Patents by Inventor Shinobu Takeura

Shinobu Takeura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process for mounting electronic device and semiconductor device
    Patent number: 6780677
    Abstract: An electronic device comprising a semiconductor chip which is fixed to the mounting face of a wiring board through an adhesive and in which external terminals are electrically connected with electrode pads of the wiring board through bump electrodes. Recesses are formed in the electrode pads, and in the recesses the electrode pads and the bump electrodes are connected. The electrode pads are formed over the surface of a soft layer, and the recesses are formed by elastic deformation of the electrode pads and the soft layer.
    Type: Grant
    Filed: August 21, 2002
    Date of Patent: August 24, 2004
    Assignees: Hitachi, Ltd., Hitachi Hokkai Semiconductor, Ltd.
    Inventors: Satoshi Imasu, Ikuo Yoshida, Tetsuya Hayashida, Akira Yamagiwa, Shinobu Takeura
  • Process for mounting electronic device and semiconductor device
    Patent number: 6737741
    Abstract: An electronic device comprising a semiconductor chip which is fixed to the mounting face of a wiring board through an adhesive and in which external terminals are electrically connected with electrode pads of the wiring board through bump electrodes. Recesses are formed in the electrode pads, and in the recesses the electrode pads and the bump electrodes are connected. The electrode pads are formed over the surface of a soft layer, and the recesses are formed by elastic deformation of the electrode pads and the soft layer.
    Type: Grant
    Filed: August 21, 2002
    Date of Patent: May 18, 2004
    Assignees: Hitachi, Ltd., Hitachi Hokkai Semiconductor, Ltd.
    Inventors: Satoshi Imasu, Ikuo Yoshida, Tetsuya Hayashida, Akira Yamagiwa, Shinobu Takeura
  • Process for mounting electronic device and semiconductor device
    Publication number: 20020195718
    Abstract: An electronic device comprising a semiconductor chip which is fixed to the mounting face of a wiring board through an adhesive and in which external terminals are electrically connected with electrode pads of the wiring board through bump electrodes. Recesses are formed in the electrode pads, and in the recesses the electrode pads and the bump electrodes are connected. The electrode pads are formed over the surface of a soft layer, and the recesses are formed by elastic deformation of the electrode pads and the soft layer.
    Type: Application
    Filed: August 21, 2002
    Publication date: December 26, 2002
    Applicant: HITACHI, LTD.
    Inventors: Satoshi Imasu, Ikuo Yoshida, Tetsuya Hayashida, Akira Yamagiwa, Shinobu Takeura
  • Process for mounting electronic device and semiconductor device
    Publication number: 20020192865
    Abstract: An electronic device comprising a semiconductor chip which is fixed to the mounting face of a wiring board through an adhesive and in which external terminals are electrically connected with electrode pads of the wiring board through bump electrodes. Recesses are formed in the electrode pads, and in the recesses the electrode pads and the bump electrodes are connected. The electrode pads are formed over the surface of a soft layer, and the recesses are formed by elastic deformation of the electrode pads and the soft layer.
    Type: Application
    Filed: August 21, 2002
    Publication date: December 19, 2002
    Applicant: HITACHI, LTD. and HITACHI HOKKAI SEMICONDUCTOR, LTD.
    Inventors: Satoshi Imasu, Ikuo Yoshida, Tetsuya Hayashida, Akira Yamagiwa, Shinobu Takeura
  • Process for mounting electronic device and semiconductor device
    Patent number: 6461896
    Abstract: An electronic device comprising a semiconductor chip which is fixed to the mounting face of a wiring board through an adhesive and in which external terminals are electrically connected with electrode pads of the wiring board through bump electrodes. Recesses are formed in the electrode pads, and in the recesses the electrode pads and the bump electrodes are connected. The electrode pads are formed over the surface of a soft layer, and the recesses are formed by elastic deformation of the electrode pads and the soft layer.
    Type: Grant
    Filed: May 5, 2000
    Date of Patent: October 8, 2002
    Assignees: Hitachi, Ltd., Hitachi Hokkai Semiconductor, Ltd.
