Abstract: The present concerns a method of fabricating a layer for an organic light emitting device comprising solution processing a layer from a solution comprising a small molecule emissive material, an aprotic solvent, and a polymeric material.

Abstract: There is provided a new process for forming a light-emitting diode device having first, second, and third subpixel areas. In the process a hole injection layer is applied over an anode layer. The hole injection material has a conductive polymer and a fluorinated acid polymer. A hole transport layer is applied over the hole injection layer. A first electroluminescent material which is either green or red, is applied to the first subpixel areas. A second electroluminescent material which is either red or green, is applied to the second subpixel areas. A blue electroluminescent material is applied overall, followed by deposition of a cathode. The second electroluminescent material emits a color different from that of the first electroluminescent material.

Abstract: An electronic device can include a charge-selective layer and an organic active layer. In one embodiment, the electronic device can include a first pixel including a charge-transport layer, and a first portion of a first organic active layer and a second pixel including a second portion of the first organic active layer and substantially none of the charge-transport layer. In another embodiment, the process of forming the electronic device can include selectively depositing a charge-transport layer over the first electrode and not the second electrode, and depositing a second organic active layer over the first electrode and the second electrode. In yet another embodiment, the process can include liquid depositing a first charge selective layer over a first and second electrode and forming a second charge selective layer over the second electrode and not the first electrode.

Abstract: An electronic device can include an organic device layer having a first and a second portion. In one embodiment, the first portion can have a higher resistivity than the second portion and lie between a first and a second electrode and include not more than 15 mole percent basic material. In a particular embodiment, the first and the second electrode can be an anode and cathode of a pixel. In another particular embodiment, the first and the second electrode can be either both anodes or both cathodes of different pixels. In another embodiment, the organic device layer can include a large molecule material. In still another embodiment, a process of forming the electronic device can include selectively modifying the first portion of the organic device layer.

Abstract: There is provided a new process for forming a light-emitting diode device having first, second, and third subpixel areas. In the process a hole injection layer is applied over an anode layer. The hole injection material has a conductive polymer and a fluorinated acid polymer. A hole transport layer is applied over the hole injection layer. A first electroluminescent material which is either green or blue, is applied to the first subpixel areas. A second electroluminescent material which is either blue or green, is applied to the second subpixel areas. A red electroluminescent material is applied overall, followed by deposition of a cathode. The second electroluminescent material emits a color different from that of the first electroluminescent material.

Abstract: A fingerprint-sensing device with a sensor array that does not use active switching elements is fabricated on a base. Sensor support integrated circuits, which contain processing and addressing circuitry, are separately fabricated and subsequently mounted on the base, establishing electrical connections with an interconnect structure within the base, and are thus not integrated with the sensor array. The sensor support integrated circuits can be covered by a bezel structure and the sensor array by a covering material. In addition, a connection cable can be provided to connect the sensor array and the sensor support integrated circuits with a power source and to other external devices and to convey signals generated by the sensor array to the external devices.

Abstract: Provided are organic n-doped electron transport layers comprising at least one electron transport material and at least one electron rich dopant material and organic p-doped hole transport layers comprising at least one hole transport material and at least one electron deficient dopant material.

Abstract: An electronic device can include an organic active layer and an electrode. In one aspect, the electrode can further include a first layer that is conductive, and a second layer that is conductive. The second layer can include a defect extending at least partly through a thickness of the second conductive layer. The electrode can also include a third layer lying within and substantially filling the defect, wherein each of the second and third layers includes a same metallic element. In another aspect, a process for forming an electronic device can include forming an organic active layer and forming a first layer that is conductive and is part of an electrode. The process can also include forming a second layer and exposing the second layer to a first plasma to form a first compound from the second layer.

Abstract: A process for forming an organic electronic device includes the steps of: (a) forming a first conductive member and a conductive lead over a substrate, wherein the first conductive member and conductive lead are spaced apart from each other; (b) forming an organic layer over the substrate, the first conductive member, and the conductive lead; (c) forming a patterned conductive layer over the organic layer, wherein the patterned conductive layer includes a second conductive member, and the patterned conductive layer creates an exposed portion of the organic layer and an unexposed portion of the organic layer; and (d) dry etching at least the exposed portion of the organic layer to expose a portion of the conductive lead using at least one oxygen-containing gas, wherein dry etching is performed at a pressure in a range of approximately 0.01 to 7.5 mTorr.

Abstract: An electronic device or a process of forming an electronic device can include a first electrode configured to achieve low Lbackground or include a black layer. An electronic device can include a substrate including a user surface. The electronic device can also include a first electrode that includes a first layer, a second layer, and a third layer. The second layer can lie between the first and third layers, and the first electrode can be configured to achieve low Lbackground. The electronic device can further include a second electrode lying farther from the user surface as compared to the first electrode. In another embodiment, a first electrode can include a first layer and a second layer. The second layer can set the work function of the electrode, and the second layer can be a black layer. Processes can be used to form the electronic devices.

Abstract: An electronic device includes a substrate including a pixel driving circuit, a first conductive member, and a second conductive member. The first and second conductive members are spaced apart, the first conductive member is connected to the pixel driving circuit, and the second conductive member can be part of a power transmission line. The electronic device also includes an electronic component that includes a first electrode that contacts the first conductive member, a second electrode that is connected to but does not contact the second conductive member, and an organic layer lying between the first and second electrodes. The electronic device also includes a third conductive member that is connected to the second electrode and the second conductive member, and contacts the second conductive member. In one embodiment, a process for forming the electronic device uses the second electrode as a hardmask when removing portions of the first organic layer.

