Abstract: A semiconductor device according to the embodiments includes: a first substrate having a plurality of first through-holes; a plurality of first electrodes provided on the first substrate to be adjacent to the respective first through-holes; a plurality of second electrodes provided on the first substrate to be adjacent to the respective first through-holes and to face the respective first electrodes; and a second substrate provided to face the first substrate, the second substrate having a plurality of second through-holes facing the respective first through-holes, at least a surface of the second substrate facing the first substrate having conductivity, the second substrate being electrically connected to the second electrodes.

Abstract: A semiconductor device according to an embodiment includes a semiconductor chip including a region having through holes; a substrate having a first opening larger than the region, the substrate containing a resin or a ceramic; a spacer provided between the semiconductor chip and the substrate, the spacer having a second opening larger than the region; a first bond provided between the semiconductor chip and the spacer; and a second bond provided between the spacer and the substrate.

Abstract: A semiconductor device according to the embodiments includes: a first substrate having a plurality of first through-holes; a plurality of first electrodes provided on the first substrate to be adjacent to the respective first through-holes; a plurality of second electrodes provided on the first substrate to be adjacent to the respective first through-holes and to face the respective first electrodes; and a second substrate provided to face the first substrate, the second substrate having a plurality of second through-holes facing the respective first through-holes, at least a surface of the second substrate facing the first substrate having conductivity, the second substrate being electrically connected to the second electrodes.

Abstract: A semiconductor apparatus according to an embodiment is a semiconductor apparatus including substrate having a recess provided at a first substrate face, a plurality of through holes provided in a predetermined region of the recess, and a plurality of protrusions provided on the recess in the predetermined region.

Abstract: A semiconductor apparatus according to an embodiment is a semiconductor apparatus including substrate having a recess provided at a first substrate face, a plurality of through holes provided in a predetermined region of the recess, and a plurality of protrusions provided on the recess in the predetermined region.

Abstract: Cloth member fastener (1) may comprise tongue(s) (30) having engagement projection(s) (32) comprising head portion(s) (33) and neck portion(s) (34); loop frame(s) (10) comprising capturing hole(s) (13) for capturing engagement projection(s) (32) and made up of narrow capturing hole region(s) (13b) through which only neck portion(s) (34) can pass, and wide insertion hole region(s) (13a) through which head portion(s) (33) and neck portion(s) (34) can pass; stopper hinge shaft(s) (22) extending in horizontal direction(s) and disposed toward base end(s); and hinging stopper(s) (20) coupled in hinged fashion by means of hinge structure(s) with respect to loop frame(s) (10) due to the fact that stopper hinge shaft(s) (22) is/are wrapped about between pair(s) of hinge holes (15a, 15b) of loop frame(s) (10) by bent portion(s) (39) of tongue(s) (30). When closed, hinging stopper(s) (20) may cover wide insertion hole region(s) (13a) and inhibit movement of engagement projection(s) (32).

Abstract: A semiconductor device according to an embodiment includes a semiconductor chip including a region having through holes; a substrate having a first opening larger than the region, the substrate containing a resin or a ceramic; a spacer provided between the semiconductor chip and the substrate, the spacer having a second opening larger than the region; a first bond provided between the semiconductor chip and the spacer; and a second bond provided between the spacer and the substrate.

Abstract: Cloth member fastener 1 in accordance with one embodiment may comprise tongue(s) 30 having engagement projection(s) 32 comprising head portion(s) 33 and neck portion(s) 34; loop frame(s) 10 which may comprise capturing hole(s) 13 for capturing engagement projection(s) 32 and which may be made up of narrow capturing hole region(s) 13b through which only neck portion(s) 34 can pass, and wide insertion hole region(s) 13a through which head portion(s) 33 and neck portion(s) 34 can pass; and stopper hinge shaft(s) 22 which may extend in horizontal direction(s) and which may be disposed toward base end(s); and may comprise hinging stopper(s) 20 which may be coupled in hinged fashion by means of hinge structure(s) with respect to loop frame(s) 10 as a result of the fact that stopper hinge shaft(s) 22 may be wrapped about between pair(s) of hinge holes 15a, 15b of loop frame(s) 10 by bent portion(s) 39 of tongue(s) 30, hinging stopper(s) 20 optionally being constituted so as to, when in closed state(s), cover wide in

