Patents by Inventor Shinya Sato

Shinya Sato has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10443215
    Abstract: A construction machine management system in which a failure analysis or a failure-omen diagnosis of a machine body can be performed with a high degree accuracy and at a low cost is provided. In a machine body group of construction machines including at least one representative machine body having an engine control unit that detects a cumulative stress value of a diesel engine of the construction machine and a crankcase pressure sensor that detects a crankcase pressure, and at least one general machine body that has an engine control unit but does not have a crankcase pressure sensor, a center server performs a diagnosis of an omen of a failure state regarding the crankcase pressure of the general machine body based on correlation information between the cumulative stress value and the crankcase pressure obtained from the representative machine body and the cumulative stress value of the general machine body.
    Type: Grant
    Filed: November 24, 2015
    Date of Patent: October 15, 2019
    Assignee: Hitachi Construction Machinery Co., Ltd.
    Inventors: Shinya Sato, Kentarou Itoga, Masatoshi Hoshino, Kouji Ishikawa
  • Publication number: 20190284688
    Abstract: A film forming apparatus according to an embodiment includes a reaction chamber; a pump; a storage container storing a discharged liquid; a first pipe having first and second end portions, the first end portion being connected to the reaction chamber, the first pipe extending in a first direction; a second pipe between the first pipe and the pump, having third and fourth end portions, extending in a second direction different from the first direction, the fourth end portion being connected to the pump; and a third pipe between the first pipe and the storage container, having fifth and sixth end portions, extending in a third direction different from the second direction, the fifth end portion being located on an imaginary straight line extending in the first direction from a center of the second end portion and the sixth end portion being connected to the storage container.
    Type: Application
    Filed: August 3, 2018
    Publication date: September 19, 2019
    Inventor: Shinya Sato
  • Patent number: 10413252
    Abstract: According to one embodiment, a medical image display apparatus comprises reception circuitry, a storage, and control circuitry. The reception circuitry configured to receive at least one medical images imaged by a medical imaging apparatus, and first progress information indicating that image inspection for the at least one medical images is in progress in a medical image inspection apparatus, and receive second progress information indicating completion of the image inspection for the at least one medical images. The storage configured to store the at least one medical images and the first progress information. The control circuitry configured to update the stored first progress information to the second progress information, if the second progress information is received.
    Type: Grant
    Filed: April 20, 2017
    Date of Patent: September 17, 2019
    Assignee: Canon Medical Systems Corporation
    Inventors: Takayuki Kojima, Kensuke Shinoda, Takumi Kaneko, Hideaki Kobayashi, Shinya Sato, Satoshi Okuyama
  • Patent number: 10381392
    Abstract: Provided is an image pickup device, including: a first trench provided between a plurality of pixels in a light-receiving region of a semiconductor substrate, the semiconductor substrate including the light-receiving region and a peripheral region, the light-receiving region being provided with the plurality of pixels each including a photoelectric conversion section; and a second trench provided in the peripheral region of the semiconductor substrate, wherein the semiconductor substrate has a variation in thickness between a portion where the first trench is provided and a portion where the second trench is provided.
    Type: Grant
    Filed: February 1, 2018
    Date of Patent: August 13, 2019
    Assignee: Sony Corporation
    Inventor: Shinya Sato
  • Publication number: 20190164872
    Abstract: An electronic device comprises a semiconductor chip, an accommodating part that accommodates the semiconductor chip, a plurality of terminals that are provided along a first side of a first surface and along a second side opposite to the first side with respect to the semiconductor chip, the plurality of terminals being electrically connected to the semiconductor chip and being exposed on the rectangular first surface of the accommodating part, and a plurality of conductive members that penetrate from the first surface of the accommodating part to the second surface opposite to the first surface.
