Abstract: The present invention relates to a corrosion-protective composition containing a wax, an unsubstituted or substituted polyaniline in a doped form and a liquid paraffin, and articles comprising the composition applied on a substrate. It also relates to a process for manufacturing the composition, wherein i) a first dispersion of a polyaniline in a doped form is prepared; and ii) the first dispersion of the polyaniline is combined with a wax component to sufficiently disperse the polyaniline therein, and to the use of the composition as a single layer coating for the protection against corrosion of a substrate in need thereof.

Abstract: An illumination apparatus includes a light source; a sensor which has an image sensor and detects an illuminance and a presence of a human based on a captured image while setting a range overlapping a range illuminated by the light source as a visual field; an illuminance determining unit for varying a light output from the light source based on the illuminance and the presence of a human; and a dimming control unit. The illuminance determining unit obtains an illuminance of an illuminance maintaining area included in the visual field based on the captured image, and when the sensor detects no human, the illuminance determining unit reduces the light output while maintaining the illuminance of the illuminance maintaining area to be equal to or greater than a threshold that is set in advance as a lower limit illuminance, which makes it feasible for the image sensor to capture an image.

Abstract: An illumination control system includes: illumination apparatuses having respective addresses and perform a dimming control in response to a dimming signal inputted from an outside, and an illumination control terminal which has an imaging device, a capturing range of which is set to include illumination ranges of the illumination apparatuses. The illumination control terminal segments an image captured by the imaging device into a plurality of areas so that the areas correspond to the illumination ranges, detects a person based on the captured image, determines a segmented area in which the person is present if the person has been detected and performs dimming control on an illumination apparatus corresponding to the determined segmented area.

Abstract: Conductive or solder bumps are stacked between a mounted component such as a BGA device and a printed wiring substrate in a multileveled printed circuit board unit. An interposer or relay substrate is interposed between the adjacent stacked conductive bumps. The interposer substrate is made of a porous material. When any difference in the expansion is caused between the printed wiring substrate and the mounted component, one side of the interposer substrate receives a relatively smaller displacement force while the other side of the interposer substrate receives a relatively larger displacement force. A shearing stress is induced in the interposer substrate. Deformation of the porous material serves to absorb the shearing stress in the interposer substrate. The conductive bumps bonded on one side of the interposer substrate as well as the conductive bumps bonded on the other side of the interposer substrate may be relieved from a shearing stress.

Abstract: In a filtering dispenser container which includes a plug attached to a mouth portion of a bottle thereof and having a liquid discharge passage, and a filter and a check valve provided in the discharge passage, air lock is prevented, even if the container contains a highly percolative liquid, by preventing a very small amount of liquid percolating the check valve from reaching the filter. In the filtering dispenser container, a dam (14) is provided between the check valve (23) and the filter (25) for retaining a very small amount of the liquid percolating the check valve (23) when the check valve is closed. Thus, the filter (25) is prevented from being wetted with the liquid percolating the closed check valve (23) during storage or delivery of the container before the first use of the container.

Abstract: A brightness sensing system includes an image pickup unit for taking an image of a target space and a calculation unit for calculating the brightness of an image pickup area based on the image taken by the image pickup unit. In the brightness sensing system, if the difference or the ratio between an image as a whole and a pixel block formed of one or more pixels is equal to or greater than a threshold in terms of brightness change between a previously-taken reference image and a currently-taken target image, the calculation unit excludes the pixel block from comparison candidates and compares the brightness of the target image with the brightness of the reference image based on the remaining pixels other than the pixel block.

Abstract: A brightness detection system includes an image sensor for generating imaging data formed of pixels, and a calculation unit for finding the brightness of an object by calculating the imaging data. The calculation unit is designed to execute a calculation only for selected arbitrary pixels among the pixels of the imaging data and falling within a preliminarily designated brightness detection range.

