excellent thermal properties, compressive strength, impact resistance, fatigue resistance, and open-hole tensile strength and which is suitable for producing structural parts of aircraft and the like. The epoxy resin composition comprises at least a given bifunctional epoxy resin as a component (A), a liquid aromatic diamine curing agent as a component (B), and core-shell polymer particles as a component (C), wherein the core-shell polymer particles as the component (C) contain epoxy groups in their shell and have a volume-average particle size of 50 to 300 nm.
    Type: Application
    Filed: February 5, 2016
    Publication date: June 9, 2016
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Toshiya KAMAE, Shinji KOCHI, Masayuki MIYOSHI, Kenichi YOSHIOKA
  • Patent number: 9062203
    Abstract: A binder composition comprising [A] an amorphous polyamide with a glass transition temperature of 140° C. or higher having a dicyclohexylmethane skeleton in the molecule and [B] a sulfonamide compound is used to provide a binder composition, a reinforcing-fiber base material and a preform respectively most suitable for RTM, which respectively exhibit excellent impact resistance and physical properties remaining stable over the variations of molding conditions and can be used for producing a fiber-reinforced composite material most suitable for members such as primary structures of aircraft.
    Type: Grant
    Filed: September 14, 2010
    Date of Patent: June 23, 2015
    Assignee: TORY INDUSTRIES INC.
    Inventors: Shinji Kochi, Kenichi Yoshioka, Masayuki Miyoshi
  • Publication number: 20150065606
    Abstract: The present invention relates to an epoxy resin composition including at least an appropriate type of epoxy resin, acid anhydride, salt of either diazabicycloundecene or diazabicyclononene and an organic compound, and core shell polymer particles, having a viscosity of 3,000 mPa·s or less at 25° C., and showing a viscosity of 4,500 mPa·s or less 3 hours after the start of measurement when subjected to continued measurement for 3 hours at a temperature of 25° C., by means of which it provides an epoxy resin composition with both a low viscosity and long pot life that serves effectively to produce fiber reinforced composite material with a high heat resistance and high toughness.
    Type: Application
    Filed: January 29, 2013
    Publication date: March 5, 2015
    Inventors: Ayumi Matsuda, Yumi Kunimitsu, Shinji Kochi
  • Publication number: 20130316169
    Abstract: The present invention provides a prepreg comprising a reinforcement fiber [A], an epoxy resin [B] having two or more epoxy groups per molecule, a compound [C] capable of curing component [B], crosslinked resin particles [D] having a refractive index in the range of 1.49 to 1.61, and carbon black [E]. Furthermore, the surface layer of the prepreg that occupies 10% of the average prepreg thickness from each surface of the prepreg comprises components [B] to [E], and the refractive index, n0, of a cured epoxy resin produced by curing a resin composition comprising component [B] and component [C] and the refractive index, n1, of component [D] have the following relationship: 0.92?n1/n0?1.05. Thus, the invention provides a prepreg that can produce fiber reinforced composite materials having decorative surfaces with decreased appearance irregularities and accordingly serves to manufacture fiber reinforced composite materials having excellent appearance.
    Type: Application
    Filed: March 22, 2012
    Publication date: November 28, 2013
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Ayumi Matsuda, Yumi Kunimitsu, Shiori Kawamoto, Shinji Kochi
  • Publication number: 20120178329
    Abstract: A binder composition comprising [A] an amorphous polyamide with a glass transition temperature of 140° C. or higher having a dicyclohexylmethane skeleton in the molecule and [B] a sulfonamide compound is used to provide a binder composition, a reinforcing-fiber base material and a preform respectively most suitable for RTM, which respectively exhibit excellent impact resistance and physical properties remaining stable over the variations of molding conditions and can be used for producing a fiber-reinforced composite material most suitable for members such as primary structures of aircraft.
    Type: Application
    Filed: September 14, 2010
    Publication date: July 12, 2012
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Shinji Kochi, Kenichi Yoshioka, Masayuki Miyoshi
  • Publication number: 20110097568
    Abstract: Disclosed herein are an epoxy resin composition for fiber-reinforced composite materials which has low viscosity, high Tg, high elastic modulus, and excellent fracture toughness and a fiber-reinforced composite material using such an epoxy resin composition which has excellent thermal properties, compressive strength, impact resistance, fatigue resistance, and open-hole tensile strength and which is suitable for producing structural parts of aircraft and the like. The epoxy resin composition comprises at least a given bifunctional epoxy resin as a component (A), a liquid aromatic diamine curing agent as a component (B), and core-shell polymer particles as a component (C), wherein the core-shell polymer particles as the component (C) contain epoxy groups in their shell and have a volume-average particle size of 50 to 300 nm.
    Type: Application
    Filed: March 23, 2009
    Publication date: April 28, 2011
    Inventors: Toshiya Kamae, Shinji Kochi, Masayuki Miyoshi, Kenichi Yoshioka