Patents by Inventor Shiro Honda

Shiro Honda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200363817
    Abstract: An autonomous moving apparatus control system including a range sensor, a reflection plate, and a control unit. The range sensor is installed in a cage of an elevator and detects a distance to an object by receiving reflected light of signal light applied to the object. The reflection plate is disposed in an elevator hall of a floor on which the elevator stops, and reflects the signal light. The control unit determines whether or not a mobile robot, which is an autonomous moving apparatus, can get on and off the elevator based on a detected distance, the detected distance being a distance to the reflection plate detected by the range sensor.
    Type: Application
    Filed: April 1, 2020
    Publication date: November 19, 2020
    Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Tomohisa TAKAI, Yuhei YAMAGUCHI, Satoshi TOYOSHIMA, Yuta WATANABE, Mikio HONDA, Shiro ODA, Tetsuya TAIRA, Nobuhisa OTSUKI
  • Publication number: 20200363802
    Abstract: An autonomous moving body includes: a determination unit configured to determine that the autonomous moving body has arrived at a waiting area on a current floor before the autonomous moving body gets on a car of the elevator; an orientation adjustment unit configured to adjust, when the determination unit determines that the autonomous moving body has arrived at the waiting area, an orientation of the autonomous moving body based on an exiting direction from the car on a destination floor; and a movement controller configured to cause, when the car arrives, the autonomous moving body to enter the car while maintaining the orientation adjusted by the orientation adjustment unit.
    Type: Application
    Filed: April 9, 2020
    Publication date: November 19, 2020
    Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Tomohisa TAKAI, Yuhei YAMAGUCHI, Satoshi TOYOSHIMA, Yuta WATANABE, Mikio HONDA, Shiro ODA, Tetsuya TAIRA, Nobuhisa OTSUKI
  • Patent number: 10717831
    Abstract: A two-component type epoxy resin composition for a fiber reinforced composite material is a two-component type epoxy resin composition for a fiber reinforced composite material that includes the following components [A] to [C], wherein the content of the component [C] is 6 to 25 mass parts relative to 100 mass parts of the component [A]. The fiber reinforced composite material is a fiber reinforced composite material made by combining and curing the two-component type epoxy resin composition for the fiber reinforced composite material and a reinforcing fiber, [A]: an epoxy resin, [B]: an acid anhydride and [C]: a quaternary ammonium salt or a quaternary phosphonium halide or an imidazolium salt.
    Type: Grant
    Filed: March 25, 2016
    Date of Patent: July 21, 2020
    Assignee: Toray Indusries, Inc.
    Inventors: Hideki Oka, Nobuyuki Tomioka, Shiro Honda
  • Patent number: 10400077
    Abstract: A reinforcing fiber fabric substrate has a binder containing a thermosetting resin [A] and a curing catalyst [B] at a basis weight of 0.1 g/m2-4 g/m2 on at least the surface of a reinforcing fiber fabric constructed of reinforcing fiber strands, wherein the reinforcing fiber fabric substrate has a heating temperature (T) in the 80-180° C. range, and the adhesive strength becomes 0.5 N/25 mm or higher at the heating temperature (T) between preform layers molded by laminating this reinforcing fiber fabric substrate at the heating temperature (T).
    Type: Grant
    Filed: November 13, 2014
    Date of Patent: September 3, 2019
    Assignee: Toray Industries, Inc.
    Inventors: Masanori Hirano, Nobuyuki Tomioka, Shiro Honda
  • Patent number: 10266411
    Abstract: A method of producing a carbon nanotube-containing composition is a method of producing a carbon nanotube-containing composition for synthesizing carbon nanotube aggregates by introducing a ferrocene derivative, a sulfur compound, a carbon source, and a carrier gas into a gas phase flowing in a heating furnace within a temperature range of higher than 1,200° C. to 1,800° C. The carbon source substantially consists of benzene or toluene. The carrier gas includes hydrogen at 10% by volume to 85% by volume. The carrier gas has a linear velocity of 500 cm/min to 2,200 cm/min.
    Type: Grant
    Filed: July 13, 2016
    Date of Patent: April 23, 2019
    Assignee: Toray Industries, Inc.
    Inventors: Takayoshi Hirai, Kenshi Miyaura, Hidekazu Nishino, Shiro Honda
  • Patent number: 10053575
    Abstract: A binder resin composition for preform production includes thermosetting resin [A], thermoplastic resin [B], and curing catalyst [C], thermosetting resin [A] containing a bifunctional epoxy resin, thermoplastic resin [B] accounting for 10 to 100 parts by mass relative to 100 parts by mass of thermosetting resin [A], and curing catalyst [C] being at least one curing catalyst selected from the group consisting of organic phosphorus compounds, imidazole, and derivatives thereof.