Abstract: An electronic device includes a substrate including a pixel driving circuit, a first conductive member, and a second conductive member. The first and second conductive members are spaced apart, the first conductive member is connected to the pixel driving circuit, and the second conductive member can be part of a power transmission line. The electronic device also includes an electronic component that includes a first electrode that contacts the first conductive member, a second electrode that is connected to but does not contact the second conductive member, and an organic layer lying between the first and second electrodes. The electronic device also includes a third conductive member that is connected to the second electrode and the second conductive member, and contacts the second conductive member. In one embodiment, a process for forming the electronic device uses the second electrode as a hardmask when removing portions of the first organic layer.

Abstract: A process for forming an electronic device includes forming a first layer over a substrate, wherein the first layer includes an organic layer, and depositing a second layer over the substrate after forming the first layer, wherein depositing the second layer is performed using ion beam sputtering. In another embodiment, a process for forming an electronic device includes placing a workpiece within a depositing chamber of a depositing apparatus, wherein the workpiece includes a substrate and an organic layer overlying the workpiece. The process includes generating a plasma within a plasma-generating chamber of the depositing apparatus, wherein the plasma is not in direct contact with the workpiece. The process also includes sending an ion beam from the plasma-generating chamber towards a target within the depositing chamber, wherein the target includes a material, and depositing a layer of the material over the organic layer.

Abstract: An electronic device includes a substrate including a pixel driving circuit, a first conductive member, and a second conductive member. The first and second conductive members are spaced apart, the first conductive member is connected to the pixel driving circuit, and the second conductive member can be part of a power transmission line. The electronic device also includes an electronic component that includes a first electrode that contacts the first conductive member, a second electrode that is connected to but does not contact the second conductive member, and an organic layer lying between the first and second electrodes. The electronic device also includes a third conductive member that is connected to the second electrode and the second conductive member, and contacts the second conductive member. In one embodiment, a process for forming the electronic device uses the second electrode as a hardmask when removing portions of the first organic layer.

Abstract: The present invention provides a pressure sensing device that includes at least one TMR sensor, and preferably an array of TMR sensors, with each TMR sensor having an insulating spacer layer interposed between a pinned and a free ferromagnetic layer. In an unbiased state, the magnetization vector of each of the ferromagnetic layers is preferably parallel to each other. Upon application of a small voltage, the magnetization vectors remain unchanged. Upon application of stress, the magnetization vector of the free magnetic layer will rotate, thus causing a corresponding and proportionally related change in the resistance of the sensor. This change in resistance can be sensed and used to calculate the stress applied thereto.

Abstract: An organic electronic device comprising (a) a conductive lead, (b) an organic layer, (c) a first conductive member overlying the organic layer, wherein a side of the first conductive member closest to the conductive lead and a side of the organic layer closest to the conductive lead are substantially coterminous with each other and from a plan view, the conductive lead and the first conductive member are spaced apart from each other, and (d) a second conductive member that electrically connects the first conductive member to the conductive lead.

Abstract: A modified atomic force microscope (AFM) is used to perform contact resistance and/or current-dependent stiction measurements for conductive thin films at controlled values of applied force. The measurements are preferably performed under conditions approximating the operation of the thin films as electrodes in microswitch array fingerprint sensors. A first, planar thin film is contacted with a second, curved thin film deposited over a round ball having a diameter of a few microns to a few tens of microns. The second film is preferably a coating deposited over the ball and over the arm controlling the ball motion. The coating deposited over the arm provides an electrically conductive path to the contact surface of the ball.

Abstract: A method of making an integrated texture sensor for sensing a texture is described. In one embodiment, the method is directed to a sensor that that is protected from external contaminating particulates and will self-equalize using air from outside the sensor. Further combinations of such protection among various membrane switches, in combination with various types of membranes, is described. In another embodiment, a method of making a skin-texture sensor for sensing a skin texture having a plurality of ridges and a plurality of valleys is described, such that when completed, applying a ridge of the texture to a membrane switch will cause flexure of the membrane resulting in a contact between the lower electrode and the upper electrode, the contact establishing an electrical communication between said one of the row lines and said one of the column lines, whereas disposing a valley of the texture over said each membrane switch will not result in the contact between the lower electrode and the upper electrode.

Abstract: The invention relates to conductive polymer composites comprising a first layer comprising at least one electrically doped conductive polymer and a second layer comprising at least one material selected from a colloid-forming polymeric acid, a salt of a colloid-forming polymeric acid, a non-polymeric fluorinated organic acid, and a salt of a non-polymeric fluorinated organic acid.

Abstract: A method of dry etching a performance sensitive element of an organic electronic device, said method comprising the steps of: (a) having at least one performance sensitive element on the substrate spaced apart from a first conductive member, wherein at least one of the performance sensitive elements is a conductive lead; (b) placing organic material on the performance sensitive element and the first conductive member, (c) forming a patterned conductive layer over the organic material exposing a predetermined portion of the performance sensitive elements; and (d) dry etching the organic material in the exposed areas of the performance sensitive elements using at least one oxygen-containing gas, and organic electronic device created using said process.