Abstract: Male undergarment (penis retainer) 50 associated with one embodiment comprises tubular cloth member 55, which is a retainer main body; front connecting cord 58a, which is a connecting member for installing the retainer main body on a human body, one end of front connecting cord 58a being attached to the lower side of a front open portion of tubular cloth member 55; clip 59a, which is attached to the tip of front connecting cord 58a; back connecting cord 58b, one end of which is attached to the upper side of a back open portion of tubular cloth member 55; and clip 59b, which is attached to the tip of back connecting cord 58b. When securing the penis, the penis is inserted into the interior of tubular cloth member 55.

Abstract: A semiconductor device includes a mounting member that includes first and second regions. First peripheral portions are provided along at least a portion of an outer periphery of the first region. A second peripheral portion is provided between at least one first peripheral portion and at least another first peripheral portion. The first peripheral portions and second peripheral portion are provided in the second region. A partition wall is provided at least on one of the first peripheral portions. A semiconductor chip is mounted on the first region via solder.

Abstract: A male undergarment for securing a penis may comprise tubular cloth penis retaining member(s); pouch-like scrotum retaining member(s) enveloping penis retaining member(s); front connecting cord(s) secured to region(s) at front(s) of penis retaining member(s) and scrotum retaining member(s); and back connecting cord(s) secured to region(s) at back(s) of penis retaining member(s) and scrotum retaining member(s). Front connecting cord(s) may comprise cord(s) for retaining the penis; and cord(s) for retaining the scrotum. There may also be opening(s) formed at back end(s) of penis retaining member(s) and scrotum retaining member(s). Back end(s) of penis retaining member(s) and back end(s) of scrotum retaining member(s) may be mutually connected and secured.

Abstract: [Problem] To provide a conventionally unavailable novel penis securing method and a penis retainer for implementing this novel penis securing method. [Solution Means] Male undergarment (penis retainer) 50 associated with the present embodiment comprises tubular cloth member 55, which is a retainer main body; front connecting cord 58a, which is a connecting member for installing the retainer main body on a human body, one end of front connecting cord 58a being attached to the lower side of a front open portion of tubular cloth member 55; clip 59a, which is attached to the tip of front connecting cord 58a; back connecting cord 58b, one end of which is attached to the upper side of a back open portion of tubular cloth member 55; and clip 59b, which is attached to the tip of back connecting cord 58b. When securing the penis, the penis is inserted into the interior of tubular cloth member 55.

Abstract: A resin-encapsulation method of the present invention for electronic parts by a stencil printing, in which a resin filling opening in a stencil is filled with a resin while a squeegee is being moved over the stencil, is characterized in that elevation control of the squeegee is made in a finish printing process at a position close to an end portion of the resin filling opening on a squeegee movement terminal side so as to scrape the excess of the filing resin out of the resin filling opening.

Abstract: A resin-encapsulation method of the present invention for electronic parts by a stencil printing, in which a resin filling opening in a stencil is filled with a resin while a squeezee is being moved over the stencil, is characterized in that elevation control of the squeezee is made in a finish printing process at a position close to an end portion of the resin filling opening on a squeezee movement terminal side so as to scrape the excess of the filing resin out of the resin filling opening.

Abstract: A coffee roasting apparatus is disclosed. The apparatus includes a coffee roasting drum which is operatively connected to a driving mechanism to cause the drum to rotate. The drum comprises a cylindrical element having an upper opening, a bottom opening and a bottom plate placed below the bottom opening to control the opening and closing of the bottom opening. An infrared heater is placed above the upper opening of the drum and an electrical heating element is placed below the drum at a position slightly above the lowermost portion of the drum. Coffee beans which are roasted by the radiation hearing of the infrared heater and the air which passes through the electrical heat element are discharged into a box through a gap defined between the bottom opening of the cylindrical element and the bottom plate.