Patents by Inventor Shogo Kawamura

Shogo Kawamura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210277814
    Abstract: An exhaust gas purification catalyst including an alkaline-earth metal carried on a porous carrier in a highly dispersed state. The catalyst layer of the exhaust gas purification catalyst has an alkaline-earth metal carrying region including a porous carrier, Pt, and a sulfuric acid salt of at least one alkaline-earth metal carried on the porous carrier, wherein a value of RAe/Pt is 0.5 or more, where RAe/Pt represents the Pearson's correlation coefficient calculated using ? and ? in each pixel obtained by, for a cross section of the region, performing the area analysis by FE-EPMA under the conditions of: pixel size 0.34 ?m×0.34 ?m; and number of measured pixels 256×256; and measuring an intensity (?: cps) of a characteristic X ray of an element (Ae) of the alkaline-earth metal and an intensity (?: cps) of a characteristic X ray of Pt for each pixel.
    Type: Application
    Filed: September 9, 2019
    Publication date: September 9, 2021
    Applicants: CATALER CORPORATION, TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Shogo KAWAMURA, Tomomasa AIKAWA, Isao NAITO, Hiroki NIHASHI, Nobuyuki TAKAGI, Takeshi NOBUKAWA
  • Patent number: 10654269
    Abstract: A liquid ejection head includes an element substrate including an energy-generating element that applies ejection energy to liquid, a first electric wiring board electrically connected to the element substrate, and a second electric wiring board on which an integrated circuit element is mounted and which is electrically connected to the first electric wiring board. An electric signal is supplied to the integrated circuit element mounted on the second electric wiring board through the first electric wiring board, processed by the integrated circuit element, and supplied to the energy-generating element through the second electric wiring board and the first electric wiring board.
    Type: Grant
    Filed: June 12, 2018
    Date of Patent: May 19, 2020
    Assignee: Canon Kabushiki Kaisha
    Inventors: Shin Ishimatsu, Toshiaki Hirosawa, Genji Inada, Hiromasa Amma, Shogo Kawamura, Yasuhiko Osaki, Takuya Iwano
  • Patent number: 10618280
    Abstract: A liquid ejection head includes an element substrate including an energy-generating element that applies ejection energy to liquid, a first electric wiring board electrically connected to the element substrate, and a second electric wiring board on which an integrated circuit element is mounted and which is electrically connected to the first electric wiring board. An electric signal is supplied to the integrated circuit element mounted on the second electric wiring board through the first electric wiring board, processed by the integrated circuit element, and supplied to the energy-generating element through the second electric wiring board and the first electric wiring board.
    Type: Grant
    Filed: June 12, 2018
    Date of Patent: April 14, 2020
    Assignee: Canon Kabushiki Kaisha
    Inventors: Shin Ishimatsu, Toshiaki Hirosawa, Genji Inada, Hiromasa Amma, Shogo Kawamura, Yasuhiko Osaki, Takuya Iwano
  • Patent number: 10589531
    Abstract: A liquid ejection head can suppress the influence of static electricity and the increase of a mounting force as well as downsize and save space of the liquid ejection head. The liquid ejection head is attachable and detachable with respect to a body connector provided on a liquid ejection apparatus body. Further, the liquid ejection head includes a head connector including a terminal which can be electrically connected to the body connector and a grounding member which is held at a coverage position where the terminal is covered in a non-contacting state with the body connector. The grounding member is formed with a deformable electroconductive member, and, as the head connector is made to move to a mounting position with respect to the body connector, is pressed by the body connector and is displaced to a position apart from the coverage position. Thus, the body connector can be connected with the terminal.
