Patents by Inventor Shinsaku IKUTA
Shinsaku IKUTA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230096212Abstract: An LED package includes a light source, a light transmissive member, and a light reflecting layer. The light source includes a resin package, a light emitting element and a wavelength conversion material. The resin package includes first and second leads and a resin member. The resin package defines a recess having a bottom face defined by portions of the first and second leads, and a portion of the resin member, and a lateral wall defined by a portion of the resin member. The light emitting element is disposed on or above the bottom face in the recess. The wavelength conversion material is disposed in the recess. The light transmissive member is disposed on or above the light source. The light reflecting layer is disposed on or above the light transmissive member at least on an upper side along an optical axis of the light emitting element.Type: ApplicationFiled: October 28, 2022Publication date: March 30, 2023Inventors: Motokazu YAMADA, Yuichi YAMADA, Shinsaku IKUTA, Takeshi TAMURA
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Patent number: 11489097Abstract: A light emitting device includes a substrate, a light source, a cover member, a light transmissive member disposed on or above the light source, a light reflecting layer disposed on or above the light transmissive member, and a light transmissive cover member. The cover member is made of a resin material containing a light reflecting substance and covers a lateral face of the light source. The light transmissive cover member covers at least a lateral face of the light transmissive member and includes an annular lens part. A thickness of a portion of the light transmissive cover member disposed above a perimeter of the light reflecting layer is larger than a thickness of a portion of the light transmissive cover member disposed above a portion of the light reflecting layer where an optical axis of the light emitting element passes through.Type: GrantFiled: November 24, 2020Date of Patent: November 1, 2022Assignee: NICHIA CORPORATIONInventors: Motokazu Yamada, Yuichi Yamada, Shinsaku Ikuta, Takeshi Tamura
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Publication number: 20210167263Abstract: A light emitting device includes a substrate, a light source, a cover member, a light transmissive member disposed on or above the light source, a light reflecting layer disposed on or above the light transmissive member, and a light transmissive cover member. The cover member is made of a resin material containing a light reflecting substance and covers a lateral face of the light source. The light transmissive cover member covers at least a lateral face of the light transmissive member and includes an annular lens part. A thickness of a portion of the light transmissive cover member disposed above a perimeter of the light reflecting layer is larger than a thickness of a portion of the light transmissive cover member disposed above a portion of the light reflecting layer where an optical axis of the light emitting element passes through.Type: ApplicationFiled: November 24, 2020Publication date: June 3, 2021Inventors: Motokazu YAMADA, Yuichi YAMADA, Shinsaku IKUTA, Takeshi TAMURA
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Patent number: 10967588Abstract: A method of manufacturing a light emitting device includes providing a substrate on which a light source is disposed. An underfill material is ejected from a nozzle onto the substrate substantially around the light source in a circular shape, a shape of a letter ‘C’, or a rectangular shape. A covering member having a recess portion is provided above the light source.Type: GrantFiled: January 9, 2020Date of Patent: April 6, 2021Assignee: NICHIA CORPORATIONInventors: Motokazu Yamada, Masakazu Kotani, Tetsuji Seino, Shinsaku Ikuta
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Patent number: 10784419Abstract: A light emitting device includes a light emitting element; a sealing resin covering the light emitting element; and a light diffusing material contained in the sealing resin. When a difference in refractive index at 10° C. between the sealing resin and the light diffusing material is ?n1 and a difference in refractive index at 50° C. between the sealing resin and the light diffusing material is ?n2, a ratio of ?n2 to ?n1 is in a range of 95% to 105%.Type: GrantFiled: May 20, 2016Date of Patent: September 22, 2020Assignee: NICHIA CORPORATIONInventors: Motokazu Yamada, Tomonori Ozaki, Shinsaku Ikuta, Yuichi Yamada
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Publication number: 20200147908Abstract: A method of manufacturing a light emitting device includes providing a substrate on which a light source is disposed. An underfill material is ejected from a nozzle onto the substrate substantially around the light source in a circular shape, a shape of a letter ‘C’, or a rectangular shape. A covering member having a recess portion is provided above the light source.Type: ApplicationFiled: January 9, 2020Publication date: May 14, 2020Applicant: NICHIA CORPORATIONInventors: Motokazu YAMADA, Masakazu KOTANI, Tetsuji SEINO, Shinsaku IKUTA
