Patents by Inventor Shiuh-Hui Steven Chen
Shiuh-Hui Steven Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11573143Abstract: A pressure sensing element, including a substrate, a device layer coupled to the substrate, a diaphragm being part of the device layer, and a plurality of piezoresistors coupled to the diaphragm. A plurality of bond pads is disposed on the device layer, and an electrical field shield is bonded to the top of device layer and at least one of the bond pads. At least one stress adjustor is part of the electrical field shield, where the stress adjustor is a cut-out constructed and arranged to reduce thermal hysteresis of the pressure sensing element caused by stress relaxation of the electrical field shield during a cooling and heating cycle. The stress adjustor may be a thin film deposited on top of the electrical field shield, which may apply residual stress to the piezoresistors. The pressure sensing element may include a cavity integrally formed as part of the substrate.Type: GrantFiled: April 21, 2021Date of Patent: February 7, 2023Assignee: VITESCO TECHNOLOGIES USA, LLCInventors: Jen-Huang Albert Chiou, Shiuh-Hui Steven Chen
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Publication number: 20220341799Abstract: A pressure sensing element, including a substrate, a device layer coupled to the substrate, a diaphragm being part of the device layer, and a plurality of piezoresistors coupled to the diaphragm. A plurality of bond pads is disposed on the device layer, and an electrical field shield is bonded to the top of device layer and at least one of the bond pads. At least one stress adjustor is part of the electrical field shield, where the stress adjustor is a cut-out constructed and arranged to reduce thermal hysteresis of the pressure sensing element caused by stress relaxation of the electrical field shield during a cooling and heating cycle. The stress adjustor may be a thin film deposited on top of the electrical field shield, which may apply residual stress to the piezoresistors. The pressure sensing element may include a cavity integrally formed as part of the substrate.Type: ApplicationFiled: April 21, 2021Publication date: October 27, 2022Applicant: Vitesco Technologies USA, LLCInventors: Jen-Huang Albert Chiou, Shiuh-Hui Steven Chen
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Patent number: 11029227Abstract: A pressure sensing element includes a supporting substrate including a cavity. A device layer is bonded to the supporting substrate, with a diaphragm of the device layer covering the cavity in a sealed manner. A plurality of piezoresistors is coupled to the diaphragm. A plurality of metal stress equalizers is disposed on the device layer such that each stress equalizer is generally adjacent to, but separated from, a corresponding piezoresistor. A plurality of metal bond pads is disposed on the device layer. The plurality of stress equalizers are constructed and arranged to reduce thermal hysteresis of the pressure sensing element caused by stress relaxation of the metal bond pads during a cooling and heating cycle of the pressure sensing element.Type: GrantFiled: September 6, 2018Date of Patent: June 8, 2021Assignee: Vitesco Technologies USA, LLCInventors: Jen-Huang Albert Chiou, Shiuh-Hui Steven Chen
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Publication number: 20190368956Abstract: A pressure sensing element includes a supporting substrate including a cavity. A device layer is bonded to the supporting substrate, with a diaphragm of the device layer covering the cavity in a sealed manner. A plurality of piezoresistors is coupled to the diaphragm. A plurality of metal stress equalizers is disposed on the device layer such that each stress equalizer is generally adjacent to, but separated from, a corresponding piezoresistor. A plurality of metal bond pads is disposed on the device layer. The plurality of stress equalizers are constructed and arranged to reduce thermal hysteresis of the pressure sensing element caused by stress relaxation of the metal bond pads during a cooling and heating cycle of the pressure sensing element.Type: ApplicationFiled: September 6, 2018Publication date: December 5, 2019Applicant: Continental Automotive Systems, Inc.Inventors: Jen-Huang Albert Chiou, Shiuh-Hui Steven Chen
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Patent number: 10221062Abstract: An improved microelectromechanical system (MEMS) pressure sensing device has an extended shallow polygon cavity on a top side of a silicon supporting substrate. A buried silicon dioxide layer is formed between the top side of the supporting substrate and a bottom side of a device layer. Piezoresistors and bond pads are formed and located on a top side of the device layer and produce measureable voltage changes responsive to a fluid pressure applied to the device layer. The purpose of the extend shallow polygon cavity is to improve the sensitivity or increase the span while keep a low pressure nonlinearity during shrinking the die size of the MEMS pressure sensing device die with corner metal bond pads having a keep-out distance to prevent a wire bonder from breaking the thin diaphragm.Type: GrantFiled: October 3, 2016Date of Patent: March 5, 2019Assignee: Continental Automotive Systems, Inc.Inventors: Jen-Huang Albert Chiou, Shiuh-Hui Steven Chen