    Type: Grant
    Filed: July 3, 2013
    Date of Patent: August 21, 2018
    Assignee: Toray Industries, Inc.
    Inventors: Masanori Hirano, Nobuyuki Tomioka, Shiro Honda
  • Publication number: 20180170758
    Abstract: A method of producing a carbon nanotube-containing composition is a method of producing a carbon nanotube-containing composition for synthesizing carbon nanotube aggregates by introducing a ferrocene derivative, a sulfur compound, a carbon source, and a carrier gas into a gas phase flowing in a heating furnace within a temperature range of higher than 1,200° C. to 1,800° C. The carbon source substantially consists of benzene or toluene. The carrier gas includes hydrogen at 10% by volume to 85% by volume. The carrier gas has a linear velocity of 500 cm/min to 2,200 cm/min.
    Type: Application
    Filed: July 13, 2016
    Publication date: June 21, 2018
    Inventors: Takayoshi Hirai, Kenshi Miyaura, Hidekazu Nishino, Shiro Honda
  • Publication number: 20180057645
    Abstract: A two-component type epoxy resin composition for a fiber reinforced composite material is a two-component type epoxy resin composition for a fiber reinforced composite material that includes the following components [A] to [C], wherein the content of the component [C] is 6 to 25 mass parts relative to 100 mass parts of the component [A]. The fiber reinforced composite material is a fiber reinforced composite material made by combining and curing the two-component type epoxy resin composition for the fiber reinforced composite material and a reinforcing fiber, [A]: an epoxy resin, [B]: an acid anhydride and [C]: a quaternary ammonium salt or a quaternary phosphonium halide or an imidazolium salt.
    Type: Application
    Filed: March 25, 2016
    Publication date: March 1, 2018
    Inventors: Hideki Oka, Nobuyuki Tomioka, Shiro Honda
  • Publication number: 20160289406
    Abstract: A reinforcing fiber fabric substrate has a binder containing a thermosetting resin [A] and a curing catalyst [B] at a basis weight of 0.1 g/m2-4 g/m2 on at least the surface of a reinforcing fiber fabric constructed of reinforcing fiber strands, wherein the reinforcing fiber fabric substrate has a heating temperature (T) in the 80-180° C. range, and the adhesive strength becomes 0.5 N/25 mm or higher at the heating temperature (T) between preform layers molded by laminating this reinforcing fiber fabric substrate at the heating temperature (T).
    Type: Application
    Filed: November 13, 2014
    Publication date: October 6, 2016
    Applicant: Toray Industries, Inc.
    Inventors: Masanori Hirano, Nobuyuki Tomioka, Shiro Honda
  • Publication number: 20160237273
    Abstract: A two-pack epoxy resin composition for a fiber-reinforced composite material, which composition includes the following components [A] to [D], and in which the mass compounding ratio of component [A] and component [B] is 5:95-50:50, there is provided a fiber-reinforced composite material which has exceptional workability during resin preparation, exceptional stability of viscosity of the resin composition at low temperatures, and exceptional impregnation properties such that low viscosity is maintained during injection into reinforcing fibers, and which cures with a short time during molding, and has high dimensional stability and exceptional heat resistance.
    Type: Application
    Filed: September 19, 2014
    Publication date: August 18, 2016
    Inventors: Hideki Oka, Nobuyuki Tomioka, Shiro Honda
  • Patent number: 9309352
    Abstract: An epoxy resin composition for RTM molding of a fiber-reinforced composite material includes [A] to [D] below, wherein [A]/[B], which is a blend mass ratio of [A] to [B], is in the range of 55/45 to 95/5: [A] a multifunctional epoxy resin that is liquid at normal temperature or has a softening point of 65° C. or lower, the multifunctional epoxy resin being at least one selected from phenol novolac epoxy resin, cresol novolac epoxy resin, and triphenylmethane epoxy resin; [B] an alicyclic epoxy resin; [C] an acid anhydride curing agent; and [D] a curing accelerator.
    Type: Grant
    Filed: January 20, 2012
    Date of Patent: April 12, 2016
    Assignee: Toray Industries, Inc.
