Patents by Inventor Shotaro SAKUMOTO

Shotaro SAKUMOTO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210327779
    Abstract: An object is to provide a technique capable of suppressing insulation defects caused by the arrival of bubbles contained in an adhesive at a circuit pattern in a semiconductor device. A semiconductor device includes the resin-insulated copper base plate having the copper base plate, the insulating layer provided on the upper surface of the copper base plate, and the circuit pattern provided on the upper surface of the insulating layer, the semiconductor element mounted on the upper surface of the resin-insulated copper base plate, the case joined to the outer peripheral portion of the resin-insulated copper base plate via the adhesive, the sealing material sealing, in the case, the upper surface of the resin-insulated copper base plate and the semiconductor element, and the roughening patterns formed on the upper surface of the insulating layer such that the circuit pattern is enclosed therewith in a plan view.
    Type: Application
    Filed: January 21, 2021
    Publication date: October 21, 2021
    Applicant: Mitsubishi Electric Corporation
    Inventor: Shotaro SAKUMOTO
  • Patent number: 10236231
    Abstract: A semiconductor device includes a lead frame; a circuit board located on the lead frame; a power device that includes a switching element and is mounted on the circuit board via a bump located between the power device and the circuit board; and a heat releasing member connected to the power device. The circuit board may be a multi-layer wiring board. The circuit board may include a capacitor element, a resistor element, an inductor element, a diode element and a switching element.
    Type: Grant
    Filed: June 30, 2017
    Date of Patent: March 19, 2019
    Assignee: J-DEVICES CORPORATION
    Inventors: Takeshi Miyakoshi, Sumikazu Hosoyamada, Yoshikazu Kumagaya, Tomoshige Chikai, Shingo Nakamura, Hiroaki Matsubara, Shotaro Sakumoto
  • Patent number: 10134710
    Abstract: A stacked semiconductor package in an embodiment includes a first semiconductor package including a first circuit board and a first semiconductor element mounted on the first circuit board; and a second semiconductor package including a second circuit board and a second semiconductor element mounted on the second circuit board, the second semiconductor package being stacked on the first semiconductor package. The first semiconductor package further includes a sealing resin sealing the first semiconductor element; a conductive layer located in contact with the sealing resin; and a thermal via connected to the conductive layer and located on the first circuit board.
    Type: Grant
    Filed: February 2, 2017
    Date of Patent: November 20, 2018
    Assignee: J-DEVICES CORPORATION
    Inventors: Takeshi Miyakoshi, Sumikazu Hosoyamada, Yoshikazu Kumagaya, Tomoshige Chikai, Shingo Nakamura, Hiroaki Matsubara, Shotaro Sakumoto
  • Publication number: 20170301599
    Abstract: A semiconductor device includes a lead frame; a circuit board located on the lead frame; a power device that includes a switching element and is mounted on the circuit board via a bump located between the power device and the circuit board; and a heat releasing member connected to the power device. The circuit board may be a multi-layer wiring board. The circuit board may include a capacitor element, a resistor element, an inductor element, a diode element and a switching element.
    Type: Application
    Filed: June 30, 2017
    Publication date: October 19, 2017
    Applicant: J-DEVICES CORPORATION
    Inventors: Takeshi MIYAKOSHI, Sumikazu HOSOYAMADA, Yoshikazu KUMAGAYA, Tomoshige CHIKAI, Shingo NAKAMURA, Hiroaki MATSUBARA, Shotaro SAKUMOTO
  • Publication number: 20170148766
    Abstract: A stacked semiconductor package in an embodiment includes a first semiconductor package including a first circuit board and a first semiconductor element mounted on the first circuit board; and a second semiconductor package including a second circuit board and a second semiconductor element mounted on the second circuit board, the second semiconductor package being stacked on the first semiconductor package. The first semiconductor package further includes a sealing resin sealing the first semiconductor element; a conductive layer located in contact with the sealing resin; and a thermal via connected to the conductive layer and located on the first circuit board.
    Type: Application
    Filed: February 2, 2017
    Publication date: May 25, 2017
    Applicant: J-DEVICES CORPORATION
    Inventors: Takeshi MIYAKOSHI, Sumikazu HOSOYAMADA, Yoshikazu KUMAGAYA, Tomoshige CHIKAI, Shingo NAKAMURA, Hiroaki MATSUBARA, Shotaro SAKUMOTO
  • Patent number: 9635762
    Abstract: A stacked semiconductor package includes a first semiconductor package including a first circuit board and a first semiconductor device mounted on the first circuit board; a second semiconductor package including a second circuit board and a second semiconductor device mounted on the second circuit board, the second semiconductor package being stacked on the first semiconductor package; and a heat transfer member provided on the first semiconductor device and a part of the first circuit board, the part being around the first semiconductor device.
    Type: Grant
    Filed: July 20, 2015
    Date of Patent: April 25, 2017
    Assignee: J-DEVICES CORPORATION
    Inventors: Shinji Watanabe, Sumikazu Hosoyamada, Shingo Nakamura, Hiroshi Demachi, Takeshi Miyakoshi, Tomoshige Chikai, Kiminori Ishido, Hiroaki Matsubara, Takashi Nakamura, Hirokazu Honda, Yoshikazu Kumagaya, Shotaro Sakumoto, Toshihiro Iwasaki, Michiaki Tamakawa
  • Patent number: 9601450
    Abstract: A stacked semiconductor package in an embodiment includes a first semiconductor package including a first circuit board and a first semiconductor element mounted on the first circuit board; and a second semiconductor package including a second circuit board and a second semiconductor element mounted on the second circuit board, the second semiconductor package being stacked on the first semiconductor package. The first semiconductor package further includes a sealing resin sealing the first semiconductor element; a conductive layer located in contact with the sealing resin; and a thermal via connected to the conductive layer and located on the first circuit board.
