Patents by Inventor Shinji Murakami

Shinji Murakami has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20100106631
    Abstract: The present invention provides a battery charger capable of charging a plurality of secondary batteries which are used in different types of apparatuses, such as an electric vehicle and a mobile power supply unit, in a simultaneous or concurrent manner without largely occupying an installation space on the ground. A DC power supply section 22 includes a plurality of DC stabilized power supply circuits each operable to supply an output according to required electric power, therefrom in an independent manner. Specifically, based on information from each of a plurality of secondary batteries, and information set up/input through a setup/input section, one of or a combination of two or more of the DC stabilized power supply circuits is selected for each of the secondary batteries.
    Type: Application
    Filed: February 8, 2008
    Publication date: April 29, 2010
    Applicant: KYUSHU ELECTRIC POWER CO., INC.
    Inventors: Koji Kurayama, Kazuyuki Adachi, Shinji Murakami, Yoshihiro Wada, Hiroyuki Shibata
  • Publication number: 20090166458
    Abstract: A fishing spinning reel includes a bail support member having a line guide portion which is supported in such a manner as to rotate reversibly between a line winding position and a line releasing position on an arm portion of a rotor linked with a handle provided on a reel main body in such a manner as to rotate as a result of the handle being operated to turn, and a switching lever which can be switched between an anti-reverse state in which the rotor is prevented from rotating backwards and a rotation enabling state in which the rotor is enabled to rotate forwards and backwards. The bail support member is restricted from reversing from the line winding position to the line releasing position when the switching lever is in the rotation enabling state.
    Type: Application
    Filed: December 22, 2008
    Publication date: July 2, 2009
    Applicant: DAIWA SEIKO, INC.
    Inventors: Shinji MURAKAMI, Takashi SHIBATA
  • Patent number: 7398939
    Abstract: An electric fishing reel has a power transmission mechanism for transmitting rotational driving force based on a drive motor and a manual handle to a spool; and a clutch mechanism for switching the power transmission mechanism between a power transmitting state and a power cutoff state. The power transmission mechanism includes a planetary gear mechanism disposed on the drive motor; a first rotor with which the planetary gear mesh; a second rotor which is driven and coupled to the first rotor through a belt; and a clutch actuating member fitted and rotationally locked in the second rotor to be movable in an axial direction and is moved in the axial direction. An engaging portion of the clutch actuating member is capable of switching the power transmission mechanism between a power transmitting state and a power cutoff state by engaging with or disengaging from a retaining portion of the spool.
    Type: Grant
    Filed: September 12, 2007
    Date of Patent: July 15, 2008
    Assignee: Daiwa Seiko, Inc.
    Inventors: Takashi Terauchi, Shinji Murakami
  • Publication number: 20080073455
    Abstract: An electric fishing reel has a power transmission mechanism for transmitting rotational driving force based on a drive motor and a manual handle to a spool; and a clutch mechanism for switching the power transmission mechanism between a power transmitting state and a power cutoff state. The power transmission mechanism includes a planetary gear mechanism disposed on the drive motor; a first rotor with which the planetary gear mesh; a second rotor which is driven and coupled to the first rotor through a belt; and a clutch actuating member fitted and rotationally locked in the second rotor to be movable in an axial direction and is moved in the axial direction. An engaging portion of the clutch actuating member is capable of switching the power transmission mechanism between a power transmitting state and a power cutoff state by engaging with or disengaging from a retaining portion of the spool.
    Type: Application
    Filed: September 12, 2007
    Publication date: March 27, 2008
    Applicant: DAIWA SEIKO, INC
    Inventors: Takashi TERAUCHI, Shinji MURAKAMI
  • Publication number: 20070105466
    Abstract: A fire-retardant composite structure which includes a balsa core layer, fiberglass reinforcing layers attached to either side of the core layer, a PTFE porous layer attached to one of the fiberglass layers or to a fiberglass veil, and a gel coat layer over the PTFE porous layer. Matrix resin bonds the fiberglass layers to the balsa core member, as well as the PTFE porous layer to the fiberglass layers by impregnation.
