Patents by Inventor Shinji Murakami
Shinji Murakami has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20100106631Abstract: The present invention provides a battery charger capable of charging a plurality of secondary batteries which are used in different types of apparatuses, such as an electric vehicle and a mobile power supply unit, in a simultaneous or concurrent manner without largely occupying an installation space on the ground. A DC power supply section 22 includes a plurality of DC stabilized power supply circuits each operable to supply an output according to required electric power, therefrom in an independent manner. Specifically, based on information from each of a plurality of secondary batteries, and information set up/input through a setup/input section, one of or a combination of two or more of the DC stabilized power supply circuits is selected for each of the secondary batteries.Type: ApplicationFiled: February 8, 2008Publication date: April 29, 2010Applicant: KYUSHU ELECTRIC POWER CO., INC.Inventors: Koji Kurayama, Kazuyuki Adachi, Shinji Murakami, Yoshihiro Wada, Hiroyuki Shibata
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Publication number: 20090166458Abstract: A fishing spinning reel includes a bail support member having a line guide portion which is supported in such a manner as to rotate reversibly between a line winding position and a line releasing position on an arm portion of a rotor linked with a handle provided on a reel main body in such a manner as to rotate as a result of the handle being operated to turn, and a switching lever which can be switched between an anti-reverse state in which the rotor is prevented from rotating backwards and a rotation enabling state in which the rotor is enabled to rotate forwards and backwards. The bail support member is restricted from reversing from the line winding position to the line releasing position when the switching lever is in the rotation enabling state.Type: ApplicationFiled: December 22, 2008Publication date: July 2, 2009Applicant: DAIWA SEIKO, INC.Inventors: Shinji MURAKAMI, Takashi SHIBATA
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Patent number: 7398939Abstract: An electric fishing reel has a power transmission mechanism for transmitting rotational driving force based on a drive motor and a manual handle to a spool; and a clutch mechanism for switching the power transmission mechanism between a power transmitting state and a power cutoff state. The power transmission mechanism includes a planetary gear mechanism disposed on the drive motor; a first rotor with which the planetary gear mesh; a second rotor which is driven and coupled to the first rotor through a belt; and a clutch actuating member fitted and rotationally locked in the second rotor to be movable in an axial direction and is moved in the axial direction. An engaging portion of the clutch actuating member is capable of switching the power transmission mechanism between a power transmitting state and a power cutoff state by engaging with or disengaging from a retaining portion of the spool.Type: GrantFiled: September 12, 2007Date of Patent: July 15, 2008Assignee: Daiwa Seiko, Inc.Inventors: Takashi Terauchi, Shinji Murakami
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Publication number: 20080073455Abstract: An electric fishing reel has a power transmission mechanism for transmitting rotational driving force based on a drive motor and a manual handle to a spool; and a clutch mechanism for switching the power transmission mechanism between a power transmitting state and a power cutoff state. The power transmission mechanism includes a planetary gear mechanism disposed on the drive motor; a first rotor with which the planetary gear mesh; a second rotor which is driven and coupled to the first rotor through a belt; and a clutch actuating member fitted and rotationally locked in the second rotor to be movable in an axial direction and is moved in the axial direction. An engaging portion of the clutch actuating member is capable of switching the power transmission mechanism between a power transmitting state and a power cutoff state by engaging with or disengaging from a retaining portion of the spool.Type: ApplicationFiled: September 12, 2007Publication date: March 27, 2008Applicant: DAIWA SEIKO, INCInventors: Takashi TERAUCHI, Shinji MURAKAMI
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Publication number: 20070105466Abstract: A fire-retardant composite structure which includes a balsa core layer, fiberglass reinforcing layers attached to either side of the core layer, a PTFE porous layer attached to one of the fiberglass layers or to a fiberglass veil, and a gel coat layer over the PTFE porous layer. Matrix resin bonds the fiberglass layers to the balsa core member, as well as the PTFE porous layer to the fiberglass layers by impregnation.Type: ApplicationFiled: December 16, 2004Publication date: May 10, 2007Inventors: Shinji Murakami, Christopher Snowden Moore
