Abstract: A semiconductor device of an embodiment includes a first electrode, a second electrode, a first oxide semiconductor layer between the first electrode and the second electrode, the first oxide semiconductor layer containing in, Zn, and a first metal element, and the first metal element being at least one metal of Ga, Mg, or Mn, a second oxide semiconductor layer between the first oxide semiconductor layer and the second electrode, the second oxide semiconductor layer containing In, Zn, and the first metal element, a third oxide semiconductor layer between the first oxide semiconductor layer and the second oxide semiconductor layer, the third oxide semiconductor layer containing in, Zn, and a second metal element, the second metal element being at least one metal of Al, Hf, La, Sn, Ta, Ti, W, Y, or Zr, a gate electrode facing the third oxide semiconductor layer, and a gate insulating.

Abstract: An object of the present invention is to ascertain parts of an object that are approachable by finger portions of a hand mechanism. In an image information processing device, a housing container is retrieved from an image by using a first retrieval frame, and an object is retrieved from the image by using a second retrieval frame. A plurality of determination points are set in advance on the second retrieval frame, and a predetermined approach direction is set for each determination point. A determination is then made as to whether or not the finger portions of the hand mechanism can be caused to approach parts of one object, existing within the second retrieval frame, that correspond respectively to the determination points set on the second retrieval frame from the predetermined approach directions set in relation to the determination points.

Abstract: A first burying layer burying a side of a first ridge structure is formed by selective growth using a first selective growth mask and a third selective growth mask. The first burying layer is formed by regrowth from a surface of a second semiconductor layer on a side of the first ridge structure. At the same time, by selective growth using a second selective growth mask and a fourth selective growth mask, a second burying layer burying a side of a second ridge structure is formed. The second burying layer is formed by regrowth from a surface of a fourth semiconductor layer on a side of the second ridge structure.

Abstract: A semiconductor laser is provided with: an active layer that excites a transverse electric (TE) mode and a transverse magnetic (TM) mode of light and constitutes at least a part of a resonator guiding the TE mode and the TM mode of light; and a diffraction grating as a frequency difference setting structure that sets the difference in oscillation frequency between the TE mode and the TM mode of light higher than a relaxation-oscillation frequency.

Abstract: In an optical device, a first semiconductor layer and a second semiconductor layer are formed to be thinner than a core, an active layer has a shape with an end in a waveguide direction tapers toward a tip end, the first semiconductor layer having a trapezoidal shape with a width thereof decreases toward a side of a third semiconductor layer from a side of the core in a plan view and a width thereof decreases as one end in the waveguide direction recedes from a central portion of the active region, and the second semiconductor layer having a trapezoidal shape with a width thereof decreases toward a side of a fourth semiconductor layer from the side of the core in a plan view and a width thereof decreases as one end in the waveguide direction recedes from the central portion of the active region.

Abstract: A direct modulation laser includes a distributed feedback type laser active region and an optical feedback region optically connected to one end of the laser active region in a waveguide direction. The direct modulation laser performs laser oscillation by using photon-photon resonance (PPR) that occurs depending on a frequency difference between a frequency of light generated (oscillated) in the laser active region and a frequency of an FP mode in the optical feedback region.

Abstract: A semiconductor optical device includes a light emitting layer that emits light in a state of current injection; an optical waveguide in which a width or a thickness in an extending direction (y) of the light emitting layer varies along the extending direction; and a uniform diffraction grating having constant cycle, width and depth, wherein the light emitting layer, the optical waveguide and the uniform diffraction grating are arranged at positions where the light emitting layer, the optical waveguide, and the uniform diffraction grating are optically coupled to one another, the uniform diffraction grating is arranged above the light emitting layer, the optical waveguide is arranged below the light emitting layer, and the optical waveguide includes, in the extending direction, a first portion having a predetermined width, a second portion having a larger width than the width of the first portion, and a third portion having the same width as the width of the first portion.

Abstract: An enclosing-sealing apparatus includes a flap opener that opens a flap of an envelope while the envelope is conveyed to an enclosing position. A first envelope detector is disposed upstream from the flap opener in an envelope conveyance direction and detects both ends of the envelope in the envelope conveyance direction. A second envelope detector is disposed downstream from the flap opener in the envelope conveyance direction and detects both ends of the envelope in the envelope conveyance direction in an open state in which the flap opens. A controller determines the open state of the flap based on a first detection result sent from the first envelope detector and a second detection result sent from the second envelope detector. The controller performs troubleshooting for enclosing the enclosure into the envelope if the controller determines that the open state of the flap is faulty.

Abstract: An enclosing apparatus for enclosing an enclosure into an envelope at an enclosing position includes a conveyance roller that conveys the envelope to the enclosing position and an envelope conveyance path through which the envelope is conveyed. An enclosing support is disposed in the envelope conveyance path and supports enclosing of the enclosure into the envelope. The enclosing support retracts a flap of the envelope from the envelope conveyance path while the conveyance roller conveys the envelope to the enclosing position.

Abstract: An envelope processing apparatus for enclosing an enclosure into an envelope conveyed to an enclosing position includes a conveyance roller that conveys the envelope to the enclosing position. A first envelope length calculator calculates a first envelope length of the envelope in an envelope conveyance direction in which the envelope is conveyed in a close state in which a flap of the envelope closes. A flap opener opens the flap while the conveyance roller conveys the envelope. A second envelope length calculator calculates a second envelope length of the envelope in the envelope conveyance direction in an open state in which the flap opens. A controller calculates a flap length of the flap in the envelope conveyance direction based on the first envelope length and the second envelope length. The controller controls enclosing of the enclosure into the envelope based on the flap length.