    Type: Grant
    Filed: August 22, 2018
    Date of Patent: March 17, 2020
    Assignee: Canon Kabushiki Kaisha
    Inventors: Shogo Kawamura, Takuya Iwano
  • Publication number: 20200030780
    Abstract: The present invention provides an exhaust gas purification catalyst including an alkaline earth metal supported in a highly dispersed state on a porous carrier. A catalyst layer of the exhaust gas purification catalyst provided by the invention has an alkaline earth metal-supporting region including a porous carrier, a catalyst metal belonging to the platinum group, and a sulfate of at least one type of alkali earth metal supported on the porous carrier. In a cross-section of this region, a Pearson correlation coefficient RAe/M is at least 0.5 as calculated using ? and ? for each pixel obtained by carrying out area analysis by FE-EPMA under conditions of pixel size of 0.34 ?m×0.34 ?m, and measured pixel number 256×256, and by measuring the characteristic X-ray intensity (?: cps) of the alkaline earth metal element (Ae) and the characteristic X-ray intensity (?: cps) of the main constituent element of the inorganic compound constituting the porous carrier for each pixel.
    Type: Application
    Filed: April 9, 2018
    Publication date: January 30, 2020
    Inventors: Shunsuke Oishi, Shogo KAWAMURA, Takahiro NAGATA, Hirotaka ORI, Minoru ITOU
  • Patent number: 10507644
    Abstract: A liquid ejecting head including a print element substrate including an ejection opening for ejecting a liquid, a wiring member including wiring electrically connected to the print element substrate, a connection electrically connecting the print element substrate to the wiring member, a support member supporting the wiring member, a sealing material sealing the connection, and a cover member provided on the support member. In the liquid ejecting head, the wiring member is a strip-shaped member, and a portion of the wiring member provided on a surface of the support member that supports the wiring member is covered by the sealing material and the cover member.
    Type: Grant
    Filed: April 19, 2018
    Date of Patent: December 17, 2019
    Assignee: Canon Kabushiki Kaisha
    Inventors: Shogo Kawamura, Toshiaki Hirosawa, Genji Inada, Hiromasa Amma, Yasuhiko Osaki, Takuya Iwano, Shin Ishimatsu
  • Patent number: 10471728
    Abstract: A page-wide liquid ejection head configured to be removably installed in a main body of a liquid ejection apparatus includes a connection part for liquid through which a liquid is supplied from the main body and an electrical connector through which an electric signal is supplied from the main body. In the liquid ejection head, the connection part for liquid and the electrical connector are located at one side of the liquid ejection head in the longitudinal direction and are provided to face different directions from each other.
    Type: Grant
    Filed: June 1, 2018
    Date of Patent: November 12, 2019
    Assignee: Canon Kabushiki Kaisha
    Inventors: Genji Inada, Toshiaki Hirosawa, Hiromasa Amma, Shogo Kawamura, Yasuhiko Osaki, Shin Ishimatsu, Takuya Iwano
  • Patent number: 10391767
    Abstract: A page-wide type liquid ejection head includes a plurality of recording element substrates, each having an ejection port array including a plurality of ejection ports, each ejection port communicating with a pressure chamber including therein a recording element, and a liquid supply path for supplying a liquid to the pressure chamber. The liquid ejection head also includes a flow path member mounting the recording element substrates arranged thereon. The flow path member includes common supply flow paths and individual supply flow paths that connect the liquid supply path to the common supply flow paths, and the individual supply flow paths include portions running obliquely to the direction orthogonal to the longitudinal direction of the liquid ejection head.
    Type: Grant
    Filed: July 5, 2018
    Date of Patent: August 27, 2019
    Assignee: Canon Kabushiki Kaisha
    Inventors: Yasuhiko Osaki, Toshiaki Hirosawa, Genji Inada, Hiromasa Amma, Shogo Kawamura, Takuya Iwano, Shin Ishimatsu
  • Publication number: 20190070849
    Abstract: An object of the present invention is to provide a liquid ejection head which can achieve suppressing the influence of static electricity and the increase of a mounting force as well as downsizing and space saving of the liquid ejection head. The liquid ejection head is attachable and detachable with respect to a body connector provided on a liquid ejection apparatus body. Further, the liquid ejection head includes a head connector including a terminal which can be electrically connected to the body connector and a grounding member which is held at a coverage position where the terminal is covered in a non-contacting state with the body connector. The grounding member is formed with a deformable electroconductive member, and, as the head connector is made to move to a mounting position with respect to the body connector, is pressed by the body connector and is displaced to a position apart from the coverage position. Thus, the body connector can be connected with the terminal.