    Type: Application
    Filed: December 16, 2004
    Publication date: May 10, 2007
    Inventors: Shinji Murakami, Christopher Snowden Moore
  • Patent number: 7140855
    Abstract: An internal mandrel for cooling a tubular thin film is disclosed where an air layer is eliminated in the lower side cooler of the internal mandrel, so that the tubular thin film can be continuously and stably produced. In the internal mandrel for directly cooling the tubular thin film while using external circularly shaped cooling tank where the tubular thin film is downwardly extruded through a circular slit of the die, the internal mandrel is characterized in that coolant for cooling a lower most part of the internal mandrel is flown in the countercurrent direction in the internal mandrel to the tubular thin film.
    Type: Grant
    Filed: January 21, 2003
    Date of Patent: November 28, 2006
    Assignee: Kohjin Co., Ltd.
    Inventors: Koji Watanabe, Shinji Murakami, Hisashi Kojoh
  • Patent number: 7070368
    Abstract: A machining feed rate for machining a workpiece portion to be machined by a machining tool based upon a machining program is set by reading a data of the workpiece portion, by sectionalizing the workpiece portion in an area corresponding to a workpiece shape of the workpiece portion, and by determining a shape change point based upon a workpiece shape of the workpiece portion. The machining feed rate is set for each area and for each shape change point with reference to a predetermined parameter corresponding to an attribute of the each sectionalized area and corresponding to an attribute of the each determined shape change point.
    Type: Grant
    Filed: September 27, 2002
    Date of Patent: July 4, 2006
    Assignee: Toyoda Koki Kabushiki Kaisja
    Inventors: Shinji Murakami, Kazuya Hattori, Yoshihiko Yamada, Tadashi Otani, Atsushi Saito
  • Publication number: 20050136761
    Abstract: A fire-retardant composite structure which includes a balsa core layer, fiberglass reinforcing layers attached to either side of the core layer, a PTFE porous layer attached to one of the fiberglass layers or to a fiberglass veil, and a gel coat layer over the PTFE porous layer. Matrix resin bonds the fiberglass layers to the balsa core member, as well as the PTFE porous layer to the fiberglass layers by impregnation.
    Type: Application
    Filed: October 29, 2004
    Publication date: June 23, 2005
    Applicant: DAIKIN INDUSTRIES, LTD.
    Inventors: Shinji Murakami, Christopher Moore
  • Publication number: 20050100623
    Abstract: The object of the present invention is to provide an internal mandrel for cooling a tubular thin film where air layer is not remaining in the lower side cooler of the internal mandrel, so that the tubular thin film can be continuously and stably produced. In the internal mandrel for directly cooling the tubular thin film while using external circularly shaped cooling tank where the tubular thin film is downwardly extruded through a circular slit of the die, the internal mandrel is characterized in that coolant for cooling a lower most part of the internal mandrel is flown in such a direction as to oppose to the tubular thin film.
    Type: Application
    Filed: January 21, 2003
    Publication date: May 12, 2005
    Applicant: Kohjin Co Ltd
    Inventors: Koji Watanabe, Shinji Murakami, Hisashi Kojoh
  • Publication number: 20050006749
    Abstract: A low elasticity layer (20) having an opening in an electrode arranging area where element electrodes are disposed is provided on a main surface of a semiconductor substrate (10). On the low elasticity layer (20), lands (32) serving as external electrodes are disposed, and pads (30) on the element electrodes, the lands (32) and metal wires (31) for connecting them are integrally formed as a metal wiring pattern (33). A solder resist film (50) having an opening for exposing a part of each land (32) is formed, and a metal ball (40) is provided on the land (32) in the opening. The low elasticity layer (20) absorbs thermal stress and the like caused in heating or cooling the semiconductor device, so as to prevent disconnection of the metal wires (31).
    Type: Application
    Filed: August 12, 2004
    Publication date: January 13, 2005
    Applicant: Matsushita Electric Industrial Co., Ltd.