    Type: Application
    Filed: January 31, 2019
    Publication date: May 30, 2019
    Inventors: Shinya SATO, Yuki YASUDA, Yojiro SHIINA
  • Patent number: 10306217
    Abstract: A virtual image display device configuring a display device includes a display section that displays an image while enabling visual recognition of an outside scene. The virtual image display device includes an image pickup section that picks up an image in an image pickup range that overlaps with at least a range visually recognized through the display section. The virtual image display device includes a coupling section that includes at least one movable section and couples the image pickup section to the display section and a plurality of light emitting sections fixedly provided in the display section.
    Type: Grant
    Filed: April 6, 2016
    Date of Patent: May 28, 2019
    Assignee: SEIKO EPSON CORPORATION
    Inventor: Shinya Sato
  • Patent number: 10277847
    Abstract: There is provided a solid-state imaging device including: a pixel region that includes a plurality of pixels arranged in a two-dimensional matrix pattern. Some of the plurality of pixels are configured to be phase difference detection pixels that include a photoelectric conversion section disposed on a semiconductor substrate and a light blocking film disposed above a portion of the photoelectric conversion section. In particular a location of the light blocking film for the phase difference detection pixels varies according to a location of the phase difference detection pixel. For example, the location of the light blocking film for a phase difference detection pixel positioned at a periphery of the pixel region is different than a location of the light blocking film for a phase difference detection pixel positioned in a center portion of the pixel region.
    Type: Grant
    Filed: May 27, 2014
    Date of Patent: April 30, 2019
    Assignee: SONY CORPORATION
    Inventors: Masashi Nakata, Koji Takahashi, Yuuji Inoue, Kenji Ikeda, Osamu Oka, Yoshiro Hattori, Shinya Sato, Hideaki Kato, Yasuhiro Chouji, Emi Nishioka, Hiroshi Kawanobe
  • Publication number: 20190122821
    Abstract: A capacitor includes a capacitor element, a bus bar, and a case. The bus bar is electrically connected to the capacitor element. The capacitor element and the bus bar are accommodated in the case. The case has a protrusion. The bus bar includes a fitting part into which the protrusion is fitted, and has a first surface facing the case and a second surface opposite to the first surface. The fitting part includes a through hole that passes through from the first surface to the second surface, and a cylindrical flange part surrounding the through hole. The cylindrical flange part is disposed on the second surface so as to rise from a peripheral edge of the through hole.
    Type: Application
    Filed: December 18, 2018
    Publication date: April 25, 2019
    Inventor: SHINYA SATO
  • Publication number: 20190112996
    Abstract: An object of the present invention is to provide a working machine and a working machine monitoring system using the same which is capable of improving the accuracy in determining fuel property. The working machine is provided with an engine operation parameter acquisition module (1041) that acquires an engine operation parameter representing the operation state of an engine mounted on the working machine; a refueling time acquisition module (1011) that acquires a refueling time when the working machine is supplied with fuel; and a fuel property determination module (1014) that determines the property of the fuel based on a comparison result of the time when the engine operation parameter changes, with the refueling time.
    Type: Application
    Filed: December 13, 2018
    Publication date: April 18, 2019
    Inventors: Shinya SATO, Masatoshi HOSHINO, Kouji ISHIKAWA, Shinji ISHIHARA
  • Patent number: 10251537
    Abstract: A large incident angle of an off-axis principal ray is ensured while a stroke of a moving lens group is kept long, and a size is reduced while a focusing operation in magnification is easy. A magnifying endoscope optical system provided with a negative single lens cemented to an image pickup device and a moving lens group, capable of switching at least between a normal observation state and a proximity magnifying state can be made by moving the moving lens groups; and the following conditional expression (1) is satisfied: ?65<fr/fw<?2??(1) where reference character fr denotes a focal distance of the negative lens cemented to the image pickup device, and reference character fw denotes a focal distance of the entire system in the normal observation state (wide angle end).
