Abstract: A method manufactures a front panel including a front panel body formed of a single transmissive resin layer and a sensor film attached thereto, using a first mold having a molding recessed portion and a second mold having a molding projecting portion. The first and second molds are joined together such that a cavity is formed between the molding recessed portion and the molding projecting portion, by placing the sensor film between the first mold and the second mold, on the molding projecting portion in the cavity. A melted resin is injected into the cavity to form the single transmissive resin layer having a front surface formed in a shape of the molding recessed portion, and a back surface formed along the sensor film in a shape of the molding projecting portion, thereby laminating the sensor film to the back surface of the transmissive resin layer.

Abstract: A method manufactures a front panel including a front panel body formed of a single transmissive resin layer and a sensor film attached thereto, using a first mold having a molding recessed portion and a second mold having a molding projecting portion. The first and second molds are joined together such that a cavity is formed between the molding recessed portion and the molding projecting portion, by placing the sensor film between the first mold and the second mold, on the molding projecting portion in the cavity. A melted resin is injected into the cavity to form the single transmissive resin layer having a front surface formed in a shape of the molding recessed portion, and a back surface formed along the sensor film in a shape of the molding projecting portion, thereby laminating the sensor film to the back surface of the transmissive resin layer.

Abstract: The surface panel includes a transmissive resin layer and a sensor film closely attached to a back surface of the resin layer. The sensor film includes a base film, a frame-shaped decorative portion on a front surface of the base film, and a transmissive electrode layer and right and left wiring layers on a back surface of the base film. The sensor film is closely attached to and along the back surface of the resin layer. The right and left wiring layers are closely attached to the corresponding right and back-surface left portions. Consequently, the area that is allocated for the transmissive region and the electrode layer can be increased.

Abstract: A heat-dissipating member includes a heat-dissipating section which is plate-shaped and which is attachable to a heat source directly or indirectly and also includes a plurality of heat-dissipating projections extending from the heat-dissipating section. The heat-dissipating projections are formed by louvering the heat-dissipating section so as to have predetermined heights. The heat-dissipating projections are arranged in increasing order of height in the direction from one end of the heat-dissipating section to an end of the heat-dissipating section that is opposed to the one end. A thermal head includes a plurality of heating elements arranged thereon and a head mount attached to the above heat-dissipating member directly or indirectly.

Abstract: A heat-dissipating member includes a heat-dissipating section which is plate-shaped and which is attachable to a heat source directly or indirectly and also includes a plurality of heat-dissipating projections extending from the heat-dissipating section. The heat-dissipating projections are formed by louvering the heat-dissipating section so as to have predetermined heights. The heat-dissipating projections are arranged in increasing order of height in the direction from one end of the heat-dissipating section to an end of the heat-dissipating section that is opposed to the one end. A thermal head includes a plurality of heating elements arranged thereon and a head mount attached to the above heat-dissipating member directly or indirectly.