Patents by Inventor Shintaro Yamanaka

Shintaro Yamanaka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10914017
    Abstract: The Sn-plated steel sheet of the disclosure is an Sn-plated steel sheet including: a steel sheet; an Sn plating layer formed on at least one side of the steel sheet and containing, based on % by mass, from 0.1 g/m2 to 15 g/m2 of metal Sn; and a coating layer formed on the surface of the Sn plating layer and containing zirconium oxide and tin oxide; in which the content of the zirconium oxide in the coating layer is from 0.2 mg/m2 to 50 mg/m2 in terms of metal Zr amount, and the peak position of binding energy of Sn3d5/2 according to X-ray photoelectron spectroscopy of the tin oxide in the coating layer is 1.6 eV or higher than the peak position of binding energy of the metal Sn.
    Type: Grant
    Filed: May 24, 2017
    Date of Patent: February 9, 2021
    Assignee: NIPPON STEEL CORPORATION
    Inventors: Shintaro Yamanaka, Shigeru Hirano, Morio Yanagihara, Hirokazu Yokoya
  • Patent number: 10911003
    Abstract: A Doherty amplifier includes a carrier amplifier, a peaking amplifier, and a phase compensation circuit. The carrier amplifier 11 includes a main amplifying element and a parasitic element, and the peaking amplifier includes an auxiliary amplifying element and a parasitic element. The phase compensation circuit has a negative electrical length that allows a total electrical length of a signal transmission path starting from an output source of the main amplifying element to a power combiner to become 180°×N?90° where N is a positive integer. In addition, a signal transmission path starting from an output source of the auxiliary amplifying element to the power combiner has an electrical length of 180°×M?180° where M is a positive integer.
    Type: Grant
    Filed: January 24, 2017
    Date of Patent: February 2, 2021
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Keigo Nakatani, Shintaro Shinjo, Koji Yamanaka
  • Publication number: 20210006208
    Abstract: A conventional Doherty amplifier requires a load modulation line having an electrical length of 90 degrees, a frequency compensation line having an electrical length of an integral (n) multiple of 180 degrees, and an input phase adjustment line having an electrical length corresponding to a difference (180°×n?90°) between the electrical length of the load modulation line and the electrical length of the frequency compensation line. Thus, the conventional Doherty amplifier has a problem of an increase in circuit size.
    Type: Application
    Filed: September 22, 2020
    Publication date: January 7, 2021
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Shuichi SAKATA, Shintaro SHINJO, Keigo NAKATANI, Koji YAMANAKA
  • Publication number: 20210005535
    Abstract: In a semiconductor device including gate fingers each having a linear shape extending from a feed line, and arranged in areas between drain electrodes and source electrodes, open stubs are connected directly to the feed line.
    Type: Application
    Filed: September 18, 2020
    Publication date: January 7, 2021
    Applicant: Mitsubishi Electric Corporation
    Inventors: Yutaro YAMAGUCHI, Masatake HANGAI, Shintaro SHINJO, Koji YAMANAKA
  • Publication number: 20200399765
    Abstract: This Sn-plated steel sheet includes: a base plated steel sheet having a steel sheet, and a Sn-plated layer on at least one surface of the steel sheet; and a film layer which contains a zirconium oxide and a tin oxide and is positioned on the base plated steel sheet. An adhesion amount of Sn per surface of the Sn-plated steel sheet is 0.1 g/m2 or more and 15 g/m2 or less, an amount of the zirconium oxide in the film layer is in a range of 1 mg/m2 or more and 30 mg/m2 or less in terms of an amount of metal Zr, a peak position of a binding energy of Sn3d5/2 of the tin oxide by X-ray photoelectron spectroscopy in the film layer is within a range of 1.4 eV or more and less than 1.6 eV from a peak position of a binding energy of metal Sn, and a quantity of electricity required for reduction of the tin oxide is in a range of more than 5.0 mC/cm2 and 20 mC/cm2 or less.