    Type: Grant
    Filed: September 9, 2015
    Date of Patent: April 9, 2019
    Assignee: OLYMPUS CORPORATION
    Inventor: Shinya Sato
  • Publication number: 20190097202
    Abstract: According to an embodiment, a battery module includes, for example, a plurality of battery cells, a first chassis, and a connection member. The battery cells are aligned in a first direction. The first chassis includes a plurality of first compartments in which the battery cells are housed one by one, and at least one second compartment that is partitioned in the first direction. The connection member includes a body that is housed in the second compartment; a pair of connection terminals that is mounted on a first face of the body and is electrically connectable to the electrodes of the battery cells via a conductive member, the first face facing in a second direction intersecting with the first direction; and a conductor that extends across the pair of connection terminals.
    Type: Application
    Filed: September 20, 2018
    Publication date: March 28, 2019
    Applicants: Kabushiki Kaisha Toshiba, Toshiba Infrastructure Systems & Solutions Corporation
    Inventors: Masahito Morone, Hirofumi Yamamoto, Tatsumi Matsuo, Motohiro Itou, Shinya Sato, Kazuto Kuroda, Ryo Okabe, Norihiro Kaneko, Minoru Gyoda, Yuji Sasaki, Kota Asami, Nobuyasu Negishi
  • Patent number: 10242937
    Abstract: To increase a current that can be supplied to an electronic element mounted on an upper surface of a semiconductor package. An electronic device includes a semiconductor chip, a package that accommodates the semiconductor chip, a plurality of terminals that is electrically bonded with the semiconductor chip and is exposed on a first surface of the package, and at least one copper post that penetrates from the first surface of the package to a second surface opposite to the first surface, and that has a cross sectional area in the direction of the first surface, which is larger than the area of the plurality of terminals on the first surface.
    Type: Grant
    Filed: October 25, 2017
    Date of Patent: March 26, 2019
    Assignees: KATOH ELECTRIC CO, LTD., TOREX SEMICONDUCTOR LTD.
    Inventors: Shinya Sato, Yuki Yasuda, Yojiro Shiina
  • Publication number: 20190086029
    Abstract: A hoop wrapped composite pressure vessel (1A) is provided in which a dome portion of a vessel main body (1) has a greater thickness than a thickness of a circularly cylindrical portion (2) and has a shape in which an outer circumferential curved surface initiating point (30A) that is situated axially outwards of an external diametrical surface (20) of the vessel main body that is flat in an axial direction is offset further axially outwards than an internal circumferential curved surface initiating point (31A) that is situated axially outwards of an internal diametrical surface (21) of the vessel main body that is flat in the axial direction and in which an FRP (10) is wound like a hoop around the vessel main body properly.
    Type: Application
    Filed: February 28, 2017
    Publication date: March 21, 2019
    Applicant: THE JAPAN STEEL WORKS, LTD.
    Inventors: Yoru WADA, Shinya SATO
  • Publication number: 20190024555
    Abstract: An exhaust purification system includes an exhaust passage. Exhaust gas flows through the exhaust passage. A burner is arranged in the exhaust passage. A combustion space for fuel in the burner is a part inside the exhaust passage. A NOx adsorbent is located downstream of the combustion space in the exhaust passage. The NOx adsorbent adsorbs nitrogen oxide contained in the exhaust gas. A selective reduction catalyst is located downstream of the NOx adsorbent in the exhaust passage. An adding valve is located between the selective reduction catalyst and the combustion space in the exhaust passage. A connection passage is connected to the adding valve. Urea water flows through the connection passage toward the adding valve. A part of the connection passage runs through the combustion space.
    Type: Application
    Filed: February 22, 2016
    Publication date: January 24, 2019
    Inventors: Shinya SATO, Mitsuru HOSOYA, Takashi TAKAKURA
  • Publication number: 20190024257
    Abstract: Provided are: a silicon carbide single crystal substrate which is cut out from a silicon carbide bulk single crystal grown by the Physical Vapor Transport method; and a process for producing the same. The number of screw dislocations in one of the semicircle areas of the substrate is smaller than that in the other thereof, namely, the number of screw dislocations in a given area of the substrate is reduced. The semicircle areas of the substrate correspond respectively to the halves of the substrate.
