Patents by Inventor Shinji Mizuno
Shinji Mizuno has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20060049840Abstract: A test probe having a conductive part electrically connected to terminals of a test-object device, including: a silicon substrate; a protrusion made of resin provided on the silicon substrate; a first conductive part which is provided on the protrusion and comes in contact with the terminals; and a second conductive part which is provided in a region other than a region having the protrusion on the silicon substrate and is electrically connected to the first conductive part.Type: ApplicationFiled: July 19, 2005Publication date: March 9, 2006Inventors: Haruki Ito, Shinji Mizuno, Koji Yamaguchi
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Publication number: 20060040094Abstract: An electronic component substrate 1-1 includes an insulating base 10 and a flexible circuit board 20 mounted on the insulating base 10. The flexible circuit board 20 is a synthetic resin film provided thereon with terminal patterns 29 and a conductor pattern 25 whose surface is slidingly contacted with a slider. The insulating base 10 is a synthetic resin molded piece. The flexible circuit board 20 is insert-molded to the insulating base 10. The electronic component substrate 1-1 is produced by preparing the flexible circuit board 20 and first and second mold members 41 and 45 having a cavity C1 with a shape that corresponds to the external shape of the electronic component substrate 1-1. Then, the flexible circuit board 20 is accommodated in the cavity C1 between the first and second mold members 41 and 45, and a molten molding resin is filled into the cavity C1. After the filled molding resin has been solidified, the first and second mold members 41 and 45 are removed.Type: ApplicationFiled: February 5, 2004Publication date: February 23, 2006Inventors: Shinji Mizuno, Koji Mitsui, Katsutoshi Yanoshita, Shinichi Suzuki, Takashi Shinoki, Kazutaka Nakagawa, Naoki Fukuda, Kozo Morita, Daisuke Makino
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Patent number: 6958183Abstract: A first film plate 20 and a second film plate 40, each made of flexible resin film, are attached to a top surface and a bottom surface of a key top 30 made of mold-resin, respectively, so as to cover the key top 30. The first film plate 20 is pressed upward to form a recessed portion 23, the key top 30 is molded within this recessed portion 23. The second film plate 40 is arranged on the bottom surface of the key top 30. All of the first film plate 20, the key top 30, and the second film plate 40 are transparent. Decorative layers 21 and 41 are formed on the first film plate 20 and the second film plate 40, respectively.Type: GrantFiled: February 13, 2002Date of Patent: October 25, 2005Assignee: Teikoku Tsushin Kogyo Co., Ltd.Inventors: Tatsuya Okamura, Kimitane Kimura, Yasuo Kojima, Atsushi Hari, Shinji Mizuno
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Publication number: 20050145471Abstract: A first film plate 20 and a second film plate 40, each made of flexible resin film, are attached to a top surface and a bottom surface of a key top 30 made of mold-resin, respectively, so as to cover the key top 30. The first film plate 20 is pressed upward to form a recessed portion 23, the key top 30 is molded within this recessed portion 23. The second film plate 40 is arranged on the bottom surface of the key top 30. All of the first film plate 20, the key top 30, and the second film plate 40 are transparent. Decorative layers 21 and 41 are formed on the first film plate 20 and the second film plate 40, respectively.Type: ApplicationFiled: March 4, 2005Publication date: July 7, 2005Inventors: Tatsuya Okamura, Kimitane Kimura, Yasuo Kojima, Atsushi Hari, Shinji Mizuno
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Publication number: 20050116794Abstract: A resonator device includes a resonator supported by a substrate as a base. The resonator is connected to a wire extending from the substrate by wire bonding so as to be suspended in midair and supported over the supporting substrate.Type: ApplicationFiled: November 23, 2004Publication date: June 2, 2005Inventor: Shinji Mizuno
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Publication number: 20020114930Abstract: A first film plate 20 and a second film plate 40, each made of flexible resin film, are attached on a top surface and an under surface of a key top 30 made of mold-resin respectively so as to cover the key top 30. The first film plate 20 is pressed upward to form a recessed portion 23, the key top 30 is molded within this recessed portion 23 and further, the second film plate 40 is arranged on the under surface side of said key top 30. All of the first film plate 20, the key top 30 and the second film plate 40 are transparent. Decorative layers 21 and 41 are formed on the first film plate 20 and the second film plate 40 respectively.Type: ApplicationFiled: February 13, 2002Publication date: August 22, 2002Inventors: Tatsuya Okamura, Kimitane Kimura, Yasuo Kojima, Atsushi Hari, Shinji Mizuno
