Patents by Inventor Shinsuke Okada

Shinsuke Okada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240044706
    Abstract: A spectroscopic module includes a plurality of beam splitters that are arranged along an X direction; a plurality of bandpass filters disposed on one side in a Z direction with respect to the plurality of beam splitters facing the plurality of beam splitters, respectively; a light detector disposed on the one side in the Z direction with respect to the plurality of bandpass filters and including a plurality of light receiving regions facing the plurality of bandpass filters, respectively; a first support body supporting the plurality of beam splitters; and a second support body supporting the plurality of bandpass filters. The second support body includes a support portion in which a support surface is formed so as to be open to the one side in the Z direction. The plurality of bandpass filters are disposed on the support surface.
    Type: Application
    Filed: October 18, 2023
    Publication date: February 8, 2024
    Applicant: HAMAMATSU PHOTONICS K.K.
    Inventors: Kazumasa MURAKAMI, Shinsuke OKADA
  • Publication number: 20230384605
    Abstract: A spectroscopic module includes M beam splitters that are arranged along an X direction, where M is a natural number of 2 or more; M bandpass filters disposed on one side in a Z direction with respect to the M beam splitters, each of the M bandpass filters facing each of the M beam splitters; a light detector disposed on the one side in the Z direction with respect to the M bandpass filters and includes M light receiving regions, each of the M light receiving regions facing each of the M bandpass filters; a first support body supporting the M beam splitters; and a second support body supporting the M bandpass filters. Each of N beam splitters among the M beam splitters has a plate shape and has a thickness of 1 mm or less, where N is a natural number of 2 to M.
    Type: Application
    Filed: August 9, 2023
    Publication date: November 30, 2023
    Applicant: HAMAMATSU PHOTONICS K.K.
    Inventors: Kazumasa MURAKAMI, Tatsuya OGINO, Shinsuke OKADA
  • Patent number: 11828651
    Abstract: A spectroscopic module includes a plurality of beam splitters that are arranged along an X direction; a plurality of bandpass filters disposed on one side in a Z direction with respect to the plurality of beam splitters facing the plurality of beam splitters, respectively; a light detector disposed on the one side in the Z direction with respect to the plurality of bandpass filters and including a plurality of light receiving regions facing the plurality of bandpass filters, respectively; a first support body supporting the plurality of beam splitters; and a second support body supporting the plurality of bandpass filters. The second support body includes a support portion in which a support surface is formed so as to be open to the one side in the Z direction. The plurality of bandpass filters are disposed on the support surface.
    Type: Grant
    Filed: December 22, 2022
    Date of Patent: November 28, 2023
    Assignee: HAMAMATSU PHOTONICS K.K.
    Inventors: Kazumasa Murakami, Shinsuke Okada
  • Patent number: 11809566
    Abstract: A method can include storing host code executable by a host device in a nonvolatile memory (NVM) device and NVM code executable by the NVM device. The NVM device can validate the integrity of the NVM code in response to predetermined conditions and generate a code integrity value for validating the NVM code. The code integrity value having a size independent of a size of the host code. An authentication code can be sent to the host device that is generated with at least the code integrity value. In response to read requests from the host device, returning at least portions of the host code for execution by the host device. Corresponding devices and systems are also disclosed.
    Type: Grant
    Filed: December 15, 2020
    Date of Patent: November 7, 2023
    Assignee: INFINEON TECHNOLOGIES LLC
    Inventors: Daisuke Nakata, Shinsuke Okada
  • Publication number: 20230349757
    Abstract: A spectroscopic module includes a plurality of beam splitters that are arranged along an X direction; a plurality of bandpass filters disposed on one side in a Z direction with respect to the plurality of beam splitters facing the plurality of beam splitters, respectively; a light detector disposed on the one side in the Z direction with respect to the plurality of bandpass filters and including a plurality of light receiving regions facing the plurality of bandpass filters, respectively; a first support body supporting the plurality of beam splitters; and a second support body supporting the plurality of bandpass filters. The second support body includes a support portion in which a support surface is formed so as to be open to the one side in the Z direction. The plurality of bandpass filters are disposed on the support surface.
    Type: Application
    Filed: July 3, 2023
    Publication date: November 2, 2023
    Applicant: HAMAMATSU PHOTONICS K.K.
