Patents by Inventor Shinsuke Sakai

Shinsuke Sakai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9181557
    Abstract: The present invention provides uracil-requiring Moorella bacteria obtained by destroying a gene coding for orotidine-5-phosphate decarboxylase; and transforming-gene-introduced Moorella bacteria obtained by introducing a gene coding for orotidine-5-phosphate decarboxylase and a transforming-gene to a chromosome of the uracil-requiring Moorella bacteria. The present invention was accomplished by uracil-requiring Moorella bacteria, comprising an MTA-D-pF strain that is obtained by destroying a gene coding for orotidine-5-phosphate decarboxylase on a chromosome of Moorella bacteria.
    Type: Grant
    Filed: June 1, 2012
    Date of Patent: November 10, 2015
    Assignees: Mitsui Engineering & Shipbuilding Co., Ltd., Hiroshima University, Gifu University
    Inventors: Yutaka Nakashimada, Akihisa Kita, Tohru Suzuki, Shinsuke Sakai, Kazue Takaoka
  • Publication number: 20140206084
    Abstract: The present invention provides a primer set used for transformation that imparts a uracil requiring property by deleting or destroying a gene coding for orotidine-5-phosphate decarboxylase in Moorella bacteria. The present invention is accomplished by a primer set that is used for creating a uracil requiring strain obtained by deleting or destroying a gene coding for orotidine-5-phosphate decarboxylase in Moorella bacteria by homologous recombination and is represented by SEQ ID No. 1 and 2 that amplify an upstream region adjacent to said gene coding for orotidine-5-phosphate decarboxylase.
    Type: Application
    Filed: June 1, 2012
    Publication date: July 24, 2014
    Applicants: MITSUI ENGINEERING & SHIPBUILDING CO., LTD., GIFU UNIVERSITY, HIROSHIMA UNIVERSITY
    Inventors: Yutaka Nakashimada, Akihisa Kita, Tohru Suzuki, Shinsuke Sakai, Kazue Takaoka
  • Publication number: 20140206065
    Abstract: The present invention provides uracil-requiring Moorella bacteria obtained by destroying a gene coding for orotidine-5-phosphate decarboxylase; and transforming-gene-introduced Moorella bacteria obtained by introducing a gene coding for orotidine-5-phosphate decarboxylase and a transforming-gene to a chromosome of the uracil-requiring Moorella bacteria. The present invention was accomplished by uracil-requiring Moorella bacteria, comprising an MTA-D-pF strain that is obtained by destroying a gene coding for orotidine-5-phosphate decarboxylase on a chromosome of Moorella bacteria.
    Type: Application
    Filed: June 1, 2012
    Publication date: July 24, 2014
    Applicants: MITSUI ENGINEERING & SHIPBUILDING CO., LTD., GIFU UNIVERSITY, HIROSHIMA UNIVERSITY
    Inventors: Yutaka Nakashimada, Akihisa Kita, Tohru Suzuki, Shinsuke Sakai, Kazue Takaoka
  • Publication number: 20090299696
    Abstract: A damage probability calculating apparatus for calculating a damage probability of a specific estimation target includes: a storage unit 1 that stores a damage rate function representing a relationship between a damage rate and time; a damage rate function correcting unit 3 that corrects the damage rate function on the basis of examination data acquired at the time of general examination of the estimation target; and a damage probability calculating unit 4 that calculates the damage probability on the basis of the damage rate function corrected by the damage rate function correcting unit 3.
    Type: Application
    Filed: December 29, 2008
    Publication date: December 3, 2009
    Applicant: NIPPON KAIJI KYOKAI
    Inventors: Hiromi SHIIHARA, Shinsuke SAKAI, Kunio TAGAMI, Masataka YATOMI, Yoshiharu SHIMURA, Masami HAMANO
  • Patent number: 6199680
    Abstract: A method and apparatus adapted to bunch together a predetermined number of inverted PTPs and uninverted PTPs into a bundle, and then transfer each PTP bundle to a bucket conveyor which moves intermittently in parallel with a conveying passage. A multitude of PTPs, a portion of which are inverted with respect to the conveying direction and the rest of which are not inverted, are conveyed along a first conveying passage while maintaining the blistered surfaces of the inverted and uninverted PTPs in parallel with each other. A selected portion of the PTPs being conveyed in the first conveying passage is pinched and separated from the same passage. The separated PTPs are bunched together while the spacing between the separated PTPs is narrowed in the conveying direction. The bunched PTPs are transferred onto a second conveying passage across the first conveying passage. The bunched PTPs are loaded into a bucket provided on a bucket conveyor which intermittently travels along the second conveying passage.