    Inventors: Satoshi Imasu, Ikuo Yoshida, Tetsuya Hayashida, Akira Yamagiwa, Shinobu Takeura
  • Process for mounting electronic device and semiconductor device
    Publication number: 20010002163
    Abstract: An electronic device comprising a semiconductor chip which is fixed to the mounting face of a wiring board through an adhesive and in which external terminals are electrically connected with electrode pads of the wiring board through bump electrodes. Recesses are formed in the electrode pads, and in the recesses the electrode pads and the bump electrodes are connected. The electrode pads are formed over the surface of a soft layer, and the recesses are formed by elastic deformation of the electrode pads and the soft layer.
    Type: Application
    Filed: January 26, 2001
    Publication date: May 31, 2001
    Applicant: Hitachi, Ltd.
    Inventors: Satoshi Imasu, Ikuo Yoshida, Tetsuya Hayashida, Akira Yamagiwa, Shinobu Takeura
  • Process for mounting electronic device and semiconductor device
    Publication number: 20010002162
    Abstract: An electronic device comprising a semiconductor chip which is fixed to the mounting face of a wiring board through an adhesive and in which external terminals are electrically connected with electrode pads of the wiring board through bump electrodes. Recesses are formed in the electrode pads, and in the recesses the electrode pads and the bump electrodes are connected. The electrode pads are formed over the surface of a soft layer, and the recesses are formed by elastic deformation of the electrode pads and the soft layer.
    Type: Application
    Filed: January 26, 2001
    Publication date: May 31, 2001
    Applicant: Hitachi, Ltd.
    Inventors: Satoshi Imasu, Ikuo Yoshida, Tetsuya Hayashida, Akira Yamagiwa, Shinobu Takeura
  • Process for mounting electronic device and semiconductor device
    Patent number: 6208525
    Abstract: An electronic device comprising a semiconductor chip which is fixed to the mounting face of a wiring board through an adhesive and in which external terminals are electrically connected with electrode pads of the wiring board through bump electrodes. Recesses are formed in the electrode pads, and in the recesses the electrode pads and the bump electrodes are connected. The electrode pads are formed over the surface of a soft layer, and the recesses are formed by elastic deformation of the electrode pads and the soft layer.
    Type: Grant
    Filed: March 26, 1998
    Date of Patent: March 27, 2001
    Assignees: Hitachi, Ltd., Hitachi Hokkai Semiconductor, Ltd.
    Inventors: Satoshi Imasu, Ikuo Yoshida, Tetsuya Hayashida, Akira Yamagiwa, Shinobu Takeura
  • Semiconductor integrated circuit device, and process and apparatus for manufacturing the same
    Patent number: 5910010
    Abstract: A method of manufacturing a semiconductor integrated circuit device includes the steps of constructing a plurality of lead frames having leads which each include an inner portion and an outer portion and electrically connecting a semiconductor chip to the inner portions of the leads of each frame. The lead frames are then stacked one above each other to form a vertical stack and plates are then inserted between each of the lead frames with each plate having an opening in the center whereby a central cavity is formed in the stack. The stack is then placed between a top mold member and a bottom mold member and a resin is injected into the central cavity whereupon the resin is cured to form a single resin package encapsulating the semiconductor chips. The resin package is then released from the mold members.
    Type: Grant
    Filed: February 18, 1997
    Date of Patent: June 8, 1999
    Assignees: Hitachi, Ltd., Hitachi ULSI Engineering Corp., Hitachi Tohbu Semiconductor, Ltd., Hitachi Hokkai Semiconductor, Ltd.
    Inventors: Hirotaka Nishizawa, Tomoyoshi Miura, Ichirou Anjou, Masamichi Ishihara, Masahiro Yamamura, Sadao Morita, Takashi Araki, Kiyoshi Inoue, Toshio Sugano, Tetsuji Kohara, Toshio Yamada, Yasushi Sekine, Yoshiaki Anata, Masakatsu Goto, Norihiko Kasai, Shinobu Takeura, Mutsuo Tsukuda, Yasunori Yamaguchi, Jiro Sawada, Hidetoshi Iwai, Seiichiro Tsukui, Tadao Kaji, Noboru Shiozawa