    Inventors: Kazumasa Murakami, Shinsuke Okada
  • Patent number: 11762211
    Abstract: A spectroscopic module includes M beam splitters that are arranged along an X direction, where M is a natural number of 2 or more; M bandpass filters disposed on one side in a Z direction with respect to the M beam splitters, each of the M bandpass filters facing each of the M beam splitters; a light detector disposed on the one side in the Z direction with respect to the M bandpass filters and includes M light receiving regions, each of the M light receiving regions facing each of the M bandpass filters; a first support body supporting the M beam splitters; and a second support body supporting the M bandpass filters. Each of N beam splitters among the M beam splitters has a plate shape and has a thickness of 1 mm or less, where N is a natural number of 2 to M.
    Type: Grant
    Filed: December 30, 2020
    Date of Patent: September 19, 2023
    Assignee: HAMAMATSU PHOTONICS K.K.
    Inventors: Kazumasa Murakami, Tatsuya Ogino, Shinsuke Okada
  • Patent number: 11747202
    Abstract: A spectroscopic module includes a plurality of beam splitters that are arranged along an X direction; a plurality of bandpass filters disposed on one side in a Z direction with respect to the plurality of beam splitters facing the plurality of beam splitters, respectively; a light detector disposed on the one side in the Z direction with respect to the plurality of bandpass filters and including a plurality of light receiving regions facing the plurality of bandpass filters, respectively; a first support body supporting the plurality of beam splitters; and a second support body supporting the plurality of bandpass filters. The second support body includes a support portion in which a support surface is formed so as to be open to the one side in the Z direction. The plurality of bandpass filters are disposed on the support surface.
    Type: Grant
    Filed: December 21, 2022
    Date of Patent: September 5, 2023
    Assignee: HAMAMATSU PHOTONICS K.K.
    Inventors: Kazumasa Murakami, Shinsuke Okada
  • Publication number: 20230132287
    Abstract: A spectroscopic module includes a plurality of beam splitters that are arranged along an X direction; a plurality of bandpass filters disposed on one side in a Z direction with respect to the plurality of beam splitters facing the plurality of beam splitters, respectively; a light detector disposed on the one side in the Z direction with respect to the plurality of bandpass filters and including a plurality of light receiving regions facing the plurality of bandpass filters, respectively; a first support body supporting the plurality of beam splitters; and a second support body supporting the plurality of bandpass filters. The second support body includes a support portion in which a support surface is formed so as to be open to the one side in the Z direction. The plurality of bandpass filters are disposed on the support surface.
    Type: Application
    Filed: December 21, 2022
    Publication date: April 27, 2023
    Applicant: HAMAMATSU PHOTONICS K.K.
    Inventors: Kazumasa MURAKAMI, Shinsuke OKADA
  • Publication number: 20230124416
    Abstract: A spectroscopic module includes a plurality of beam splitters that are arranged along an X direction; a plurality of bandpass filters disposed on one side in a Z direction with respect to the plurality of beam splitters facing the plurality of beam splitters, respectively; a light detector disposed on the one side in the Z direction with respect to the plurality of bandpass filters and including a plurality of light receiving regions facing the plurality of bandpass filters, respectively; a first support body supporting the plurality of beam splitters; and a second support body supporting the plurality of bandpass filters. The second support body includes a support portion in which a support surface is formed so as to be open to the one side in the Z direction. The plurality of bandpass filters are disposed on the support surface.
    Type: Application
    Filed: December 22, 2022
    Publication date: April 20, 2023
    Applicant: HAMAMATSU PHOTONICS K.K.
    Inventors: Kazumasa MURAKAMI, Shinsuke OKADA
  • Patent number: 11561133
    Abstract: A spectroscopic module includes a plurality of beam splitters that are arranged along an X direction; a plurality of bandpass filters disposed on one side in a Z direction with respect to the plurality of beam splitters facing the plurality of beam splitters, respectively; a light detector disposed on the one side in the Z direction with respect to the plurality of bandpass filters and including a plurality of light receiving regions facing the plurality of bandpass filters, respectively; a first support body supporting the plurality of beam splitters; and a second support body supporting the plurality of bandpass filters. The second support body includes a support portion in which a support surface is formed so as to be open to the one side in the Z direction. The plurality of bandpass filters are disposed on the support surface.
    Type: Grant
    Filed: January 3, 2022
    Date of Patent: January 24, 2023
    Assignee: HAMAMATSU PHOTONICS K.K.