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Patent number: 5111363Abstract: A mount for electronic parts includes a flexible board made of a thermoplastic resin film and having electrically conductive patterns formed thereon, and an electrically conductive bonding agent for bonding terminals of the electronic parts to the conductive patterns. Some or all of the electronic parts to be mounted are resin-molded to the flexible board so as to be integrated therewith.Type: GrantFiled: June 12, 1989Date of Patent: May 5, 1992Assignee: Teikoku Tsushin Kogyo Co., Ltd.Inventors: Nobuyuki Yagi, Jiroh Inagaki, Kozo Morita, Yosutoshi Kaku, Shinji Mizuno, Akiko Yamanaka
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Patent number: 5071611Abstract: A molded resin casing of an electronic part equipped with a flat cable and internally accommodating a board on which are formed electric conductor patterns slidingly contacted by contacts of a slider of the electronic part. A flexible board having various electric conductor patterns formed on a synthetic resin film is used as the board, the flexible board is formed integral with a flat cable including a synthetic resin film on which are formed electric conductor patterns electrically connected to the aforementioned various electric conductor patterns, and when the molded resin casing is molded by injecting a molten synthetic resin, the flexible board is inserted in such a manner that the electric conductor patterns are exposed within the casing, thereby integrating the flexible board and synthetic resin casing, with the flat cable extending outwardly from a side portion of the synthetic resin casing.Type: GrantFiled: December 7, 1989Date of Patent: December 10, 1991Assignee: Teikoku Tsuhin Kogyo Co., Ltd.Inventors: Nobuyuki Yagi, Jiroh Inagaki, Kozo Morita, Yasutoshi Kaku, Nobuyuki Kikuchi, Shinji Mizuno
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Patent number: 5051069Abstract: A multi-cylinder piston-operated compressor having a cylinder consisting of an axially combined cylinder block closed at both axial ends by front and rear housings having suction and discharge chambers therein, a reciprocative piston mechanism arranged in the cylinder for sucking, compressing, and discharging a refrigerant gas, and a connecting flange from which the refrigerant gas after compression is sent toward an air-conditioning circuit. The cylinder block and the connecting flange define a muffling chamber for deadening pulsation in the pressure of the discharged refrigerant gas.Type: GrantFiled: February 28, 1990Date of Patent: September 24, 1991Assignee: Kabushiki Kaisha Toyoda Jidoshokki SeisakushoInventors: Hayato Ikeda, Tetsuo Yoshida, Shinji Mizuno
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Patent number: 4978491Abstract: Disclosed is a molded resin casing of a rotary- or sliding-type electronic part internally accommodating a board on which are formed electric conductor patterns slidingly contacted by contacts of a slider of the electronic part, wherein a flexible board having the electric conductor patterns formed on a film comprising a synthetic resin material is used as the board, and the flexible board is inserted inside the synthetic resin casing in such a manner that the electric conductor patterns are exposed to the interior of the casing.Type: GrantFiled: September 13, 1988Date of Patent: December 18, 1990Assignee: Teikoku Tsushin Kogyo Co., Ltd.Inventors: Nobuyuki Yagi, Jiroh Inagaki, Kozo Morita, Yasutoshi Kaku, Nobuyuki Kikuchi, Shinji Mizuno
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Patent number: 4935718Abstract: A molded resin casing of a rotary- or sliding-type electronic part internally accommodating a board on which are formed electric conductor patterns slidingly contacted by contacts of a slider of the electronic part, wherein a flexible board having the electric conductor patterns formed on a film comprising a synthetic resin material is used as the board, and the flexible board is inserted inside the synthetic resin casing in such as manner that the electric conductor patterns are exposed to the interior of the casing.Type: GrantFiled: August 22, 1988Date of Patent: June 19, 1990Assignee: Teikoku Tsushin Kogyo Co., Ltd.Inventors: Nobuyuki Yagi, Jiroh Inagaki, Kozo Morita, Yasutoshi Kaku, Nobuyuki Kikuchi, Shinji Mizuno
