Patents by Inventor Shiou-Yi Kuo

Shiou-Yi Kuo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240413133
    Abstract: A wafer with micro integrated circuits includes a transparent substrate and a plurality of micro components. The micro components are each attached to the transparent substrate by a plurality of transparent adhesive layers. Each of the micro components includes a bonding pad in direct contact with the transparent adhesive layer and an etching stop layer located on the side of the micro components opposite from the bonding pad.
    Type: Application
    Filed: June 4, 2024
    Publication date: December 12, 2024
    Inventors: Shiou-Yi KUO, Chin-Hung LUNG, Bo-Yu CHEN
  • Publication number: 20240395986
    Abstract: A light-emitting element, a manufacturing method thereof, and a package structure are provided. The light-emitting element includes a first semiconductor layer, an active layer disposed on the first semiconductor layer, a second semiconductor layer disposed on the active layer, and a convex lens structure disposed on the second semiconductor layer. The convex lens structure includes a plurality of microlenses. The microlenses and the second semiconductor layer are integrally formed and have the same material. The radius of curvature of one of the microlenses is 0.2 ?m to 5.0 ?m, and the light-emission angle of the light-emitting element is 100° to 110°.
    Type: Application
    Filed: May 20, 2024
    Publication date: November 28, 2024
    Inventors: Shiou-Yi KUO, Jian-Chin LIANG, Cheng-Hsien LI, Kai Hung CHENG
  • Publication number: 20240379908
    Abstract: A semiconductor structure includes a micro semiconductor device and a support fragment. The micro semiconductor device has a first surface and a second surface opposite the first surface. The micro semiconductor device includes a first electrode and a second electrode on the first surface. The first electrode and the second electrode are separated from each other. The support fragment is left on the micro semiconductor device and positioned corresponding to the region between the main portion of the first electrode and the second electrode in the vertical direction. The support fragment has an annular breaking surface in a plan view of the support fragment.
    Type: Application
    Filed: April 16, 2024
    Publication date: November 14, 2024
    Inventors: Guo-Yi SHIU, Shiou-Yi KUO
  • Publication number: 20240355986
    Abstract: A micro light-emitting diode package structure and a forming method thereof are provided. The micro light-emitting diode package structure includes micro light-emitting diode dies, a light-transmitting layer, a first insulating layer, redistribution layers, and conductive elements. The micro light-emitting diode dies are disposed side by side and each includes an electrode surface, a light-emitting surface, and side surfaces. The electrode surface and the light-emitting surface are opposite to each other, and the side surfaces are between them. The light-transmitting layer covers the light-emitting surface and the side surfaces. The first insulating layer is under the micro light-emitting diode dies and in direct contact with the electrode surface. The redistribution layers are disposed under the first insulating layer and pass through the first insulating layer to electrically connect the electrode surface.
    Type: Application
    Filed: April 11, 2024
    Publication date: October 24, 2024
    Inventors: Shiou-Yi KUO, Guo-Yi SHIU, Chin-Hung LO, Chih-Hao LIN, Cheng-Hsien LI, Wei-Yuan MA
  • Publication number: 20240313180
    Abstract: A micro light-emitting diode pixel structure and a method for forming the same are provided. The micro light emitting diode pixel structure includes micro light emitting diode chips, redistribution layers, bonding pads, an insulating layer, a flexible material layer and a first hard mask pattern. The redistribution layers are electrically connected to electrode surfaces of the micro light-emitting diode chips. The bonding pads are disposed under the redistribution layers. The insulation layer is disposed between the redistribution layers and the bonding pads. The flexible material layer disposed on the insulating layer to cover the micro light-emitting diode chips, the redistribution layers and insulation layer. The first hard mask pattern is disposed under or above the flexible material layers. In a cross-sectional view, the first hard mask pattern has a first edge and the flexible material layer has a second edge flush with the first edge.