    Type: Application
    Filed: September 24, 2018
    Publication date: January 24, 2019
    Applicant: SHOWA DENKO K.K.
    Inventors: Shinya SATO, Tatsuo FUJIMOTO, Hiroshi TSUGE, Masakazu KATSUNO
  • Publication number: 20180371611
    Abstract: According to one embodiment, a processing system includes a first vessel, a destination part to be transported, and a liquid sending part. The first vessel gathers a product being liquid temporarily. The destination part to be transported includes a second vessel to gather the product transported from the first vessel. The liquid sending part includes a first portion. The first portion includes a nozzle and a first mechanism. The nozzle discharges the product provided between the first vessel and the destination part to be transported. The first mechanism is purged by an inactive gas.
    Type: Application
    Filed: March 15, 2018
    Publication date: December 27, 2018
    Inventor: Shinya Sato
  • Patent number: 10119200
    Abstract: Provided are: a silicon carbide single crystal substrate which is cut out from a silicon carbide bulk single crystal grown by the Physical Vapor Transport method; and a process for producing the same. The number of screw dislocations in one of the semicircle areas of the substrate is smaller than that in the other thereof, namely, the number of screw dislocations in a given area of the substrate is reduced. The semicircle areas of the substrate correspond respectively to the halves of the substrate.
    Type: Grant
    Filed: November 15, 2013
    Date of Patent: November 6, 2018
    Assignee: SHOWA DENKO K.K.
    Inventors: Shinya Sato, Tatsuo Fujimoto, Hiroshi Tsuge, Masakazu Katsuno
  • Patent number: 10079098
    Abstract: A case-mold-type capacitor includes a capacitor element, first and second bus bars connected to the first and second electrodes of the capacitor element, a case accommodating the capacitor element and the first and second bus bars, and a mold resin filling the case therein. The case has a cutaway portion provided therein. A sealing plate joined to the case so as to seal the cutaway portion. The first and second bus bars pass through the sealing plate and are fixed to the sealing plate. The case-mold-type capacitor improves dimensional accuracy between terminal portions of the first and second bus bars without increasing material cost, and has high reliability.
    Type: Grant
    Filed: October 20, 2017
    Date of Patent: September 18, 2018
    Assignee: Panasonic Intellectual Property Management Co., Ltd.
    Inventors: Shinya Sato, Toshihisa Miura
  • Publication number: 20180233285
    Abstract: A film capacitor includes a capacitor element, a first bus bar and a second bus bar, a case, and a filling resin. The first bus bar has a first overlapping part, and the second bus bar has a second overlapping part. The first overlapping part and the second overlapping part overlap with each other via an insulating plate. The insulating plate has a first surface that faces the first overlapping part and a second surface that faces the second overlapping part, and has a first protrusion formed on the first surface and a second protrusion formed on the second surface, the second protrusion opposing the first protrusion. The first overlapping part has a first fitting hole into which the first protrusion is fitted, and the second overlapping part has a second fitting hole into which the second protrusion is fitted. The insulating plate has a through-hole that penetrates through the first protrusion and the second protrusion.
    Type: Application
    Filed: April 13, 2018
    Publication date: August 16, 2018
    Inventors: SHINYA SATO, HIROTAKA HISAMURA
  • Publication number: 20180218968
    Abstract: To increase a current that can be supplied to an electronic element mounted on an upper surface of a semiconductor package. An electronic device includes a semiconductor chip, a package that accommodates the semiconductor chip, a plurality of terminals that is electrically bonded with the semiconductor chip and is exposed on a first surface of the package, and at least one copper post that penetrates from the first surface of the package to a second surface opposite to the first surface, and that has a cross sectional area in the direction of the first surface, which is larger than the area of the plurality of terminals on the first surface.
    Type: Application
    Filed: October 25, 2017
    Publication date: August 2, 2018
    Inventors: Shinya SATO, Yuki YASUDA, Yojiro SHIINA