    Type: Application
    Filed: August 22, 2018
    Publication date: March 7, 2019
    Inventors: Shogo Kawamura, Takuya Iwano
  • Publication number: 20190009535
    Abstract: A page-wide type liquid ejection head includes a plurality of recording element substrates, each having an ejection port array including a plurality of ejection ports, each ejection port communicating with a pressure chamber including therein a recording element, and a liquid supply path for supplying a liquid to the pressure chamber. The liquid ejection head also includes a flow path member mounting the recording element substrates arranged thereon. The flow path member includes common supply flow paths and individual supply flow paths that connect the liquid supply path to the common supply flow paths, and the individual supply flow paths include portions running obliquely to the direction orthogonal to the longitudinal direction of the liquid ejection head.
    Type: Application
    Filed: July 5, 2018
    Publication date: January 10, 2019
    Inventors: Yasuhiko Osaki, Toshiaki Hirosawa, Genji Inada, Hiromasa Amma, Shogo Kawamura, Takuya Iwano, Shin Ishimatsu
  • Publication number: 20190001674
    Abstract: The liquid ejection head 1 includes an element substrate 4 including an energy-generating element that applies ejection energy to liquid, a first electric wiring board 7 electrically connected to the element substrate 4, and a second electric wiring board 9 on which an integrated circuit element 10 is mounted and which is electrically connected to the first electric wiring board 7. An electric signal is supplied to the integrated circuit element 10 mounted on the second electric wiring board 9 through the first electric wiring board 7, processed by the integrated circuit element 10, and supplied to the energy-generating element through the second electric wiring board 9 and the first electric wiring board 7.
    Type: Application
    Filed: June 12, 2018
    Publication date: January 3, 2019
    Inventors: Shin Ishimatsu, Toshiaki Hirosawa, Genji Inada, Hiromasa Amma, Shogo Kawamura, Yasuhiko Osaki, Takuya Iwano
  • Publication number: 20180361748
    Abstract: A page-wide liquid ejection head configured to be removably installed in a main body of a liquid ejection apparatus includes a connection part for liquid through which a liquid is supplied from the main body and an electrical connector through which an electric signal is supplied from the main body. In the liquid ejection head, the connection part for liquid and the electrical connector are located at one side of the liquid ejection head in the longitudinal direction and are provided to face different directions from each other.
    Type: Application
    Filed: June 1, 2018
    Publication date: December 20, 2018
    Inventors: Genji Inada, Toshiaki Hirosawa, Hiromasa Amma, Shogo Kawamura, Yasuhiko Osaki, Shin Ishimatsu, Takuya Iwano
  • Publication number: 20180304620
    Abstract: A liquid ejecting head including a print element substrate including an ejection opening for ejecting a liquid, a wiring member including wiring electrically connected to the print element substrate, a connection electrically connecting the print element substrate to the wiring member, a support member supporting the wiring member, a sealing material sealing the connection, and a cover member provided on the support member. In the liquid ejecting head, the wiring member is a strip-shaped member, and a portion of the wiring member provided on a surface of the support member that supports the wiring member is covered by the sealing material and the cover member.
    Type: Application
    Filed: April 19, 2018
    Publication date: October 25, 2018
    Inventors: Shogo Kawamura, Toshiaki Hirosawa, Genji Inada, Hiromasa Amma, Yasuhiko Osaki, Takuya Iwano, Shin Ishimatsu
  • Patent number: 10076859
    Abstract: Provided are a molding method for efficiently and accurately performing molding of a layered component made of a thermosetting resin by a simple mechanism, and molded articles. For this purpose, primary molding for molding a plurality of divided bodies and secondary molding for joining the plurality of divided bodies with one another are performed sequentially.
