Patents by Inventor Shinya TERASAWA

Shinya TERASAWA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Component feeding device and component feeding method
    Patent number: 11570941
    Abstract: There is provided a component feeding device including multiple component replenishing devices configured to replenish with components having different shapes; multiple stages on which the components replenished from the multiple replenishing devices are scattered, and a control section configured to cause the multiple replenishing devices to replenish the components to the respective stages at an arbitrary timing. There is provided a component feeding method for supplying components, having different shapes and being respectively replenished onto multiple stages from multiple replenishing devices, to a component mounting device with the components being respectively scattered on the multiple stages, wherein amounts of the components is capable of being respectively changed for each of the multiple stages.
    Type: Grant
    Filed: December 12, 2017
    Date of Patent: January 31, 2023
    Assignee: FUJI CORPORATION
    Inventor: Shinya Terasawa
  • COMPONENT FEEDING DEVICE AND COMPONENT FEEDING METHOD
    Publication number: 20210176906
    Abstract: There is provided a component feeding device including multiple component replenishing devices configured to replenish with components having different shapes; multiple stages on which the components replenished from the multiple replenishing devices are scattered, and a control section configured to cause the multiple replenishing devices to replenish the components to the respective stages at an arbitrary timing. There is provided a component feeding method for supplying components, having different shapes and being respectively replenished onto multiple stages from multiple replenishing devices, to a component mounting device with the components being respectively scattered on the multiple stages, wherein amounts of the components is capable of being respectively changed for each of the multiple stages.
    Type: Application
    Filed: December 12, 2017
    Publication date: June 10, 2021
    Applicant: FUJI CORPORATION
    Inventor: Shinya TERASAWA