    Type: Application
    Filed: October 31, 2023
    Publication date: September 19, 2024
    Inventors: Shiou-Yi KUO, Guo-Yi SHIU
  • Publication number: 20240274764
    Abstract: A light-emitting element includes light-emitting diode (LED) chip with a first and second surface opposite to each other, and sidewalls connecting the first and second surface. The light-emitting element further includes an insulation structure covering the first surface, the second surface, and the sidewalls. The light-emitting element further includes multiple connection pads disposed on the first surface. In a cross-sectional view, the insulation layer includes a plurality of protrusion portions disposed on the sidewalls. Each of the protrusion portions protrudes from the sidewalls and extends laterally with a protrusion length. The protrusion length of one of the plurality of protrusion portions is different from that of another one of the plurality of protrusion portions.
    Type: Application
    Filed: April 11, 2024
    Publication date: August 15, 2024
    Inventors: Jih-Kang CHEN, Shiou-Yi KUO
  • Publication number: 20240258467
    Abstract: A light emitting diode (LED) package includes a substrate, at least one micro LED chip, a black material layer, and a transparent material layer. The substrate has a width ranging from 100 micrometers to 1000 micrometers. The at least one micro LED chip is electrically mounted on a top surface of the substrate and has a width ranging from 1 micrometer to 100 micrometers. The black material layer covers the top surface of the substrate to expose the at least one micro LED chip. The transparent material layer covers the at least one micro LED chip and the black material layer.
    Type: Application
    Filed: April 9, 2024
    Publication date: August 1, 2024
    Inventors: Te-Chung WANG, Shiou-Yi KUO
  • Patent number: 11984544
    Abstract: A light-emitting element includes light-emitting diode (LED) chip with a first and second surface opposite to each other, and sidewalls connecting the first and second surface. The light-emitting element further includes a first insulation layer disposed on and covering the first surface and one part of the sidewalls. The light-emitting element further includes multiple connection pads physically contact the first surface and protruding from the first insulation layer, as well as a second insulation layer disposed on and covering the second surface and the other part of the sidewalls. The second insulation layer includes a cover portion and protrusion portions. The cover portion covers the whole second surface and the other part of the sidewalls. The protrusion portions are disposed on the sidewalls, protrude from the cover portion and extend laterally.
    Type: Grant
    Filed: August 27, 2021
    Date of Patent: May 14, 2024
    Assignee: Lextar Electronics Corporation
    Inventors: Jih-Kang Chen, Shiou-Yi Kuo
  • Patent number: 11978832
    Abstract: A light emitting diode (LED) package includes a substrate, at least one micro LED chip, a black material layer, and a transparent material layer. The substrate has a width ranging from 100 micrometers to 1000 micrometers. The at least one micro LED chip is electrically mounted on a top surface of the substrate and has a width ranging from 1 micrometer to 100 micrometers. The black material layer covers the top surface of the substrate to expose the at least one micro LED chip. The transparent material layer covers the at least one micro LED chip and the black material layer.
    Type: Grant
    Filed: February 21, 2023
    Date of Patent: May 7, 2024
    Assignee: Lextar Electronics Corporation
    Inventors: Te-Chung Wang, Shiou-Yi Kuo
  • Publication number: 20240128414
    Abstract: A light-emitting device is provided. The light-emitting device includes a light-emitting unit and a light-conversion structure disposed on the light-emitting unit, wherein the light-conversion structure includes a quantum dot layer and an etching blocking layer disposed on one of the surfaces of the quantum dot layer.
    Type: Application
    Filed: October 6, 2023
    Publication date: April 18, 2024
    Inventors: Shiou-Yi KUO, Chin-Hung LUNG, Yu-Chun LEE, Hung-Chun TONG
  • Publication number: 20230299056
    Abstract: A light-emitting diode device including a pixel structure including first, second and third light-emitting diode chips, a passivation layer, and first, second, third and fourth circuit layers is provided. The first and second light-emitting diode chips are positioned on a top surface opposite to a light-emitting surface of the third light-emitting diode chip. First and second vertical projections of the first and second light-emitting diode chips on the top surface do not overlap each other. First and second bonding surfaces of the first and second circuit layers corresponding to openings in the passivation layer are positioned to overlap the first vertical projection and are separated from the second vertical projection. Third and fourth bonding surfaces of the third and fourth circuit layers that correspond to openings in the passivation layer are positioned to overlap the second vertical projection and are separated from the first vertical projection.