Abstract: A core, constituted by an amorphous undoped semiconductor (i type), which is formed on a lower clad layer, and a p-type layer and an n-type layer which are disposed on the lower clad layer with the core interposed therebetween and are formed in contact with the core are provided. The core is formed to be thicker than the p-type layer and the n-type layer. The p-type layer and the n-type layer are constituted by single crystal silicon.

Abstract: A semiconductor memory device includes a first semiconductor layer, first conductive layers, electric charge accumulating portions, a first conductivity-typed second semiconductor layer, a first wiring, a second conductivity-typed third semiconductor layer, and a second conductive layer. The first semiconductor layer extends in a first direction. First conductive layers are arranged in the first direction and extend in a second direction. Electric charge accumulating portions are disposed between the first semiconductor layer and first conductive layers. The second semiconductor layer is connected to one end of the first semiconductor layer. The first wiring is connected to the first semiconductor layer via the second semiconductor layer. The third semiconductor layer is connected to a side surface in a third direction of the first semiconductor layer. The second conductive layer extends in the second direction and is connected to the first semiconductor layer via the third semiconductor layer.

Abstract: A resin composition containing (A) an organopolysiloxane having a glycidyloxy group, and (B) at least one selected from the group consisting of a triarylalkoxysilane, a diaryldialkoxysilane, a hydrolysate thereof and a partially hydrolyzed/condensed product thereof is provided. The resin composition may further contain (C) a ?-dicarbonyl compound. The resin composition may further contain (D) an organic compound having one or more of an epoxy group, an oxetanyl group and a vinyl ether group. The resin composition may be mixed with (E) an organoaluminum compound and/or organotitanium compound and be cured.

Abstract: A semiconductor device includes a semiconductor layer containing metal atoms, a charge storage layer provided on a surface of the semiconductor layer via a first insulating film, and an electrode layer provided on a surface of the charge storage layer via a second insulating film. The thickness of the first insulating film is 5 nm or more and 10 nm or less. The concentration of the metal atoms in the semiconductor layer is 5.0×1017 [EA/cm3] or higher and 1.3×1020 [EA/cm3] or lower.

Abstract: In one embodiment, a semiconductor storage device includes a stacked body in which a plurality of conducting layers are stacked through a plurality of insulating layers in a first direction, a semiconductor layer penetrating the stacked body, extending in the first direction and including metal atoms, and a memory film including a first insulator, a charge storage layer and a second insulator that are provided between the stacked body and the semiconductor layer. The semiconductor layer surrounds a third insulator penetrating the stacked body and extending in the first direction, and at least one crystal grain in the semiconductor layer has a shape surrounding the third insulator.

Abstract: An active region formed on a substrate, and a p-type region and an n-type region formed so as to sandwich the active region are provided. The p-type region and the n-type region are formed so as to sandwich the active region. Both edges of a first side being a side of the p-type region and facing a first side surface of the active region are rounded in a direction separating from the active region. Also, both edges of a second side being a side of the n-type region and facing a second side surface of the active region are rounded in a direction separating from the active region.

Abstract: There are provided a first cladding layer formed on a Si substrate, a first core made of Si and formed on the first cladding layer, and a second cladding layer formed on the first cladding layer and covering the first core Additionally, this optical device includes a waveguide type laser formed over the second cladding layer, a second core made of InP and formed continuously to the laser, and a third cladding layer formed on the second cladding layer and covering the laser and the second core.

Abstract: A semiconductor storage device includes a first conductive layer that extends in a first direction; a second conductive layer that extends in the first direction and is arranged with the first conductive layer in a second direction; a first insulating layer that is provided between the first conductive layer and the second conductive layer; a semiconductor layer that extends in the second direction and faces the first conductive layer, the second conductive layer, and the first insulating layer in a third direction; a first charge storage layer that is provided between the first conductive layer and the semiconductor layer; a second charge storage layer that is provided between the second conductive layer and the semiconductor layer; a first high dielectric constant layer that is provided between the first conductive layer and the first charge storage layer; and a second high dielectric constant layer provided between the second conductive layer and the second charge storage layer.

Abstract: According to one embodiment, a semiconductor storage device includes a plurality of electrode films on a substrate, spaced from one another in a first direction. A charge storage film is provided on a side face the electrode films via a first insulating film. A semiconductor film is provided on a side face of the charge storage film via a second insulating film. The charge storage film includes a plurality of insulator regions contacting the first insulating film, a plurality of semiconductor or conductor regions provided between the insulator regions and another insulator region.

Abstract: A rim portion of a vehicle wheel has an outer flange portion. In a region of the outer flange portion, a space portion between spoke portions is disposed on a radial-direction inner side, a first inclined surface and a second inclined surface are provided. The first inclined surface is provided on an axial-direction outer side of an outer flange outer circumferential portion. The second inclined surface is on an axial-direction outer side of an outer flange inner circumferential portion. The first inclined surface is formed to incline from the axial-direction outer side toward an axial-direction inner side as the first inclined surface extends from a radial-direction outer side end toward the radial-direction inner side. The second inclined surface is a surface formed to incline from the axial-direction inner side toward the axial-direction outer side as the second inclined surface extends from the radial-direction outer side toward the radial-direction inner side.