Abstract: Conductive or solder bumps are stacked between a mounted component such as a BGA device and a printed wiring substrate in a multileveled printed circuit board unit. An interposer or relay substrate is interposed between the adjacent stacked conductive bumps. The interposer substrate is made of a porous material. When any difference in the expansion is caused between the printed wiring substrate and the mounted component, one side of the interposer substrate receives a relatively smaller displacement force while the other side of the interposer substrate receives a relatively larger displacement force. A shearing stress is induced in the interposer substrate. Deformation of the porous material serves to absorb the shearing stress in the interposer substrate. The conductive bumps bonded on one side of the interposer substrate as well as the conductive bumps bonded on the other side of the interposer substrate may be relieved from a shearing stress.

Abstract: Conductive or solder bumps are stacked between a mounted component such as a BGA device and a printed wiring substrate in a multileveled printed circuit board unit. An interposer or relay substrate is interposed between the adjacent stacked conductive bumps. The interposer substrate is made of a porous material. When any difference in the expansion is caused between the printed wiring substrate and the mounted component, one side of the interposer substrate receives a relatively smaller displacement force while the other side of the interposer substrate receives a relatively larger displacement force. A shearing stress is induced in the interposer substrate. Deformation of the porous material serves to absorb the shearing stress in the interposer substrate. The conductive bumps bonded on one side of the interposer substrate as well as the conductive bumps bonded on the other side of the interposer substrate may be relieved from a shearing stress.

Abstract: A method for altering a circuit pattern of a printed-circuit board includes the steps of removing a portion of the printed-circuit board so that the circuit pattern inside the printed-circuit board is exposed, and connecting an exposed portion of the circuit pattern to another portion of the printed-circuit board by a conductive body so that a circuit path is formed between the exposed portion of the circuit pattern and the other portion of the printed-circuit board.

Abstract: Conductive or solder bumps are stacked between a mounted component such as a BGA device and a printed wiring substrate in a multileveled printed circuit board unit. An interposer or relay substrate is interposed between the adjacent stacked conductive bumps. The interposer substrate is made of a porous material. When any difference in the expansion is caused between the printed wiring substrate and the mounted component, one side of the interposer substrate receives a relatively smaller displacement force while the other side of the interposer substrate receives a relatively larger displacement force. A shearing stress is induced in the interposer substrate. Deformation of the porous material serves to absorb the shearing stress in the interposer substrate. The conductive bumps bonded on one side of the interposer substrate as well as the conductive bumps bonded on the other side of the interposer substrate may be relieved from a shearing stress.

Abstract: Conductive or solder bumps are stacked between a mounted component such as a BGA device and a printed wiring substrate in a multileveled printed circuit board unit. An interposer or relay substrate is interposed between the adjacent stacked conductive bumps. The interposer substrate is made of a porous material. When any difference in the expansion is caused between the printed wiring substrate and the mounted component, one side of the interposer substrate receives a relatively smaller displacement force while the other side of the interposer substrate receives a relatively larger displacement force. A shearing stress is induced in the interposer substrate. Deformation of the porous material serves to absorb the shearing stress in the interposer substrate. The conductive bumps bonded on one side of the interposer substrate as well as the conductive bumps bonded on the other side of the interposer substrate may be relieved from a shearing stress.

Abstract: Conductive or solder bumps are stacked between a mounted component such as a BGA device and a printed wiring substrate in a multileveled printed circuit board unit. An interposer or relay substrate is interposed between the adjacent stacked conductive bumps. The interposer substrate is made of a porous material. When any difference in the expansion is caused between the printed wiring substrate and the mounted component, one side of the interposer substrate receives a relatively smaller displacement force while the other side of the interposer substrate receives a relatively larger displacement force. A shearing stress is induced in the interposer substrate. Deformation of the porous material serves to absorb the shearing stress in the interposer substrate. The conductive bumps bonded on one side of the interposer substrate as well as the conductive bumps bonded on the other side of the interposer substrate may be relieved from a shearing stress.