    Inventors: Kazumasa Murakami, Shinsuke Okada
  • Patent number: 11316687
    Abstract: Disclosed are apparatus and methods for programming a plurality of nonvolatile memory (NVM) devices. Each NVM device self-generates and stores a unique encryption key. Each NVM device concurrently receives an image from a multiple-device programming system to which all the NVM devices are communicatively coupled. Each NVM device encrypts the received image using such NVM device's unique encryption key to produce a unique encrypted image for each NVM device. Each NVM device stores its unique encrypted image within a nonvolatile memory of such NVM device. The unique encryption key can then be securely transferred to a host device for decrypting the image accessed from one of the NVM devices.
    Type: Grant
    Filed: December 13, 2019
    Date of Patent: April 26, 2022
    Assignee: Cypress Semiconductor Corporation
    Inventors: Clifford Zitlaw, Markus Unseld, Sandeep Krishnegowda, Daisuke Nakata, Shinsuke Okada, Stephan Rosner
  • Publication number: 20220120613
    Abstract: A spectroscopic module includes a plurality of beam splitters that are arranged along an X direction; a plurality of bandpass filters disposed on one side in a Z direction with respect to the plurality of beam splitters facing the plurality of beam splitters, respectively; a light detector disposed on the one side in the Z direction with respect to the plurality of bandpass filters and including a plurality of light receiving regions facing the plurality of bandpass filters, respectively; a first support body supporting the plurality of beam splitters; and a second support body supporting the plurality of bandpass filters. The second support body includes a support portion in which a support surface is formed so as to be open to the one side in the Z direction. The plurality of bandpass filters are disposed on the support surface.
    Type: Application
    Filed: January 3, 2022
    Publication date: April 21, 2022
    Applicant: HAMAMATSU PHOTONICS K.K.
    Inventors: Kazumasa MURAKAMI, Shinsuke OKADA
  • Publication number: 20220108016
    Abstract: A method can include storing host code executable by a host device in a nonvolatile memory (NVM) device and NVM code executable by the NVM device. The NVM device can validate the integrity of the NVM code in response to predetermined conditions and generate a code integrity value for validating the NVM code. The code integrity value having a size independent of a size of the host code. An authentication code can be sent to the host device that is generated with at least the code integrity value. In response to read requests from the host device, returning at least portions of the host code for execution by the host device. Corresponding devices and systems are also disclosed.
    Type: Application
    Filed: December 15, 2020
    Publication date: April 7, 2022
    Applicant: Infineon Technologies LLC
    Inventors: Daisuke Nakata, Shinsuke Okada
  • Patent number: 11248957
    Abstract: A spectroscopic module includes a plurality of beam splitters that are arranged along an X direction; a plurality of bandpass filters disposed on one side in a Z direction with respect to the plurality of beam splitters facing the plurality of beam splitters, respectively; a light detector disposed on the one side in the Z direction with respect to the plurality of bandpass filters and including a plurality of light receiving regions facing the plurality of bandpass filters, respectively; a first support body supporting the plurality of beam splitters; and a second support body supporting the plurality of bandpass filters. The second support body includes a support portion in which a support surface is formed so as to be open to the one side in the Z direction. The plurality of bandpass filters are disposed on the support surface.
    Type: Grant
    Filed: January 4, 2021
    Date of Patent: February 15, 2022
    Assignee: HAMAMATSU PHOTONICS K.K.
    Inventors: Kazumasa Murakami, Shinsuke Okada
  • Publication number: 20210207997
    Abstract: A spectroscopic module includes a plurality of beam splitters that are arranged along an X direction; a plurality of bandpass filters disposed on one side in a Z direction with respect to the plurality of beam splitters facing the plurality of beam splitters, respectively; a light detector disposed on the one side in the Z direction with respect to the plurality of bandpass filters and including a plurality of light receiving regions facing the plurality of bandpass filters, respectively; a first support body supporting the plurality of beam splitters; and a second support body supporting the plurality of bandpass filters. The second support body includes a support portion in which a support surface is formed so as to be open to the one side in the Z direction. The plurality of bandpass filters are disposed on the support surface.
    Type: Application
    Filed: January 4, 2021
    Publication date: July 8, 2021
    Applicant: HAMAMATSU PHOTONICS K.K.