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Patent number: 7140855Abstract: An internal mandrel for cooling a tubular thin film is disclosed where an air layer is eliminated in the lower side cooler of the internal mandrel, so that the tubular thin film can be continuously and stably produced. In the internal mandrel for directly cooling the tubular thin film while using external circularly shaped cooling tank where the tubular thin film is downwardly extruded through a circular slit of the die, the internal mandrel is characterized in that coolant for cooling a lower most part of the internal mandrel is flown in the countercurrent direction in the internal mandrel to the tubular thin film.Type: GrantFiled: January 21, 2003Date of Patent: November 28, 2006Assignee: Kohjin Co., Ltd.Inventors: Koji Watanabe, Shinji Murakami, Hisashi Kojoh
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Patent number: 7070368Abstract: A machining feed rate for machining a workpiece portion to be machined by a machining tool based upon a machining program is set by reading a data of the workpiece portion, by sectionalizing the workpiece portion in an area corresponding to a workpiece shape of the workpiece portion, and by determining a shape change point based upon a workpiece shape of the workpiece portion. The machining feed rate is set for each area and for each shape change point with reference to a predetermined parameter corresponding to an attribute of the each sectionalized area and corresponding to an attribute of the each determined shape change point.Type: GrantFiled: September 27, 2002Date of Patent: July 4, 2006Assignee: Toyoda Koki Kabushiki KaisjaInventors: Shinji Murakami, Kazuya Hattori, Yoshihiko Yamada, Tadashi Otani, Atsushi Saito
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Publication number: 20050136761Abstract: A fire-retardant composite structure which includes a balsa core layer, fiberglass reinforcing layers attached to either side of the core layer, a PTFE porous layer attached to one of the fiberglass layers or to a fiberglass veil, and a gel coat layer over the PTFE porous layer. Matrix resin bonds the fiberglass layers to the balsa core member, as well as the PTFE porous layer to the fiberglass layers by impregnation.Type: ApplicationFiled: October 29, 2004Publication date: June 23, 2005Applicant: DAIKIN INDUSTRIES, LTD.Inventors: Shinji Murakami, Christopher Moore
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Publication number: 20050100623Abstract: The object of the present invention is to provide an internal mandrel for cooling a tubular thin film where air layer is not remaining in the lower side cooler of the internal mandrel, so that the tubular thin film can be continuously and stably produced. In the internal mandrel for directly cooling the tubular thin film while using external circularly shaped cooling tank where the tubular thin film is downwardly extruded through a circular slit of the die, the internal mandrel is characterized in that coolant for cooling a lower most part of the internal mandrel is flown in such a direction as to oppose to the tubular thin film.Type: ApplicationFiled: January 21, 2003Publication date: May 12, 2005Applicant: Kohjin Co LtdInventors: Koji Watanabe, Shinji Murakami, Hisashi Kojoh
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Publication number: 20050006749Abstract: A low elasticity layer (20) having an opening in an electrode arranging area where element electrodes are disposed is provided on a main surface of a semiconductor substrate (10). On the low elasticity layer (20), lands (32) serving as external electrodes are disposed, and pads (30) on the element electrodes, the lands (32) and metal wires (31) for connecting them are integrally formed as a metal wiring pattern (33). A solder resist film (50) having an opening for exposing a part of each land (32) is formed, and a metal ball (40) is provided on the land (32) in the opening. The low elasticity layer (20) absorbs thermal stress and the like caused in heating or cooling the semiconductor device, so as to prevent disconnection of the metal wires (31).Type: ApplicationFiled: August 12, 2004Publication date: January 13, 2005Applicant: Matsushita Electric Industrial Co., Ltd.Inventors: Nozomi Shimoishizaka, Ryuichi Sahara, Yoshifumi Nakamura, Takahiro Kumakawa, Shinji Murakami, Yutaka Harada