    Inventors: Nozomi Shimoishizaka, Ryuichi Sahara, Yoshifumi Nakamura, Takahiro Kumakawa, Shinji Murakami, Yutaka Harada
  • Patent number: 6812573
    Abstract: A low elasticity layer (20) having an opening in an electrode arranging area where element electrodes are disposed is provided on a main surface of a semiconductor substrate (10). On the low elasticity layer (20), lands (32) serving as external electrodes are disposed, and pads (30) on the element electrodes, the lands (32) and metal wires (31) for connecting them are integrally formed as a metal wiring pattern (33). A solder resist film (50) having an opening for exposing a part of each land (32) is formed, and a metal ball (40) is provided on the land (32) in the opening. The low elasticity layer (20) absorbs thermal stress and the like caused in heating or cooling the semiconductor device, so as to prevent disconnection of the metal wires (31).
    Type: Grant
    Filed: June 25, 2001
    Date of Patent: November 2, 2004
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Nozomi Shimoishizaka, Ryuichi Sahara, Yoshifumi Nakamura, Takahiro Kumakawa, Shinji Murakami, Yutaka Harada
  • Patent number: 6772953
    Abstract: An electronic circuit module formed of an antenna coil and an integrated circuit provided on a circuit board is provided inside a hollow resin case formed of a first part and a second part. A first slit leading into the hollow portion is provided in one side face of the resin case formed of the first and second parts joined to each other. Since the electronic circuit module is not exposed to high temperatures and high pressure during the manufacturing process, defects such as the breakage of the integrated circuit or the disconnection of the antenna coil can be avoided. Since the slit leading into the hollow portion is provided, the hollow portion does not swell by the temperature increase. In addition, pinholes do not tend to be formed during the joining of the first and second parts. Thus, a contactless data carrier with an excellent electrostatic withstand voltage characteristic can be provided.
    Type: Grant
    Filed: February 1, 2001
    Date of Patent: August 10, 2004
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Keiichi Iiyama, Takashi Noda, Shinji Murakami, Yutaka Harada, Takuya Oka, Masaru Tanichi
  • Patent number: 6627277
    Abstract: In an extruder for producing a polytetrafluoroethylene tube having a minimum thickness deviation by extruding a polytetrafluoroethylene paste through an annular portion formed by a core pin (30) and a die orifice (50) around it, the core pin comprises a mandrel connection end (34) which is connected to a mandrel and a die orifice outlet end (36) which is located at a die orifice outlet end, and the core pin has between the ends a portion of which cross-section perpendicular to an axial direction of the core pin has a smaller area than that of a cross-section of each end of the core pin. By using the extruder, the tube having a thickness deviation of not larger than 15% can be obtained.
    Type: Grant
    Filed: February 18, 2000
    Date of Patent: September 30, 2003
    Assignee: Daikin Industries Ltd.
    Inventors: Tatsuro Uchida, Shinji Murakami, Shoji Kawachi
  • Patent number: 6597142
    Abstract: An apparatus for setting control parameters of a machining apparatus. The setting apparatus includes a storage unit for storing a set of control parameters for each of a plurality of machining modes; an input device for selecting one of the plurality of machining modes; and a control unit for selecting a set of control parameters corresponding the selected machining mode and setting the set of control parameters as control parameters to be used for controlling the machining apparatus.
    Type: Grant
    Filed: September 21, 2001
    Date of Patent: July 22, 2003
    Assignee: Toyoda Koki Kabushiki Kaisha
    Inventors: Tetsuro Shibukawa, Akimitsu Kamiya, Kazunari Ogura, Atsuhisa Asada, Tadashi Otani, Shinji Murakami, Katsuhiro Maseki, Yoshihiko Yamada
  • Publication number: 20030118416
    Abstract: A machining feed rate for machining a workpiece portion to be machined by a machining tool based upon a machining program is set by reading a data of the workpiece portion, by sectionalizing the workpiece portion in an area corresponding to a workpiece shape of the workpiece portion, and by determining a shape change point based upon a workpiece shape of the workpiece portion. The machining feed rate is set for each area and for each shape change point with reference to a predetermined parameter corresponding to an attribute of the each sectionalized area and corresponding to an attribute of the each determined shape change point.