    Type: Application
    Filed: March 1, 2019
    Publication date: December 24, 2020
    Applicant: NIPPON STEEL CORPORATION
    Inventors: Shintaro YAMANAKA, Masakazu NODA, Yasuhiko SATO, Nobuo NAKASONE
  • Patent number: 10865491
    Abstract: The Sn-based alloy plated steel sheet of this disclosure includes: a steel sheet; a composite plating layer formed on at least one side of the steel sheet and including an Fe—Ni—Sn alloy layer and an island-shaped Sn layer located on the Fe—Ni—Sn alloy layer; and a coating layer formed on the surface of the composite plating layer and containing zirconium oxide and tin oxide, and the composite plating layer contains a predetermined amount of Ni and a predetermined amount of Sn, a content of the zirconium oxide in the coating layer is from 0.2 mg/m2 to 50 mg/m2 in terms of metal Zr amount, and a peak position of binding energy of Sn3d5/2 according to X-ray photoelectron spectroscopy of the tin oxide in the coating layer is 1.6 eV or higher than a peak position of binding energy of the metal Sn.
    Type: Grant
    Filed: May 24, 2017
    Date of Patent: December 15, 2020
    Assignee: NIPPON STEEL CORPORATION
    Inventors: Shintaro Yamanaka, Shigeru Hirano, Morio Yanagihara, Hirokazu Yokoya
  • Patent number: 10800933
    Abstract: A surface treatment solution for a plated steel sheet to be hot-pressed comprising a ZnO aqueous dispersion (A) and a water dispersible organic resin (B), wherein the ZnO aqueous dispersion (A) comprises water and ZnO particle size having 50 to 300 nm particles, the water dispersible organic resin (B) has a 5 to 45 mgKOH/g acid value and 5 to 300 nm emulsion particle size, and a mass ratio (WA/WB) of a mass of ZnO particles in the ZnO aqueous dispersion (WA) to a mass of solid content of the water dispersible organic resin (WB) is 30/70 to 95/5.
    Type: Grant
    Filed: June 3, 2016
    Date of Patent: October 13, 2020
    Assignee: NIHON PARKERIZING CO., LTD.
    Inventors: Soshi Fujita, Jun Maki, Shintaro Yamanaka, Masao Kurosaki, Tatsuya Suzuki, Kensuke Mizuno, Takumi Kozaki, Takahiro Kodama
  • Publication number: 20200307159
    Abstract: A steel sheet for a container includes: a steel sheet; an Ni plated layer, which is arranged on at least one side of the steel sheet and is adhered in an amount of from 0.3 to 3 g/m2 per side in terms of metal Ni amount; and a chromate coated film or a Zr coated film which is arranged on the Ni plated layer, in which the Ni plated layer contains from 0.1 to 20% by mass of ZnO particles per side in terms of metal Zn amount.
    Type: Application
    Filed: May 24, 2017
    Publication date: October 1, 2020
    Applicant: NIPPON STEEL & SUMITOMO METAL CORPORATION
    Inventors: Shigeru HIRANO, Yoshiaki TANI, Shintaro YAMANAKA, Hirokazu YOKOYA
  • Patent number: 10748860
    Abstract: Parallel inductors include a first metal wire (8a or 8b) for connecting a drain terminal (2) and a first metal pattern (7a or 7b), and a second metal wire (10a or 10b) for connecting the first metal pattern (7a or 7b) and a second metal pattern (9a or 9b). The second metal wires (10a and 10b) are each positioned between the corresponding first metal wire (8a or 8b) and a corresponding third metal wire (12a or 12b) for connecting the drain terminal (2) and a third metal pattern (11). The direction of current through the second metal wires (10a and 10b) is opposite to the direction of current through each of the first metal wire (8a or 8b) and the third metal wire (12a or 12b).
    Type: Grant
    Filed: July 1, 2016
    Date of Patent: August 18, 2020
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Keigo Nakatani, Yuji Komatsuzaki, Shintaro Shinjo, Koji Yamanaka, Shohei Imai
  • Publication number: 20200244227
    Abstract: Included is a compensation circuit (9) having one end connected to another end of a first output circuit (7) and another end of a second output circuit (8) and another end grounded, the compensation circuit having an electrical length of 90 degrees at a first operation frequency and an electrical length of 45 degrees at a second operation frequency which is half of the first operation frequency.
    Type: Application
    Filed: April 10, 2020
    Publication date: July 30, 2020
    Applicant: Mitsubishi Electric Corporation
    Inventors: Keigo NAKATANI, Yuji KOMATSUZAKI, Shuichi SAKATA, Shintaro SHINJO, Koji YAMANAKA
  • Publication number: 20200232077
    Abstract: A sheet includes: a base; an Al-plating layer on at least one of opposite surfaces of the base; an intermediate coating layer on a surface of the Al-plating layer; and a surface coating layer formed on a surface of the intermediate coating layer and containing ZnO particles with a mean particle size of 0.10 ?m or more and 5.00 ?m or less and an organic resin such that an amount of coating of the ZnO particles is 0.5 g/m2 or more and 10.0 g/m2 or less in terms of metallic zinc.
