Patents by Inventor Shiyojiro Kodai

Shiyojiro Kodai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4879153
    Abstract: An IC card has a laminated card body in which an IC module is housed. The card body is formed by lamination of a plurality of sheets, at least the sheet which contacts the bottom surface of the IC module being made of a synthetic paper having good flexing resistance. The remaining sheets are made of a rigid polyvinyl chloride. The card body is formed by conventional laminating processes.
    Type: Grant
    Filed: September 8, 1988
    Date of Patent: November 7, 1989
    Assignees: Ryoden Kasei Co., Ltd., Mitsubishi Denki Kabushiki Kaisha
    Inventors: Masato Ohashi, Shiyojiro Kodai