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Patent number: 10569487Abstract: A method of manufacturing a light emitting device includes providing a substrate on which a light source is disposed. An underfill material is ejected from a nozzle onto the substrate substantially around the light source in a circular shape, a shape of a letter ‘C’, or a rectangular shape. A covering member having a recess portion is provided above the light source.Type: GrantFiled: April 24, 2019Date of Patent: February 25, 2020Assignee: NICHIA CORPORATIONInventors: Motokazu Yamada, Masakazu Kotani, Tetsuji Seino, Shinsaku Ikuta
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Patent number: 10391727Abstract: A light emitting device includes a substrate, a light source, and a covering member. The light source has an optical axis, a light source bottom portion and a light source upper portion opposite to the light source bottom portion in the optical axis. The light source is provided on the substrate at the light source bottom portion. The covering member has a bottom surface and a top portion opposite to the bottom surface in the optical axis and is provided on the substrate at the bottom surface to cover the light source. The covering member has a recess portion on the top portion above the light source and around the optical axis.Type: GrantFiled: March 20, 2018Date of Patent: August 27, 2019Assignee: NICHIA CORPORATIONInventors: Motokazu Yamada, Masakazu Kotani, Tetsuji Seino, Shinsaku Ikuta
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Publication number: 20190248083Abstract: A method of manufacturing a light emitting device includes providing a substrate on which a light source is disposed. An underfill material is ejected from a nozzle onto the substrate substantially around the light source in a circular shape, a shape of a letter ‘C’, or a rectangular shape. A covering member having a recess portion is provided above the light source.Type: ApplicationFiled: April 24, 2019Publication date: August 15, 2019Applicant: NICHIA CORPORATIONInventors: Motokazu YAMADA, Masakazu KOTANI, Tetsuji SEINO, Shinsaku IKUTA
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Publication number: 20180215113Abstract: A light emitting device includes a substrate, a light source, and a covering member. The light source has an optical axis, a light source bottom portion and a light source upper portion opposite to the light source bottom portion in the optical axis. The light source is provided on the substrate at the light source bottom portion. The covering member has a bottom surface and a top portion opposite to the bottom surface in the optical axis and is provided on the substrate at the bottom surface to cover the light source. The covering member has a recess portion on the top portion above the light source and around the optical axis.Type: ApplicationFiled: March 20, 2018Publication date: August 2, 2018Applicant: NICHIA CORPORATIONInventors: Motokazu YAMADA, Masakazu KOTANI, Tetsuji SEINO, Shinsaku IKUTA
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Patent number: 9956731Abstract: A light emitting device includes a substrate, a light source, and a covering member. The light source has an optical axis, a light source bottom portion and a light source upper portion opposite to the light source bottom portion in the optical axis. The light source is provided on the substrate at the light source bottom portion. The covering member has a bottom surface and a top portion opposite to the bottom surface in the optical axis and is provided on the substrate at the bottom surface to cover the light source. The covering member has a recess portion on the top portion above the light source and around the optical axis. The covering member tapers toward the bottom surface.Type: GrantFiled: March 11, 2016Date of Patent: May 1, 2018Assignee: NICHIA CORPORATIONInventors: Motokazu Yamada, Masakazu Kotani, Tetsuji Seino, Shinsaku Ikuta
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Publication number: 20160343918Abstract: A light emitting device includes a light emitting element; a sealing resin covering the light emitting element; and a light diffusing material contained in the sealing resin. When a difference in refractive index at 10° C. between the sealing resin and the light diffusing material is ?n1 and a difference in refractive index at 50° C. between the sealing resin and the light diffusing material is ?n2, a ratio of ?n2 to ?n1 is in a range of 95% to 105%.Type: ApplicationFiled: May 20, 2016Publication date: November 24, 2016Applicant: NICHIA CORPORATIONInventors: Motokazu YAMADA, Tomonori OZAKI, Shinsaku IKUTA, Yuichi YAMADA
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Publication number: 20160265741Abstract: A light emitting device includes a substrate, a light source, and a covering member. The light source has an optical axis, a light source bottom portion and a light source upper portion opposite to the light source bottom portion in the optical axis. The light source is provided on the substrate at the light source bottom portion. The covering member has a bottom surface and a top portion opposite to the bottom surface in the optical axis and is provided on the substrate at the bottom surface to cover the light source. The covering member has a recess portion on the top portion above the light source and around the optical axis. The covering member tapers toward the bottom surface.Type: ApplicationFiled: March 11, 2016Publication date: September 15, 2016Applicant: NICHIA CORPORATIONInventors: Motokazu YAMADA, Masakazu KOTANI, Tetsuji SEINO, Shinsaku IKUTA