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Patent number: 10060820Abstract: Suspending a microelectromechanical system (MEMS) pressure sensing element inside a cavity using spring-like corrugations or serpentine crenellations, reduces thermally-mismatched mechanical stress on the sensing element. Overlaying the spring-like structures and the sensing element with a gel further reduces thermally-mismatched stress and vibrational dynamic stress.Type: GrantFiled: July 13, 2016Date of Patent: August 28, 2018Assignee: Continental Automotive Systems, Inc.Inventors: Shiuh-Hui Steven Chen, Jen-Huang Albert Chiou, Robert C. Kosberg, Daniel Roy Empen
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Patent number: 9964458Abstract: The voltage output span and sensitivity from a MEMS pressure sensor are increased and pressure nonlinearity is reduced by thinning a diaphragm and forming the diaphragm to include anchors that are not connected to or joined to diaphragm-stiffening beams or thickened regions of the diaphragm.Type: GrantFiled: May 12, 2016Date of Patent: May 8, 2018Assignee: Continental Automotive Systems, Inc.Inventors: Jen-Huang Albert Chiou, Shiuh-Hui Steven Chen
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Publication number: 20180093881Abstract: An improved microelectromechanical system (MEMS) pressure sensing device has an extended shallow polygon cavity on a top side of a silicon supporting substrate. A buried silicon dioxide layer is formed between the top side of the supporting substrate and a bottom side of a device layer. Piezoresistors and bond pads are formed and located on a top side of the device layer and produce measureable voltage changes responsive to a fluid pressure applied to the device layer. The purpose of the extend shallow polygon cavity is to improve the sensitivity or increase the span while keep a low pressure nonlinearity during shrinking the die size of the MEMS pressure sensing device die with corner metal bond pads having a keep-out distance to prevent a wire bonder from breaking the thin diaphragm.Type: ApplicationFiled: October 3, 2016Publication date: April 5, 2018Inventors: Jen-Huang Albert Chiou, Shiuh-Hui Steven Chen
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Patent number: 9846096Abstract: Electrical and mechanical noise in a microelectromechanical system (MEMS) pressure sensor are reduced by the symmetrical distribution of bond pads, conductive vias and interconnects and by the elimination of bond wires used in the prior art to connect a MEMS pressure sensing element to an application specific integrated circuit (ASIC). The bond wires are eliminated by using conductive vias to connect an ASIC to a MEMS pressure sensing element. Extraneous electrical noise is suppressed by conductive rings that surround output signal bond pads and a conductive loop that surrounds the conductive rings and bond pads. The conductive rings and loop are connected to a fixed voltage or ground potential.Type: GrantFiled: March 28, 2016Date of Patent: December 19, 2017Assignee: Continental Automotive Systems, Inc.Inventors: Shiuh-Hui Steven Chen, Robert C Kosberg, Jen-Huang Albert Chiou
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Patent number: 9846095Abstract: In a microelectromechanical system (MEMS) pressure sensor, thin and fragile bond wires that are used in the prior art to connect a MEMS pressure sensing element to an application specific integrated circuit (ASIC) for the input and output signals between these two chips are replaced by stacking the ASIC on the MEMS pressure sensing element and connecting each other using conductive vias formed in the ASIC. Gel used to protect the bond wires, ASIC and MEMS pressure sensing element can be eliminated if bond wires are no longer used. Stacking the ASIC on the MEMS pressure sensing element and connecting them using conductive vias enables a reduction in the size and cost of a housing in which the devices are placed and protected.Type: GrantFiled: March 28, 2016Date of Patent: December 19, 2017Assignee: Continental Automotive Systems, Inc.Inventors: Jen-Huang Albert Chiou, Robert C Kosberg, Shiuh-Hui Steven Chen
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Publication number: 20170328797Abstract: The voltage output span and sensitivity from a MEMS pressure sensor are increased and pressure nonlinearity is reduced by thinning a diaphragm and forming the diaphragm to include anchors that are not connected to or joined to diaphragm-stiffening beams or thickened regions of the diaphragm.Type: ApplicationFiled: May 12, 2016Publication date: November 16, 2017Inventors: Jen-Huang Albert Chiou, Shiuh-Hui Steven Chen
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Patent number: 9764947Abstract: The voltages output from a low-pressure MEMS sensor are increased by increasing the sensitivity of the sensor. Sensitivity is increased by thinning the diaphragm of the low pressure sensor device. Nonlinearity increased by thinning the diaphragm is reduced by simultaneously creating a cross stiffener on the top side of the diaphragm. An over-etch of the top side further increases sensitivity.Type: GrantFiled: November 3, 2015Date of Patent: September 19, 2017Assignee: Continental Automotive Systems, Inc.Inventors: Jen-Huang Albert Chiou, Shiuh-Hui Steven Chen
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Publication number: 20170176278Abstract: Suspending a microelectromechanical system (MEMS) pressure sensing element inside a cavity using spring-like corrugations or serpentine crenellations, reduces thermally-mismatched mechanical stress on the sensing element. Overlaying the spring-like structures and the sensing element with a gel further reduces thermally-mismatched stress and vibrational dynamic stress.Type: ApplicationFiled: July 13, 2016Publication date: June 22, 2017Inventors: Shiuh-Hui Steven Chen, Jen-Huang Albert Chiou, Robert C. Kosberg, Daniel Roy Empen