    Type: Grant
    Filed: April 30, 2015
    Date of Patent: September 18, 2018
    Assignee: CANON KABUSHIKI KAISHA
    Inventor: Shogo Kawamura
  • Patent number: 9878475
    Abstract: There is provided a molding method for efficiently and accurately molding a hollow part of a thermosetting resin with a simple mechanism, a mold, and a molded article. A mold used for molding of a thermosetting resin includes an upper mold, an intermediate mold, and a lower mold which can be stacked with each other. Primary molding for molding segment parts and secondary molding for bonding the segment parts are sequentially performed by placing or retracting the intermediate mold to switch between a runner for primary molding and a runner for secondary molding.
    Type: Grant
    Filed: December 5, 2014
    Date of Patent: January 30, 2018
    Assignee: CANON KABUSHIKI KAISHA
    Inventor: Shogo Kawamura
  • Patent number: 9458309
    Abstract: The invention provides a molding material including a liquid epoxy resin composition containing an epoxy resin, a curing agent or a curing catalyst, a filler, a thixotropy-imparting agent, and a wetting dispersant.
    Type: Grant
    Filed: March 31, 2015
    Date of Patent: October 4, 2016
    Assignee: CANON KABUSHIKI KAISHA
    Inventors: Isao Imamura, Yoshiyuki Shino, Shogo Kawamura
  • Publication number: 20150328810
    Abstract: Provided are a molding method for efficiently and accurately performing molding of a layered component made of a thermosetting resin by a simple mechanism, and molded articles. For this purpose, primary molding for molding a plurality of divided bodies and secondary molding for joining the plurality of divided bodies with one another are performed sequentially.
    Type: Application
    Filed: April 30, 2015
    Publication date: November 19, 2015
    Inventor: Shogo Kawamura
  • Publication number: 20150307689
    Abstract: The invention provides a molding material including a liquid epoxy resin composition containing an epoxy resin, a curing agent or a curing catalyst, a filler, a thixotropy-imparting agent, and a wetting dispersant.
    Type: Application
    Filed: March 31, 2015
    Publication date: October 29, 2015
    Inventors: Isao Imamura, Yoshiyuki Shino, Shogo Kawamura
  • Publication number: 20150174800
    Abstract: The present invention provides a resin molding method that can produce a molded product that is inexpensive and represents a small linear expansion coefficient, a high degree of resistance to various liquids and an excellent mold releasability as well as a high degree of dimensional accuracy. The resin molding method includes a step of plasticizing thermosetting resin (S2) and injecting the plasticized thermosetting resin into the cavity of a metal mold apparatus (S3), a step of curing the thermosetting resin in the cavity (S4) and a step of opening the mold (S5). The step of opening the mold (S5) is executed when the mold that forms the cavity is at a temperature not lower than the glass transition point Tg of the thermosetting resin.
    Type: Application
    Filed: November 25, 2014
    Publication date: June 25, 2015
    Inventors: Isao Imamura, Yoshiyuki Shino, Shogo Kawamura
  • Publication number: 20150165660
    Abstract: There is provided a molding method for efficiently and accurately molding a hollow part of a thermosetting resin with a simple mechanism, a mold, and a molded article. A mold used for molding of a thermosetting resin includes an upper mold, an intermediate mold, and a lower mold which can be stacked with each other. Primary molding for molding segment parts and secondary molding for bonding the segment parts are sequentially performed by placing or retracting the intermediate mold to switch between a runner for primary molding and a runner for secondary molding.
    Type: Application
    Filed: December 5, 2014
    Publication date: June 18, 2015
    Inventor: Shogo Kawamura