    Type: Application
    Filed: March 23, 2018
    Publication date: July 23, 2020
    Applicant: NIPPON STEEL CORPORATION
    Inventors: Shinichi YAMAGUCHI, Jun MAKI, Soshi FUJITA, Shintaro YAMANAKA, Michiko KONNO, Tetsuya TOBA
  • Patent number: 10711336
    Abstract: Provided is an alloyed hot-dip galvanized steel sheet including a base steel sheet, the base steel sheet containing a given amount of C, Si, Mn, and other elements. The alloyed hot-dip galvanized steel sheet is provided with an alloyed hot-dip galvanized layer on a surface of the base steel sheet, the alloyed hot-dip galvanized layer containing, in mass %, Fe: more than or equal to 5% and less than or equal to 15%, and having a thickness of more than or equal to 3 ?m and less than or equal to 30 ?m.
    Type: Grant
    Filed: November 8, 2018
    Date of Patent: July 14, 2020
    Assignee: NIPPON STEEL CORPORATION
    Inventors: Soshi Fujita, Shintaro Yamanaka
  • Publication number: 20200136564
    Abstract: In a case where the power of a signal to be amplified is greater than or equal to a threshold value, a signal distributor (2) outputs one of signals to a carrier amplifier (6), outputs another signal, a phase of which is 90 degrees behind that of the one of the signals, to a peak amplifier (8), and adjusts a phase shift amount of a signal shifted by a phase shifter (7) depending on the frequency of the signal to be amplified. In a case where the power of the signal to be amplified is less than the threshold value, the signal distributor (2) outputs the one of the signals to the carrier amplifier (6) without outputting the other signal to the peak amplifier (8).
    Type: Application
    Filed: July 27, 2017
    Publication date: April 30, 2020
    Applicant: Mitsubishi Electric Corporation
    Inventors: Keigo NAKATANI, Shuichi SAKATA, Shintaro SHINJO, Koji YAMANAKA
  • Publication number: 20200091871
    Abstract: A Doherty amplifier includes a carrier amplifier, a peaking amplifier, and a phase compensation circuit. The carrier amplifier 11 includes a main amplifying element and a parasitic element, and the peaking amplifier includes an auxiliary amplifying element and a parasitic element. The phase compensation circuit has a negative electrical length that allows a total electrical length of a signal transmission path starting from an output source of the main amplifying element to a power combiner to become 180°×N?90° where N is a positive integer. In addition, a signal transmission path starting from an output source of the auxiliary amplifying element to the power combiner has an electrical length of 180°×M?180° where M is a positive integer.
    Type: Application
    Filed: January 24, 2017
    Publication date: March 19, 2020
    Applicant: Mitsubishi Electric Corporation
    Inventors: Keigo NAKATANI, Shintaro SHINJO, Koji YAMANAKA
  • Patent number: 10574197
    Abstract: A first stabilizing circuit (7a) is disposed between a first transistor (5a) and a first output matching circuit (10a) in a first stage. A second stabilizing circuit (7b) is disposed between a second transistor (5b) and a second output matching circuit (10b) in a second stage. The first stabilizing circuit (7a) includes a first band-pass filter and a first resistor (103a) connected in parallel. The first band-pass filter allows a signal of a frequency f1 lower than a central frequency fc of the operation frequencies as an amplifier to pass through. The second stabilizing circuit (7b) includes a second band-pass filter and a second resistor (103b) connected in parallel. The second band-pass filter allows a signal of a frequency f2 higher than the central frequency fc to pass through.
    Type: Grant
    Filed: December 8, 2015
    Date of Patent: February 25, 2020
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Takaaki Yoshioka, Shintaro Shinjo, Koji Yamanaka
  • Publication number: 20200040479
    Abstract: A Sn-plated steel sheet according to the present invention includes a steel sheet, a Sn-plated layer that is provided on at least one surface of the steel sheet, and a film that is provided on a surface of the Sn-plated layer and includes zirconium oxide and tin oxide, in which an amount of the zirconium oxide in the film is 0.2 mg/m2 to 50 mg/m2 in terms of metal Zr amount, in a depth direction analysis by X-ray photoelectron spectroscopy, a depth position A at which an element concentration of Zr present as the zirconium oxide is maximum is positioned closer to a surface of the film than a depth position B at which an element concentration of Sn present as the tin oxide is maximum, and a distance between the depth position A and the depth position B in a depth direction is 0.5 nm or more.