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Patent number: 6812573Abstract: A low elasticity layer (20) having an opening in an electrode arranging area where element electrodes are disposed is provided on a main surface of a semiconductor substrate (10). On the low elasticity layer (20), lands (32) serving as external electrodes are disposed, and pads (30) on the element electrodes, the lands (32) and metal wires (31) for connecting them are integrally formed as a metal wiring pattern (33). A solder resist film (50) having an opening for exposing a part of each land (32) is formed, and a metal ball (40) is provided on the land (32) in the opening. The low elasticity layer (20) absorbs thermal stress and the like caused in heating or cooling the semiconductor device, so as to prevent disconnection of the metal wires (31).Type: GrantFiled: June 25, 2001Date of Patent: November 2, 2004Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Nozomi Shimoishizaka, Ryuichi Sahara, Yoshifumi Nakamura, Takahiro Kumakawa, Shinji Murakami, Yutaka Harada
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Patent number: 6772953Abstract: An electronic circuit module formed of an antenna coil and an integrated circuit provided on a circuit board is provided inside a hollow resin case formed of a first part and a second part. A first slit leading into the hollow portion is provided in one side face of the resin case formed of the first and second parts joined to each other. Since the electronic circuit module is not exposed to high temperatures and high pressure during the manufacturing process, defects such as the breakage of the integrated circuit or the disconnection of the antenna coil can be avoided. Since the slit leading into the hollow portion is provided, the hollow portion does not swell by the temperature increase. In addition, pinholes do not tend to be formed during the joining of the first and second parts. Thus, a contactless data carrier with an excellent electrostatic withstand voltage characteristic can be provided.Type: GrantFiled: February 1, 2001Date of Patent: August 10, 2004Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Keiichi Iiyama, Takashi Noda, Shinji Murakami, Yutaka Harada, Takuya Oka, Masaru Tanichi
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Patent number: 6627277Abstract: In an extruder for producing a polytetrafluoroethylene tube having a minimum thickness deviation by extruding a polytetrafluoroethylene paste through an annular portion formed by a core pin (30) and a die orifice (50) around it, the core pin comprises a mandrel connection end (34) which is connected to a mandrel and a die orifice outlet end (36) which is located at a die orifice outlet end, and the core pin has between the ends a portion of which cross-section perpendicular to an axial direction of the core pin has a smaller area than that of a cross-section of each end of the core pin. By using the extruder, the tube having a thickness deviation of not larger than 15% can be obtained.Type: GrantFiled: February 18, 2000Date of Patent: September 30, 2003Assignee: Daikin Industries Ltd.Inventors: Tatsuro Uchida, Shinji Murakami, Shoji Kawachi
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Patent number: 6597142Abstract: An apparatus for setting control parameters of a machining apparatus. The setting apparatus includes a storage unit for storing a set of control parameters for each of a plurality of machining modes; an input device for selecting one of the plurality of machining modes; and a control unit for selecting a set of control parameters corresponding the selected machining mode and setting the set of control parameters as control parameters to be used for controlling the machining apparatus.Type: GrantFiled: September 21, 2001Date of Patent: July 22, 2003Assignee: Toyoda Koki Kabushiki KaishaInventors: Tetsuro Shibukawa, Akimitsu Kamiya, Kazunari Ogura, Atsuhisa Asada, Tadashi Otani, Shinji Murakami, Katsuhiro Maseki, Yoshihiko Yamada
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Publication number: 20030118416Abstract: A machining feed rate for machining a workpiece portion to be machined by a machining tool based upon a machining program is set by reading a data of the workpiece portion, by sectionalizing the workpiece portion in an area corresponding to a workpiece shape of the workpiece portion, and by determining a shape change point based upon a workpiece shape of the workpiece portion. The machining feed rate is set for each area and for each shape change point with reference to a predetermined parameter corresponding to an attribute of the each sectionalized area and corresponding to an attribute of the each determined shape change point.Type: ApplicationFiled: September 27, 2002Publication date: June 26, 2003Applicant: TOYODA KOKI KABUSHIKI KAISHAInventors: Shinji Murakami, Kazuya Hattori, Yoshihiko Yamada, Tadashi Otani, Atsushi Saito