    Type: Application
    Filed: March 17, 2023
    Publication date: September 21, 2023
    Inventors: Shiou-Yi KUO, Te-Chung WANG, Guo-Yi SHIU
  • Publication number: 20230260979
    Abstract: A pixel package is provided. The pixel package includes a flexible redistribution layer and a plurality of LED chips arranged on the surface of the flexible redistribution layer in a flip-chip manner. The pixel package also includes a plurality of light-adjusting layers respectively disposed on the LED chips. The pixel package further includes a plurality of flexible composite laminates disposed on the surface of the flexible redistribution layer and between the LED chips.
    Type: Application
    Filed: May 9, 2022
    Publication date: August 17, 2023
    Inventors: Fu-Hsin CHEN, Yu-Chun LEE, Cheng-Ta KUO, Jian-Chin LIANG, Tzong-Liang TSAI, Shiou-Yi KUO, Chien-Nan YEH
  • Publication number: 20230207744
    Abstract: A light emitting diode (LED) package includes a substrate, at least one micro LED chip, a black material layer, and a transparent material layer. The substrate has a width ranging from 100 micrometers to 1000 micrometers. The at least one micro LED chip is electrically mounted on a top surface of the substrate and has a width ranging from 1 micrometer to 100 micrometers. The black material layer covers the top surface of the substrate to expose the at least one micro LED chip. The transparent material layer covers the at least one micro LED chip and the black material layer.
    Type: Application
    Filed: February 21, 2023
    Publication date: June 29, 2023
    Inventors: Te-Chung WANG, Shiou-Yi KUO
  • Publication number: 20230197905
    Abstract: A light-emitting device includes a substrate, a plurality of light-emitting diode (LED) dies, a first reflection layer, and a second reflection layer. The LED dies are on the substrate. The first reflection layer is on the LED dies. The second reflection layer is on the first reflection layer. The first reflection layer is configured to reflect a waveband of light emitted from the LED dies. The second reflection layer is configured to reflect a laser waveband, wherein the wavelength of the laser waveband is less than 420 nm.
    Type: Application
    Filed: December 8, 2022
    Publication date: June 22, 2023
    Inventors: Jih-Kang CHEN, Shiou-Yi KUO, Guo-Yi SHIU
  • Patent number: 11664483
    Abstract: A light-emitting device includes a micro light-emitting diode chip (micro LED chip), a first electrical connecting layer, a second electrical connecting layer and a housing layer. The micro LED chip includes a light exit surface, a bottom surface opposite to the light exit surface and first and second electrodes located on the bottom surface. The first and second electrical connecting layers respectively connect to the first and second electrodes and extend along two opposite sidewalls to two sides of a perimeter of the light exit surface. The housing layer encloses the micro LED chip and the first and second electrical connecting layer. The light exit surface of the micro LED chip and top surfaces of the first and second electrical connecting layers are not enclosed by the housing layer.
    Type: Grant
    Filed: October 23, 2020
    Date of Patent: May 30, 2023
    Assignee: Lextar Electronics Corporation
    Inventors: Shiou-Yi Kuo, Jian-Chin Liang, Jo-Hsiang Chen, Chih-Hao Lin
  • Publication number: 20230155062
    Abstract: A package structure is provided. The package structure has a light-emitting region and a non-light-emitting region that is adjacent to the light-emitting region, and includes a substrate, a first light-emitting layer, a second light-emitting layer and a third light-emitting layer. The first light-emitting layer, the second light-emitting layer and the third light-emitting layer are sequentially stacked on the substrate. Each of the first light-emitting layer, the second light-emitting layer and the third light-emitting layer includes a transparent adhesive layer disposed in the light-emitting region, a light-emitting diode (LED) chip disposed on the transparent adhesive layer, a redistribution layer formed on the LED chip and extending from the light-emitting region to the non-light-emitting region, and a planarization layer disposed on the LED chip and the redistribution layer.