Abstract: An Al—Mg—Si—Cu aluminum alloy plate excelling in strength and formability and exhibiting improved filiform corrosion resistance which is suitably used for automotive body panels. The aluminum alloy plate contains 0.25-0.6% of Mg (mass %, hereinafter the same), 0.9-1.1% of Si, 0.6-1.0% of Cu, and at least one of 0.20% or less of Mn and 0.10% or less of Cr, with the balance consisting of Al and impurities, wherein the number of Q phases (Cu—Mg—Si—Al phases) with a size of 2 &mgr;m or more in diameter present in a matrix is 150 per mm2 or more. The aluminum alloy plate is fabricated by homogenizing an ingot of an aluminum alloy having the above composition at 530° C. or more, cooling the ingot to 450° C. or less at a cooling rate of 30° C./hour or less, hot-rolling the ingot, cold-rolling the hot-rolled product, and providing the cold-rolled product with a solution heat treatment.

Abstract: An aluminum alloy plate for an automobile has a chemical composition containing 0.8 to 1.5% by mass of Si, 0.4 to 0.7% by mass of Mg and 0.5 to 0.8% by mass of Cu. The crystal grain size is 10 to 40 &mgr;m. Cu content obtained by analyzing the outermost surface of the aluminum alloy with an oxide film according to X-ray photoelectron spectroscopy (XPS) is {fraction (1/10)} to ½ of the Cu content of the bulk of the aluminum alloy plate.

Abstract: A method for altering a circuit pattern of a printed-circuit board includes the steps of removing a portion of the printed-circuit board so that the circuit pattern inside the printed-circuit board is exposed, and connecting an exposed portion of the circuit pattern to another portion of the printed-circuit board by a conductive body so that a circuit path is formed between the exposed portion of the circuit pattern and the other portion of the printed-circuit board.

Abstract: A method for altering a circuit pattern of a printed-circuit board includes the steps of removing a portion of the printed-circuit board so that the circuit pattern inside the printed-circuit board is exposed, and connecting an exposed portion of the circuit pattern to another portion of the printed-circuit board by a conductive body so that a circuit path is formed between the exposed portion of the circuit pattern and the other portion of the printed-circuit board.

Abstract: A method for altering a circuit pattern of a printed-circuit board includes the steps of removing a portion of the printed-circuit board so that the circuit pattern inside the printed-circuit board is exposed, and connecting an exposed portion of the circuit pattern to another portion of the printed-circuit board by a conductive body so that a circuit path is formed between the exposed portion of the circuit pattern and the other portion of the printed-circuit board.

Abstract: An aluminum alloy plate for an automobile has a chemical composition containing 0.8 to 1.5% by mass of Si, 0.4 to 0.7% by mass of Mg and 0.5 to 0.8% by mass of Cu. The crystal grain size is 10 to 40 &mgr;m. Cu content obtained by analyzing the outermost surface of the aluminum alloy with an oxide film according to X-ray photoelectron spectroscopy (XPS) is {fraction (1/10)} to ½ of the Cu content of the bulk of the aluminum alloy plate.

Abstract: An Al—Mg—Si—Cu aluminum alloy plate excelling in strength and formability and exhibiting improved filiform corrosion resistance which is suitably used for automotive body panels. The aluminum alloy plate contains 0.25-0.6% of Mg (mass %, hereinafter the same), 0.9-1.1% of Si, 0.6-1.0% of Cu, and at least one of 0.20% or less of Mn and 0.10% or less of Cr, with the balance consisting of Al and impurities, wherein the number of Q phases (Cu—Mg—Si—Al phases) with a size of 2 &mgr;m or more in diameter present in a matrix is 150 per mm2 or more. The aluminum alloy plate is fabricated by homogenizing an ingot of an aluminum alloy having the above composition at 530° C. or more, cooling the ingot to 450° C. or less at a cooling rate of 30° C./hour or less, hot-rolling the ingot, cold-rolling the hot-rolled product, and providing the cold-rolled product with a solution heat treatment.