    Type: Grant
    Filed: May 26, 1999
    Date of Patent: March 13, 2001
    Assignee: Omori Machinery Co., Ltd.
    Inventors: Shinsuke Sakai, Toshio Omori
  • Patent number: 5459104
    Abstract: The invention relates to a process of production of a semiconductor substrate by binding etc. involving the direct polishing of an oxide film with step differences. A silicon oxide film (3) having step differences is formed on at least one surface of an active layer substrate (A). This silicon oxide film (3) is polished by a rigid platen using a polishing agent comprised primarily of cerium oxide. A support substrate (B) is laminated to the bonding face (3a) this obtained to obtain a wafer of a SOI structure. This enables elimination of the polycrystalline silicon layer on the silicon oxide film which had been formed only for bonding purposes.
    Type: Grant
    Filed: September 19, 1994
    Date of Patent: October 17, 1995
    Assignee: Mitsubishi Materials Silicon Corporation
    Inventor: Shinsuke Sakai
  • Patent number: 5337232
    Abstract: In breaking a syntagm, such as a phrase, a clause, a sentence, or sentences, into a succession of analyzed morphemes, use is made of at least one group of morphemes included in the syntagm which includes two or more morphemes in a customary order. These two or more morphemes of each group are stored in a dictionary together with a descriptor, such as TIME or ANGLE, descriptive of the group, and an identifier or number indicative of the customary order. Selected by a separating unit, candidate morphemes for the analyzed morphemes are stored, together with, if any, the descriptor and at least one of the identifier or a mark, in a memory as memorized morphemes. An output unit selects those memorized morphemes which are accompanied by a common descriptor descriptive of a single group and either the identifier or the mark indicative of the customary order of morphemes in the group, and outputs these as the analyzed morphemes.
    Type: Grant
    Filed: March 18, 1992
    Date of Patent: August 9, 1994
    Assignee: NEC Corporation
    Inventors: Shinsuke Sakai, Takao Miyabe
  • Patent number: 5096854
    Abstract: The present invention relates to a method for polishing a silicon wafer. The method comprises the steps of: (a) supplying a polishing fluid to a polishing surface, the polishing fluid including an alkaline fluid and polishing particles of high-purity silica dispersed in the alkaline fluid, the polishing surface being planar; (b) bringing a silicon wafer in contact with the polishing surface; and (c) moving at least one of the silicon wafer and the polishing surface relative to the other, thereby polishing the silicon wafer. The method is characterized by the following: the polishing surface is made of a ceramic material harder than the silicon wafer and more resistant to mechanochemical polishing than silicon, and the maximum roughness of the ceramic is less than 0.02 .mu.m.
    Type: Grant
    Filed: June 19, 1989
    Date of Patent: March 17, 1992
    Assignees: Japan Silicon Co., Ltd., Sony Corporation
    Inventors: Yuichi Saito, Shinsuke Sakai, Hisao Hayashi, Takeshi Matsushita
  • Patent number: 4699118
    Abstract: A dressing apparatus comprises a head movably mounted on a tip portion of a body, the head having a tip having formed therein a cut-out which opens in the direction of the movement of the head and into which one of outer and inner peripheral cutting edges formed on a cut-off wheel in the form of a disc is adapted to be inserted, a tape traveling device mounted on the head and the body for causing a tape having a layer of abrasive grain on a side thereof to travel across the cut-out in the head, and an actuator disposed between the head and the body for moving the head. The dressing apparatus and a dressing method are arranged such that the one peripheral cutting edge is inserted into the cut-out in the head, and the one peripheral cutting edge and the side of the tape are brought into contact with each other while causing the tape to travel by the tape traveling device, to apply the dressing to the one peripheral cutting edge.
    Type: Grant
    Filed: March 18, 1986
    Date of Patent: October 13, 1987
    Assignees: Mitsubishi Kinzoku Kabushiki Kaisha, Japan Silicon Co., Ltd.
    Inventors: Shoji Tsuruta, Hideaki Minami, Yoshinori Ohhata, Shinsuke Sakai