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Patent number: 4928082Abstract: A molded resin casing of an electronic part equipped with a flexible flat cable and internally accommodating a board on which are formed electric conductor patterns slidingly contacted by contacts of a slider of the electronic part, includes a flexible board having various electric conductor patterns formed on a synthetic resin film used as the board. The flexible board is formed integrally with a flexible flat cable comprising a synthetic resin film on which are formed electric conductor patterns electrically connected to the aforementioned various electric conductor patterns. When the molded resin casing is molded by injecting a molten synthetic resin, the flexible board is inserted in such a manner that the electric conductor patterns are exposed within the casing, thereby integrating the flexible board and synthetic resin casing, with the flexible flat cable extending outwardly from a side portion of the synthetic resin casing.Type: GrantFiled: August 22, 1988Date of Patent: May 22, 1990Assignee: Teikoku Tsushin Kogyo Co., Ltd.Inventors: Nobuyuki Yagi, Jiro Inagaki, Kozo Morita, Yasutoshi Kaku, Nobuyuki Kikuchi, Shinji Mizuno
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Patent number: 4875911Abstract: Apparatus for separating gaseous mixtures comprising a pair of separator vessels each packed with adsorbent material such as silica gel, activated alumina or molecular sieves or absorbent material such as lithium chloride with serving as separating material, wherein a separating cycle during which air containing water vapor or gaseous mixture consisting of two or more different components such as nitrogen and oxygen is fed into one of the separator vessels to remove one or more components from the mixture and a regenerating cycle during which the processed gaseous mixture is partially fed into the other separator vessel to remove the quantity of components previously adsorbed or adsorbed by the separating material present within this separator vessel and thereby to regenerate the separating material are alternately repeated and wherein there are provided regeneration promoting separator vessels for further removal of the components to a lower concentration.Type: GrantFiled: July 15, 1987Date of Patent: October 24, 1989Assignee: CKD Kabushiki KaishaInventors: Shinji Mizuno, Humio Kawato, Kazuyoshi Hanazawa, Tatsuaki Aoyama, Yoshinari Ogasawara
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Patent number: 4815981Abstract: A flexible printed circuit board terminal structure includes a flexible printed circuit board composed of electrically conductive patterns formed on a flexible insulative film of a thermoplastic synthetic resin by the screen-printing of an electrically conductive coating, and an insulative coating of synthetic resin disposed on the insulative film on a portion thereof except for a terminal section defined at one edge. Metallic terminal members are placed on the electrically conductive patterns at the printed circuit board terminal section directly or through the intermediary of an electrically conductive adhesive, a terminal fixing film made of a thermoplastic synthetic resin having the same properties as the thermoplastic insulative film is placed on the terminal section from above the metallic terminal members, and predetermined portions of the thermoplastic insulative film and terminal fixing film, with the exception of portions at which the metallic terminal members are situated, are thermally fused.Type: GrantFiled: July 15, 1987Date of Patent: March 28, 1989Assignee: Teikoku Tsushin Kogyo Co., Ltd.Inventor: Shinji Mizuno
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Patent number: 4746275Abstract: A multi-piston swash plate type compressor with an internal lubricating arrangement for an air conditioning system used in a vehicle such as an automobile comprises a cylinder block body having a swash plate chamber formed therein for receiving a swash plate, and cylinder bores formed therein for receiving pistons. The compressor has a suction chamber which is fed with a refrigerant including a lubrication oil from an evaporator of the air conditioning system, and a discharge chamber which feeds the compressed refrigerant to a condenser of the air conditioning system. The suction and discharge chambers are communicated with each of the cylinder bores through valves. Passages are formed in the cylinder block body for feeding the refrigerant from the swash plate member to the suction chamber in such a manner that the refrigerant flow is guided to positively lubricate movable parts included in the cylinder block body as a component element of the compressor.Type: GrantFiled: December 22, 1986Date of Patent: May 24, 1988Assignee: Kabushiki Kaisha Toyoda Jidoshokki SeisakushoInventors: Hidekazu Iwamori, Makoto Ohno, Hideo Mori, Shinji Mizuno