    Inventors: Kazumasa MURAKAMI, Shinsuke OKADA
  • Publication number: 20210208412
    Abstract: A spectroscopic module includes M beam splitters that are arranged along an X direction, where M is a natural number of 2 or more; M bandpass filters disposed on one side in a Z direction with respect to the M beam splitters, each of the M bandpass filters facing each of the M beam splitters; a light detector disposed on the one side in the Z direction with respect to the M bandpass filters and includes M light receiving regions, each of the M light receiving regions facing each of the M bandpass filters; a first support body supporting the M beam splitters; and a second support body supporting the M bandpass filters. Each of N beam splitters among the M beam splitters has a plate shape and has a thickness of 1 mm or less, where N is a natural number of 2 to M.
    Type: Application
    Filed: December 30, 2020
    Publication date: July 8, 2021
    Applicant: HAMAMATSU PHOTONICS K.K.
    Inventors: Kazumasa MURAKAMI, Tatsuya OGINO, Shinsuke OKADA
  • Patent number: 10949340
    Abstract: An overlaid erase block (EB) mapping scheme for a flash memory provides efficient wear-leveling and reduces mount operation latency. The overlaid EB mapping scheme maps a first type of EB onto one of a plurality of physical erase blocks, in a corresponding portion of the flash memory. The first type of EB includes a plurality of pointers. The overlaid EB mapping scheme also maps each of second and third types of EBs onto one of the physical EBs that is not mapped to the first type of EB. The second type of EBs store system management information and the third type of EBs store user data. When the flash memory is started up, the overlaid EB mapping scheme scans the corresponding portion to locate the first type of EB, locates the system EBs using the pointers, and locates the data EBs using the system management information.
    Type: Grant
    Filed: May 18, 2018
    Date of Patent: March 16, 2021
    Assignee: Cypress Semiconductor Corporation
    Inventors: Shinsuke Okada, Sunil Atri, Hiroyuki Saito
  • Publication number: 20200287716
    Abstract: Disclosed are apparatus and methods for programming a plurality of nonvolatile memory (NVM) devices. Each NVM device self-generates and stores a unique encryption key. Each NVM device concurrently receives an image from a multiple-device programming system to which all the NVM devices are communicatively coupled. Each NVM device encrypts the received image using such NVM device's unique encryption key to produce a unique encrypted image for each NVM device. Each NVM device stores its unique encrypted image within a nonvolatile memory of such NVM device. The unique encryption key can then be securely transferred to a host device for decrypting the image accessed from one of the NVM devices.
    Type: Application
    Filed: December 13, 2019
    Publication date: September 10, 2020
    Applicant: Cypress Semiconductor Corporation
    Inventors: Clifford Zitlaw, Markus Unseld, Sandeep Krishnegowda, Daisuke Nakata, Shinsuke Okada, Stephan Rosner
  • Patent number: 10331359
    Abstract: Disclosed herein are system, method, and computer program product embodiments for accessing data of a memory. A method embodiment operates by receiving one or more requests for data stored across at least a first memory area and a second memory area of a memory. The method continues with performing, by at least one processor, a wrapped read of data within a first memory area of the memory. The method then performs, by the at least one processor, a continuous read of data within a second memory area of the memory, the second memory area being adjacent to the first memory area. The continuous read starts at a first boundary of the second memory area, and is performed automatically after the wrapped read of data within the first memory area.
    Type: Grant
    Filed: October 12, 2017
    Date of Patent: June 25, 2019
    Assignee: Cypress Semiconductor Corporation
    Inventors: Qamrul Hasan, Shinsuke Okada, Yuichi Ise, Kai Dieffenbach, Kiyomatsu Shouji
  • Publication number: 20180349268
    Abstract: An overlaid erase block (EB) mapping scheme for a flash memory provides efficient wear-leveling and reduces mount operation latency. The overlaid EB mapping scheme maps a first type of EB onto one of a plurality of physical erase blocks, in a corresponding portion of the flash memory. The first type of EB includes a plurality of pointers. The overlaid EB mapping scheme also maps each of second and third types of EBs onto one of the physical EBs that is not mapped to the first type of EB. The second type of EBs store system management information and the third type of EBs store user data. When the flash memory is started up, the overlaid EB mapping scheme scans the corresponding portion to locate the first type of EB, locates the system EBs using the pointers, and locates the data EBs using the system management information.
    Type: Application
    Filed: May 18, 2018
    Publication date: December 6, 2018
    Applicant: Cypress Semiconductor Corporation
    Inventors: Shinsuke Okada, Sunil Atri, Hiroyuki Saito