    Type: Application
    Filed: September 27, 2002
    Publication date: June 26, 2003
    Applicant: TOYODA KOKI KABUSHIKI KAISHA
    Inventors: Shinji Murakami, Kazuya Hattori, Yoshihiko Yamada, Tadashi Otani, Atsushi Saito
  • Publication number: 20020084763
    Abstract: An apparatus for setting control parameters of a machining apparatus. The setting apparatus includes a storage unit for storing a set of control parameters for each of a plurality of machining modes; an input device for selecting one of the plurality of machining modes; and a control unit for selecting a set of control parameters corresponding the selected machining mode and setting the set of control parameters as control parameters to be used for controlling the machining apparatus.
    Type: Application
    Filed: September 21, 2001
    Publication date: July 4, 2002
    Applicant: TOYODA KOKI KABUSHIKI KAISHA
    Inventors: Tetsuro Shibukawa, Akimitsu Kamiya, Kazunari Ogura, Atsuhisa Asada, Tadashi Otani, Shinji Murakami, Katsuhiro Maseki, Yoshihiko Yamada
  • Patent number: 6357106
    Abstract: A method for mounting parts, and an IC card and its manufacturing method. The method reduces the number of steps, increases productivity, lowers costs, and miniaturizes the chip. A first electrode of the IC chip for processing signals received from a coil is connected to an internal end of a coil pattern formed on a first substrate, and an external end of the coil pattern and a second electrode of the IC chip are connected via a jumper wire.
    Type: Grant
    Filed: February 25, 1999
    Date of Patent: March 19, 2002
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Mitsumasa Oku, Takashi Akiguchi, Shinji Murakami, Yutaka Harada, Norihito Tsukahara, Mitsunori Yokomakura, Kenichi Sato
  • Publication number: 20020026703
    Abstract: The present invention provides a method for mounting parts, and an IC card and its manufacturing method, capable of reducing the number of steps, increasing productivity, reducing in costs, and miniaturizing the chip. For this purpose, in the present invention, a first electrode (7a) of the IC chip (4) for processing signals received from a coil (3) is connected to an internal end (3b) of a coil pattern (2) formed on a first substrate (1a), and an external end (3a) of the coil pattern (2) and a second electrode (7b) of the IC chip (4) are connected via a jumper wiring means (8).
    Type: Application
    Filed: October 26, 2001
    Publication date: March 7, 2002
    Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
    Inventors: Mitsumasa Oku, Takashi Akiguchi, Shinji Murakami, Yutaka Harada, Norihito Tsukahara, Mitsunori Yokomakura, Kenichi Sato
  • Publication number: 20020017569
    Abstract: An electronic circuit module formed of an antenna coil and an integrated circuit provided on a circuit board is provided inside a hollow resin case formed of a first part and a second part. A first slit leading into the hollow portion is provided in one side face of the resin case formed of the first and second parts joined to each other. Since the electronic circuit module is not exposed to high temperatures and high pressure during the manufacturing process, defects such as the breakage of the integrated circuit or the disconnection of the antenna coil can be avoided. Since the slit leading into the hollow portion is provided, the hollow portion does not swell by the temperature increase. In addition, pinholes do not tend to be formed during the joining of the first and second parts. Thus, a contactless data carrier with an excellent electrostatic withstand voltage characteristic can be provided.
    Type: Application
    Filed: February 1, 2001
    Publication date: February 14, 2002
    Inventors: Keiichi Iiyama, Takashi Noda, Shinji Murakami, Yutaka Harada, Takuya Oka, Masaru Tanichi
  • Publication number: 20020000655
    Abstract: A low elasticity layer (20) having an opening in an electrode arranging area where element electrodes are disposed is provided on a main surface of a semiconductor substrate (10). On the low elasticity layer (20), lands (32) serving as external electrodes are disposed, and pads (30) on the element electrodes, the lands (32) and metal wires (31) for connecting them are integrally formed as a metal wiring pattern (33). A solder resist film (50) having an opening for exposing a part of each land (32) is formed, and a metal ball (40) is provided on the land (32) in the opening. The low elasticity layer (20) absorbs thermal stress and the like caused in heating or cooling the semiconductor device, so as to prevent disconnection of the metal wires (31).
    Type: Application
    Filed: August 22, 2001
    Publication date: January 3, 2002
    Inventors: Nozomi Shimoishizaka, Ryuichi Sahara, Yoshifumi Nakamura, Takahiro Kumakawa, Shinji Murakami, Yutaka Harada