    Type: Application
    Filed: September 13, 2022
    Publication date: May 18, 2023
    Inventors: Kang-Hung LIU, Chih-Hao LIN, Shiou-Yi KUO
  • Publication number: 20230131636
    Abstract: Embodiments provide a micro light-emitting diode package structure and a method for forming the same. The micro light-emitting diode package structure includes a redistribution layer, a control device, micro light-emitting diodes, and a flexible material layer. The control device and the micro light-emitting diodes are disposed on and electrically connected to the redistribution layer. The flexible material layer covers the control device and the micro light-emitting diodes, wherein the micro light-emitting diodes are in contact with the flexible material layer.
    Type: Application
    Filed: October 20, 2022
    Publication date: April 27, 2023
    Inventors: Shiou-Yi KUO, Guo-Yi SHIU, Chih-Hao LIN, Min-Che TSAI, Jian-Chin LIANG
  • Patent number: 11631788
    Abstract: A light-emitting diode structure for improving bonding yield is provided, which includes a light-emitting diode, a plurality of contact electrodes, an insulating layer structure, and a plurality of bonding electrodes. One surface of the light-emitting diode includes a mesa structure. The contact electrodes are on the mesa structure. The bonding electrodes are on the insulating layer structure and respectively cover at least one contact electrode. A surface of one of the bonding electrodes facing away from the light-emitting diode has a first platform and a second platform. The second platform is on the first platform. A surface area of a vertical projection of the second platform on the light-emitting diode is smaller than that of the first platform on the light-emitting diode, and said vertical projection of the second platform is within that of the first platform.
    Type: Grant
    Filed: November 30, 2020
    Date of Patent: April 18, 2023
    Assignee: Lextar Electronics Corporation
    Inventor: Shiou-Yi Kuo
  • Patent number: 11616173
    Abstract: A light emitting diode (LED) package includes a substrate, at least one micro LED chip, a black material layer, and a transparent material layer. The substrate has a width ranging from 100 micrometers to 1000 micrometers. The at least one micro LED chip is electrically mounted on a top surface of the substrate and has a width ranging from 1 micrometer to 100 micrometers. The black material layer covers the top surface of the substrate to expose the at least one micro LED chip. The transparent material layer covers the at least one micro LED chip and the black material layer.
    Type: Grant
    Filed: May 5, 2021
    Date of Patent: March 28, 2023
    Assignee: Lextar Electronics Corporation
    Inventors: Te-Chung Wang, Shiou-Yi Kuo
  • Publication number: 20230070973
    Abstract: A package structure, a display device, and manufacturing methods thereof are provided. A package structure includes a conductive element, a first dielectric layer, a redistribution layer, a second dielectric layer, a light-shielding layer, a conductive layer, and a light-emitting diode unit. The first dielectric layer is disposed on the conductive element. The redistribution layer is disposed on the first dielectric layer. The redistribution layer is electrically connected to the conductive element. The second dielectric layer is disposed on the first dielectric layer. The light-shielding layer is disposed on the second dielectric layer. The conductive layer is disposed on the redistribution layer and includes a first conductive portion with a light reflectivity of less than 30%. The light-emitting diode unit is disposed on the conductive layer.
    Type: Application
    Filed: September 7, 2022
    Publication date: March 9, 2023
    Inventors: Chih-Hao LIN, Jo-Hsiang CHEN, Wei-Yuan MA, Hui-Ru WU, Min-Che TSAI, Shiou-Yi KUO, Jian-Chin LIANG