    Inventors: Hideki Oka, Nobuyuki Tomioka, Shiro Honda
  • Patent number: 9243139
    Abstract: An epoxy resin composition comprising an epoxy resin [A], an amine-based curing agent [B] and a block copolymer [C] as components, wherein the epoxy resin [A] contains [Aa] an epoxy resin having at least one structure selected from a condensed polycyclic structure, biphenyl structure and oxazolidone ring structure; [Ab] an epoxy resin selected from a polyfunctional amine type epoxy resin [Ab1] and a liquid bisphenol type epoxy resin [Ab2], and the block copolymer [C] is at least one block copolymer selected from the group consisting of S-B-M, B-M and M-B-M. The present invention provides an epoxy resin composition that can be cured to form a cured product excellent in heat resistance, elastic modulus and toughness.
    Type: Grant
    Filed: December 12, 2013
    Date of Patent: January 26, 2016
    Assignee: TORAY INDUSTRIES, INC.
    Inventors: Maki Nagano, Nobuyuki Tomioka, Takayuki Imaoka, Shiro Honda
  • Publication number: 20150322257
    Abstract: A binder resin composition for preform production includes thermosetting resin [A], thermoplastic resin [B], and curing catalyst [C], thermosetting resin [A] containing a bifunctional epoxy resin, thermoplastic resin [B] accounting for 10 to 100 parts by mass relative to 100 parts by mass of thermosetting resin [A], and curing catalyst [C] being at least one curing catalyst selected from the group consisting of organic phosphorus compounds, imidazole, and derivatives thereof.
    Type: Application
    Filed: July 3, 2013
    Publication date: November 12, 2015
    Inventors: Masanori Hirano, Nobuyuki Tomioka, Shiro Honda
  • Publication number: 20150017450
    Abstract: A resin composition which contains at least constituent elements (A)-(E) described below and wherein the epoxy resin (A) contains 80-100% by mass of a bifunctional epoxy resin and component (D) is contained in an amount of 60-85% by mass relative to 100% by mass of the total mass of the resin composition. This resin composition does not substantially contain a solvent and is in a liquid state at room temperature. (A) an epoxy rein (B) an amine-based curing agent (C) an accelerator that has at least one functional group selected from among a dimethylureide group, an imidazole group and a tertiary amino group (D) silica particles (E) a silane coupling agent Provided is a resin composition which has excellent curability at low temperatures and a sufficiently low linear expansion coefficient after curing. This resin composition does not suffer from warping in cases where applied to a copper thin film and molded, and does not suffer from separation or cracks even if a substrate obtained therefrom is bent.
    Type: Application
    Filed: January 21, 2013
    Publication date: January 15, 2015
    Inventors: Hideki Oka, Nobuyuki Tomioka, Shiro Honda
  • Publication number: 20140100320
    Abstract: An epoxy resin composition comprising an epoxy resin [A], an amine-based curing agent [B] and a block copolymer [C] as components, wherein the epoxy resin [A] contains [Aa] an epoxy resin having at least one structure selected from a condensed polycyclic structure, biphenyl structure and oxazolidone ring structure; [Ab] an epoxy resin selected from a polyfunctional amine type epoxy resin [Ab1] and a liquid bisphenol type epoxy resin [Ab2], and the block copolymer [C] is at least one block copolymer selected from the group consisting of S-B-M, B-M and M-B-M. The present invention provides an epoxy resin composition that can be cured to form a cured product excellent in heat resistance, elastic modulus and toughness.
    Type: Application
    Filed: December 12, 2013
    Publication date: April 10, 2014
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Maki NAGANO, Nobuyuki TOMIOKA, Takayuki IMAOKA, Shiro HONDA
  • Patent number: 8658736
    Abstract: An epoxy resin composition comprising an epoxy resin [A], an amine-based curing agent [B] and a block copolymer [C] as components, wherein the epoxy resin [A] contains [Aa] an epoxy resin having at least one structure selected from a condensed polycyclic structure, biphenyl structure and oxazolidone ring structure; [Ab] an epoxy resin selected from a polyfunctional amine type epoxy resin [Ab1] and a liquid bisphenol type epoxy resin [Ab2], and the block copolymer [C] is at least one block copolymer selected from the group consisting of S-B-M, B-M and M-B-M. The present invention provides an epoxy resin composition that can be cured to form a cured product excellent in heat resistance, elastic modulus and toughness.
    Type: Grant
    Filed: September 29, 2009
    Date of Patent: February 25, 2014
    Assignee: Toray Industries, Inc.
