Patents by Inventor Shogo Matsumaru

Shogo Matsumaru has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20090081580
    Abstract: A positive type resist composition for forming a high resolution resist pattern and a method of forming a resist pattern are provided which use a low-molecular-weight material as a base component, and a compound and a dissolution inhibitor that are each suitable for the positive type resist composition. Here, the compound is a non-polymer having a molecular weight of 500 to 3000, and is decomposed under the action of an acid to produce two or more molecules of a decomposition product having a molecular weight of 200 or more; the dissolution inhibitor comprises the compound; the positive type resist composition comprises the compound and the acid generator component; and the method of forming a resist pattern uses the positive type resist composition.
    Type: Application
    Filed: April 17, 2006
    Publication date: March 26, 2009
    Applicant: TOKYO OHKA KOGYO CO., LTD
    Inventors: Daiju Shiono, Taku Hirayama, Toshiyuki Ogata, Shogo Matsumaru, Hideo Hada
  • Publication number: 20090029284
    Abstract: There are provided a coating material which improves an etching resistance of a pattern in an etching process using a pattern formed on a substrate as a mask. The material is a pattern coating material for an etching process using a pattern formed on a substrate as a mask, including a metal compound (W) which can produce a hydroxyl group on hydrolysis.
    Type: Application
    Filed: June 16, 2006
    Publication date: January 29, 2009
    Applicants: Tokyo Ohka Kogyo Co., Ltd., Riken
    Inventors: Shogo Matsumaru, Toshiyuki Ogata, Kiyoshi Ishikawa, Hideo Hada, Shigenori Fujikawa, Toyoki Kunitake
  • Patent number: 7482108
    Abstract: The invention provides a polymer compound capable of forming a positive resist composition that can form a high-resolution pattern with a reduced level of LER, an acid generator formed from such a polymer compound, a positive resist composition that includes such a polymer compound, and a method for forming a resist pattern that uses such a positive resist composition.
    Type: Grant
    Filed: July 1, 2005
    Date of Patent: January 27, 2009
    Assignee: Tokyo Ohka Kogyo Co., Ltd.
    Inventors: Shogo Matsumaru, Masaru Takeshita, Takeshi Iwai, Hideo Hada
  • Publication number: 20070231708
    Abstract: The invention provides a polymer compound capable of forming a positive resist composition that can form a high-resolution pattern with a reduced level of LER, an acid generator formed from such a polymer compound, a positive resist composition that includes such a polymer compound, and a method for forming a resist pattern that uses such a positive resist composition.
    Type: Application
    Filed: July 1, 2005
    Publication date: October 4, 2007
    Applicant: TOKYO OHKA KOGYO CO., LTD.
    Inventors: Shogo Matsumaru, Masaru Takeshita, Takeshi Iwai, Hideo Hada
  • Publication number: 20070065748
    Abstract: A resin for photoresist compositions is disclosed with excellent resolution and line edge roughness characteristics. A photoresist composition and a method for forming a resist pattern using such a resin are also disclosed. The resin has a hydroxyl group bonded to a carbon atom at a polymer terminal, and the carbon atom in the ?-position to the hydroxyl group has at least one electron attractive group.
    Type: Application
    Filed: June 2, 2003
    Publication date: March 22, 2007
    Applicant: Tokyo Ohka Kogyo Co., Ltd.
    Inventors: Hideo Hada, Masaru Takeshita, Shogo Matsumaru, Hiroaki Shimizu