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Patent number: 9651441Abstract: The voltages output from a low-pressure MEMS sensor are increased by increasing the sensitivity of the sensor. Sensitivity is increased by thinning the diaphragm of the low pressure sensor device with corner trench. Nonlinearity increased by thinning the diaphragm is reduced by simultaneously creating a cross stiffener to the bottom side of the diaphragm. A rim, anchors, and a stiffener pad can also be added to further stiffen the thinner diaphragm and further reduce pressure nonlinearity.Type: GrantFiled: May 5, 2015Date of Patent: May 16, 2017Assignee: Continental Automotive Systems, Inc.Inventors: Jen-Huang Albert Chiou, Shiuh-Hui Steven Chen
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Publication number: 20160320255Abstract: In a microelectromechanical system (MEMS) pressure sensor, thin and fragile bond wires that are used in the prior art to connect a MEMS pressure sensing element to an application specific integrated circuit (ASIC) for the input and output signals between these two chips are replaced by stacking the ASIC on the MEMS pressure sensing element and connecting each other using conductive vias formed in the ASIC. Gel used to protect the bond wires, ASIC and MEMS pressure sensing element can be eliminated if bond wires are no longer used. Stacking the ASIC on the MEMS pressure sensing element and connecting them using conductive vias enables a reduction in the size and cost of a housing in which the devices are placed and protected.Type: ApplicationFiled: March 28, 2016Publication date: November 3, 2016Inventors: Jen-Huang Albert Chiou, Robert C. Kosberg, Shiuh-Hui Steven Chen
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Publication number: 20160299025Abstract: Electrical and mechanical noise in a microelectromechanical system (MEMS) pressure sensor are reduced by the symmetrical distribution of bond pads, conductive vias and interconnects and by the elimination of bond wires used in the prior art to connect a MEMS pressure sensing element to an application specific integrated circuit (ASIC). The bond wires are eliminated by using conductive vias to connect an ASIC to a MEMS pressure sensing element. Extraneous electrical noise is suppressed by conductive rings that surround output signal bond pads and a conductive loop that surrounds the conductive rings and bond pads. The conductive rings and loop are connected to a fixed voltage or ground potential.Type: ApplicationFiled: March 28, 2016Publication date: October 13, 2016Inventors: Shiuh-Hui Steven Chen, Robert C. Kosberg, Jen-Huang Albert Chiou
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Patent number: 9395259Abstract: In a MEMS PRT having a diaphragm that is located offset from the center of the die, thermally-induced thermal noise in the output of a Wheatstone bridge circuit is reduced by locating the Wheatstone bridge circuit away from the largest area of the die and supporting pedestal.Type: GrantFiled: October 23, 2013Date of Patent: July 19, 2016Assignee: Continental Automotive Systems, Inc.Inventors: Jen-Huang Albert Chiou, Xiaoyi Ding, Shiuh-Hui Steven Chen, Jeffrey J. Frye
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Publication number: 20160146685Abstract: The voltages output from a low-pressure MEMS sensor are increased by increasing the sensitivity of the sensor. Sensitivity is increased by thinning the diaphragm of the low pressure sensor device. Nonlinearity increased by thinning the diaphragm is reduced by simultaneously creating a cross stiffener on the top side of the diaphragm. An over-etch of the top side further increases sensitivity.Type: ApplicationFiled: November 3, 2015Publication date: May 26, 2016Inventors: Jen-Huang Albert Chiou, Shiuh-Hui Steven Chen
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Publication number: 20150330856Abstract: The voltages output from a low-pressure MEMS sensor are increased by increasing the sensitivity of the sensor. Sensitivity is increased by thinning the diaphragm of the low pressure sensor device with corner trench. Nonlinearity increased by thinning the diaphragm is reduced by simultaneously creating a cross stiffener to the bottom side of the diaphragm. A rim, anchors, and a stiffener pad can also be added to further stiffen the thinner diaphragm and further reduce pressure nonlinearity.Type: ApplicationFiled: May 5, 2015Publication date: November 19, 2015Inventors: Jen-Huang Albert Chiou, Shiuh-Hui Steven Chen
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Patent number: 8881596Abstract: An MEMS pressure sensor is designed to reduce or eliminate thermal noise, such as temperature offset voltage output. The pressure sensor includes a pressure sensing element having a diaphragm, and a cavity formed as part of the pressure sensing element, where the cavity receives a fluid such that the diaphragm at least partially deflects. The pressure sensing element also includes a plurality of piezoresistors, which are operable to generate a signal based on the amount of deflection in the diaphragm. At least one trench is integrally formed as part of the pressure sensing element, and an adhesive connects the pressure sensing element to the at least one substrate such that at least a portion of the adhesive is attached to the trench and redistributes thermally induced stresses on the pressure sensing element such that the thermally induced noise is substantially eliminated.Type: GrantFiled: January 30, 2012Date of Patent: November 11, 2014Assignee: Continental Automotive Systems, Inc.Inventors: Jen-Huang Albert Chiou, Shiuh-Hui Steven Chen