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Publication number: 20020084763Abstract: An apparatus for setting control parameters of a machining apparatus. The setting apparatus includes a storage unit for storing a set of control parameters for each of a plurality of machining modes; an input device for selecting one of the plurality of machining modes; and a control unit for selecting a set of control parameters corresponding the selected machining mode and setting the set of control parameters as control parameters to be used for controlling the machining apparatus.Type: ApplicationFiled: September 21, 2001Publication date: July 4, 2002Applicant: TOYODA KOKI KABUSHIKI KAISHAInventors: Tetsuro Shibukawa, Akimitsu Kamiya, Kazunari Ogura, Atsuhisa Asada, Tadashi Otani, Shinji Murakami, Katsuhiro Maseki, Yoshihiko Yamada
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Patent number: 6357106Abstract: A method for mounting parts, and an IC card and its manufacturing method. The method reduces the number of steps, increases productivity, lowers costs, and miniaturizes the chip. A first electrode of the IC chip for processing signals received from a coil is connected to an internal end of a coil pattern formed on a first substrate, and an external end of the coil pattern and a second electrode of the IC chip are connected via a jumper wire.Type: GrantFiled: February 25, 1999Date of Patent: March 19, 2002Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Mitsumasa Oku, Takashi Akiguchi, Shinji Murakami, Yutaka Harada, Norihito Tsukahara, Mitsunori Yokomakura, Kenichi Sato
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Publication number: 20020026703Abstract: The present invention provides a method for mounting parts, and an IC card and its manufacturing method, capable of reducing the number of steps, increasing productivity, reducing in costs, and miniaturizing the chip. For this purpose, in the present invention, a first electrode (7a) of the IC chip (4) for processing signals received from a coil (3) is connected to an internal end (3b) of a coil pattern (2) formed on a first substrate (1a), and an external end (3a) of the coil pattern (2) and a second electrode (7b) of the IC chip (4) are connected via a jumper wiring means (8).Type: ApplicationFiled: October 26, 2001Publication date: March 7, 2002Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.Inventors: Mitsumasa Oku, Takashi Akiguchi, Shinji Murakami, Yutaka Harada, Norihito Tsukahara, Mitsunori Yokomakura, Kenichi Sato
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Publication number: 20020017569Abstract: An electronic circuit module formed of an antenna coil and an integrated circuit provided on a circuit board is provided inside a hollow resin case formed of a first part and a second part. A first slit leading into the hollow portion is provided in one side face of the resin case formed of the first and second parts joined to each other. Since the electronic circuit module is not exposed to high temperatures and high pressure during the manufacturing process, defects such as the breakage of the integrated circuit or the disconnection of the antenna coil can be avoided. Since the slit leading into the hollow portion is provided, the hollow portion does not swell by the temperature increase. In addition, pinholes do not tend to be formed during the joining of the first and second parts. Thus, a contactless data carrier with an excellent electrostatic withstand voltage characteristic can be provided.Type: ApplicationFiled: February 1, 2001Publication date: February 14, 2002Inventors: Keiichi Iiyama, Takashi Noda, Shinji Murakami, Yutaka Harada, Takuya Oka, Masaru Tanichi
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Publication number: 20020000655Abstract: A low elasticity layer (20) having an opening in an electrode arranging area where element electrodes are disposed is provided on a main surface of a semiconductor substrate (10). On the low elasticity layer (20), lands (32) serving as external electrodes are disposed, and pads (30) on the element electrodes, the lands (32) and metal wires (31) for connecting them are integrally formed as a metal wiring pattern (33). A solder resist film (50) having an opening for exposing a part of each land (32) is formed, and a metal ball (40) is provided on the land (32) in the opening. The low elasticity layer (20) absorbs thermal stress and the like caused in heating or cooling the semiconductor device, so as to prevent disconnection of the metal wires (31).Type: ApplicationFiled: August 22, 2001Publication date: January 3, 2002Inventors: Nozomi Shimoishizaka, Ryuichi Sahara, Yoshifumi Nakamura, Takahiro Kumakawa, Shinji Murakami, Yutaka Harada