Patents by Inventor Sho Masuzima

Sho Masuzima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4192061
    Abstract: A process and apparatus for the manufacture of a continuous web of parallel lead electronic components is provided. Wire for the leads of the components is straightened, cut into uniform predetermined lengths, formed into a U-shaped leadwire and fed onto a continuous moving support band. The parallel leads of the U-shaped lead wires are secured to the support band by adhesive tape at the same time the spacing between the parallel leads is controlled to insure dimensional accuracy. The parallel leads of the open end of the formed lead wires are formed with a cross-over portion and an electronic component element is connected to the formed end.
    Type: Grant
    Filed: September 12, 1977
    Date of Patent: March 11, 1980
    Assignee: Tokyo Denki Kagaku Kogyo Kabushiki Kaisha
    Inventors: Sho Masuzima, Hisashi Fujita
  • Patent number: 4062719
    Abstract: An apparatus for manufacturing from a cassette which initially has a continuous leader extending between and connected to a pair of rotary hubs thereof and from an elongated flexible information material carrying information which can be extracted from the material a cassette which has a length of the information material stored in the cassette with opposed ends of the information material connected with leaders which are respectively connected to the rotary hubs of the cassette.
    Type: Grant
    Filed: April 2, 1976
    Date of Patent: December 13, 1977
    Assignee: Tokyo Denki Kagaku Kogyo Kabushiki Kaisha
    Inventors: Sho Masuzima, Shuhei Yoshida, Toshiyuki Yaguchi, Tetsuya Fuchiguchi
  • Patent number: 4054988
    Abstract: A machine for processing and securing parallel lead electronic circuit elements into lead receiving openings formed in a printed circuit board is provided. The machine includes a supply assembly for selectively supplying one group of a plurality of distinct groups of parallel lead electronic circuit elements, the supply assembly including a selecting sub-assembly for selecting one of the circuit elements from the selected group circuit elements to be supplied. A transfer assembly includes a chuck for receiving the supplied circuit elements and displacing same to a release position. An insert assembly is adapted to effect release of the circuit elements when the chuck is displaced to a release position and includes a holding sub-assembly for receiving each circuit element released by the chuck at the release position and a plunger sub-assembly adapted to engage the circuit elements at the release position and displace the circuit elements from the release position to an inserted position.
    Type: Grant
    Filed: April 2, 1976
    Date of Patent: October 25, 1977
    Assignee: Tokyo Denki Kagaku Kogyo Kabushiki Kaisha
    Inventors: Sho Masuzima, Tetsuo Takahashi, Yoshinobu Taguchi, Hisashi Fujita