    Inventors: Shiro Honda, Noriyuki Hirano, Jun Misumi, Kaori Narimatsu
  • Publication number: 20130303661
    Abstract: An epoxy resin composition for RTM molding of a fiber-reinforced composite material includes [A] to [D] below, wherein [A]/[B], which is a blend mass ratio of [A] to [B], is in the range of 55/45 to 95/5: [A] a multifunctional epoxy resin that is liquid at normal temperature or has a softening point of 65° C. or lower, the multifunctional epoxy resin being at least one selected from phenol novolac epoxy resin, cresol novolac epoxy resin, and triphenylmethane epoxy resin; [B] an alicyclic epoxy resin; [C] an acid anhydride curing agent; and [D] a curing accelerator.
    Type: Application
    Filed: January 20, 2012
    Publication date: November 14, 2013
    Applicant: Toray Industries, Inc.
    Inventors: Hideki Oka, Nobuyuki Tomioka, Shiro Honda
  • Publication number: 20130281573
    Abstract: Provided are: a fiber-reinforced composite material which has mode I interlaminar fracture toughness, mode II interlaminar fracture toughness and compressive strength under heat and humidity conditions at the same time; an epoxy resin composition for obtaining the fiber-reinforced composite material; and a prepreg which is obtained using the epoxy resin composition. An epoxy resin composition for fiber-reinforced composite materials, which contains at least the following constituent elements (A), (B), (C) and (D). (A) An epoxy resin (B) Resin particles that satisfy the following conditions (b1)-(b3) and are insoluble in an epoxy resin (b1) The particle size distribution index is 1.0-1.8. (b2) The particle sphericity is 90 or more. (b3) The glass transition temperature of the particles is 80-180° C. (C) At least one elastomer component that is selected from among block copolymers containing a block having a glass transition temperature of 20° C.
    Type: Application
    Filed: January 20, 2012
    Publication date: October 24, 2013
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Yuko Goto, Nobuyuki Tomioka, Yuji Echigo, Hiroaki Sakata, Shiro Honda, Hiroshi Taiko
  • Patent number: 8338535
    Abstract: The present invention relates to an epoxy resin composition comprising the following [A], [A?], [B], and [C]: [A] a bisphenol-type epoxy resin having a glass transition temperature or melting point of 50° C. or higher; [A?] an epoxy resin which is in a liquid state at 25° C.; [B] an epoxy resin curing agent; and [C] at least one block copolymer selected from the group consisting of S-B-M, B-M, and M-B-M, wherein the blocks are linked to each other by a covalent bond or by an intermediate molecule bound to one of the blocks via one covalent bond formation and to the other block via another covalent bond formation; the block M is a methyl methacrylate homopolymer or a copolymer comprising at least 50% by weight of methyl methacrylate; the block B is incompatible with the block M and has a glass transition temperature of 20° C.
    Type: Grant
    Filed: June 25, 2007
    Date of Patent: December 25, 2012
    Assignee: Toray Industries, Inc.
    Inventors: Hiroaki Sakata, Nobuyuki Tomioka, Shiro Honda
  • Patent number: 8309631
    Abstract: It is an object of the present invention to provide a fiber reinforced composite material combining good properties such as toughness and impact resistance and to provide an epoxy resin composition to obtain this. This object is achieved by the an epoxy resin composition comprising the following [A], [B], [C], and [D]: [A] a diglycidyl ether-type epoxy resin having a molecular weight of 1,500 or more; [B] an epoxy resin in which an SP value of a structural unit thereof is greater by 1.5 to 6.5 than an SP value of a structural unit of [A]; [C] a diglycidyl ether-type epoxy resin having a molecular weight of 500 to 1,200; and [D] an epoxy resin curing agent, in a ratio that satisfies the following formulas (1) to (4): 0.2?A/(A+B+C+E)?0.6;??(1), 0.2?B/(A+B+C+E)?0.6;??(2), 0.15?C/(A+B+C+E)?0.4; and??(3), 0?E/(A+B+C+E)?0.2,??(4) wherein A, B, and C represent weights of [A], [B], and [C], respectively, and E represents a weight of an epoxy resin other than [A], [B], and [C].
    Type: Grant
    Filed: February 26, 2009
    Date of Patent: November 13, 2012
    Assignee: Toray Industries, Inc.
    Inventors: Nobuyuki Tomioka, Shiro Honda, Yuki Mitsutsuji, Maki Mizuki, Takayuki Imaoka