    Type: Application
    Filed: April 13, 2018
    Publication date: February 6, 2020
    Applicant: NIPPON STEEL CORPORATION
    Inventors: Shintaro YAMANAKA, Shigeru HIRANO, Masakazu NODA, Yasuhiko SATO
  • Patent number: 10526690
    Abstract: A high-strength hot-dip galvanized steel sheet that is a steel sheet that includes major components and that contains at least 40 vol. % the sum of bainite and martensite, 8-60 vol. % retained austenite, and less than 40 vol. % ferrite, with the remainder comprising an incidental structure. The hot-dip galvanized steel sheet has, at the interface between the deposit layer formed by hot-dip galvanization and the base steel sheet, an intermetallic compound constituted of Fe, Al, Zn, and incidental impurities and having an average thickness of 0.1-2 ?m, the intermetallic compound having a crystal grain diameter of 0.01-1 ?m. After the deposit layer formed by hot-dip galvanization was removed, the surface of the base steel sheet has an arithmetic average roughness Ra of 0.1-2.0 ?m and gives a roughness curve in which the contour elements have an average length RSm of 5-300 ?m.
    Type: Grant
    Filed: September 28, 2012
    Date of Patent: January 7, 2020
    Assignee: NIPPON STEEL CORPORATION
    Inventors: Shintaro Yamanaka, Soshi Fujita, Koichi Sato
  • Publication number: 20200002818
    Abstract: An Al-plated steel sheet includes: a base; an Al-plating layer formed on at least one of opposite surfaces of the base; and a surface layer formed on the Al-plating layer, the surface layer containing: ZnO particles; an organic resin; and acetylacetonato in an amount in a range from 10 mass % to 30 mass %, both inclusive, with respect to a total mass of the surface layer. A mean particle size of the ZnO particles is in a range from 0.10 ?m to 5.00 ?m, both inclusive, and an amount of coating of the ZnO particles is in a range from 0.5 g/m2 to 10.0 g/m2, both inclusive, in terms of metal Zn.
    Type: Application
    Filed: March 23, 2018
    Publication date: January 2, 2020
    Applicant: NIPPON STEEL CORPORATION
    Inventors: Shinichi YAMAGUCHI, Shintaro YAMANAKA
  • Patent number: 10523158
    Abstract: Provided is a load modulation amplifier including: a high frequency circuit board; and on the board, an input distribution circuit unit (DC) including: a distributor for dividing one input signal into two signals IS1 and IS2; and a phase delay circuit formed on a signal line for the divided IS2; a carrier amplifier (CA) including a first high frequency transistor for amplifying the IS1; a peak amplifier (PA) including a second high frequency transistor and for amplifying the IS2; and an output combination circuit (OCCU) including: a 90-degree phase delay circuit (90DC) formed on a signal line for output of the CA; a combiner for combining output of the 90DC and output of the PA; and an impedance conversion circuit for converting an output impedance of the combiner. The CA and the PA are directly connected to the OCCU without converting an output impedance.
    Type: Grant
    Filed: February 23, 2016
    Date of Patent: December 31, 2019
    Assignee: Mitsubishi Electric Corporation
    Inventors: Shintaro Shinjo, Yuji Komatsuzaki, Keigo Nakatani, Koji Yamanaka
  • Publication number: 20190301043
    Abstract: The Sn-plated steel sheet of the disclosure is an Sn-plated steel sheet including: a steel sheet; an Sn plating layer formed on at least one side of the steel sheet and containing, based on % by mass, from 0.1 g/m2 to 15 g/m2 of metal Sn; and a coating layer formed on the surface of the Sn plating layer and containing zirconium oxide and tin oxide; in which the content of the zirconium oxide in the coating layer is from 0.2 mg/m2 to 50 mg/m2 in terms of metal Zr amount, and the peak position of binding energy of Sn3d5/2 according to X-ray photoelectron spectroscopy of the tin oxide in the coating layer is 1.6 eV or higher than the peak position of binding energy of the metal Sn.
    Type: Application
    Filed: May 24, 2017
    Publication date: October 3, 2019
    Applicant: NIPPON STEEL & SUMITOMO METAL CORPORATION
    Inventors: Shintaro YAMANAKA, Shigeru HIRANO, Morio YANAGIHARA, Hirokazu YOKOYA