    Type: Grant
    Filed: March 26, 2015
    Date of Patent: March 21, 2017
    Assignee: J-DEVICES CORPORATION
    Inventors: Takeshi Miyakoshi, Sumikazu Hosoyamada, Yoshikazu Kumagaya, Tomoshige Chikai, Shingo Nakamura, Hiroaki Matsubara, Shotaro Sakumoto
  • Patent number: 9368474
    Abstract: A manufacturing method for a semiconductor device of the present invention includes: preparing a semiconductor wafer including an electrode formed therein; electrically connecting a first semiconductor element formed in a semiconductor chip and the electrode formed in the semiconductor wafer; filling a gap between the semiconductor wafer and the semiconductor chip with a first insulating resin layer; forming a second insulating resin layer on the semiconductor wafer; grinding the second insulating resin layer and the semiconductor chip until a thickness of the semiconductor chip reaches a predetermined thickness; forming a first insulating layer on the second insulating resin layer and the semiconductor chip; forming a line on the first insulating layer connected with a conductive material filled an opening in the first insulating layer and the second insulating resin layer to expose the electrode; and grinding the semiconductor wafer until a thickness of the semiconductor wafer reaches a predetermined thickn
    Type: Grant
    Filed: September 10, 2015
    Date of Patent: June 14, 2016
    Assignee: J-DEVICES CORPORATION
    Inventors: Hiroaki Matsubara, Tomoshige Chikai, Kiminori Ishido, Takashi Nakamura, Hirokazu Honda, Hiroshi Demachi, Yoshikazu Kumagaya, Shotaro Sakumoto, Shinji Watanabe, Sumikazu Hosoyamada, Shingo Nakamura, Takeshi Miyakoshi, Toshihiro Iwasaki, Michiaki Tamakawa
  • Patent number: 9362200
    Abstract: A semiconductor package includes a support substrate arranged with a first aperture reaching a semiconductor device on a rear side, the semiconductor device is bonded via an adhesive to a surface of the support substrate, an insulating layer covering the semiconductor device, and wiring for connecting the semiconductor device and an external terminal through the insulating layer. The adhesive may form a part of the first aperture. In addition, a heat dissipation part may be arranged in the first aperture and a metal material may be filled in the first aperture.
    Type: Grant
    Filed: June 19, 2015
    Date of Patent: June 7, 2016
    Assignee: J-DEVICES CORPORATION
    Inventors: Hirokazu Honda, Shinji Watanabe, Toshihiro Iwasaki, Kiminori Ishido, Koichiro Niwa, Takeshi Miyakoshi, Sumikazu Hosoyamada, Yoshikazu Kumagaya, Tomoshige Chikai, Shingo Nakamura, Shotaro Sakumoto, Hiroaki Matsubara
  • Publication number: 20160079204
    Abstract: A manufacturing method for a semiconductor device of the present invention includes: preparing a semiconductor wafer including an electrode formed therein; electrically connecting a first semiconductor element formed in a semiconductor chip and the electrode formed in the semiconductor wafer; filling a gap between the semiconductor wafer and the semiconductor chip with a first insulating resin layer; forming a second insulating resin layer on the semiconductor wafer; grinding the second insulating resin layer and the semiconductor chip until a thickness of the semiconductor chip reaches a predetermined thickness; forming a first insulating layer on the second insulating resin layer and the semiconductor chip; forming a line on the first insulating layer connected with a conductive material filled an opening in the first insulating layer and the second insulating resin layer to expose the electrode; and grinding the semiconductor wafer until a thickness of the semiconductor wafer reaches a predetermined thickn
    Type: Application
    Filed: September 10, 2015
    Publication date: March 17, 2016
    Inventors: Hiroaki Matsubara, Tomoshige Chikai, Kiminori Ishido, Takashi Nakamura, Hirokazu Honda, Hiroshi Demachi, Yoshikazu Kumagaya, Shotaro Sakumoto, Shinji Watanabe, Sumikazu Hosoyamada, Shingo Nakamura, Takeshi Miyakoshi, Toshihiro Iwasaki, Michiaki Tamakawa
  • Publication number: 20160027715
    Abstract: A stacked semiconductor package includes a first semiconductor package including a first circuit board and a first semiconductor device mounted on the first circuit board; a second semiconductor package including a second circuit board and a second semiconductor device mounted on the second circuit board, the second semiconductor package being stacked on the first semiconductor package; and a heat transfer member provided on the first semiconductor device and a part of the first circuit board, the part being around the first semiconductor device.
    Type: Application
    Filed: July 20, 2015
    Publication date: January 28, 2016
    Inventors: Shinji WATANABE, Sumikazu HOSOYAMADA, Shingo NAKAMURA, Hiroshi DEMACHI, Takeshi MIYAKOSHI, Tomoshige CHIKAI, Kiminori ISHIDO, Hiroaki MATSUBARA, Takashi NAKAMURA, Hirokazu HONDA, Yoshikazu KUMAGAYA, Shotaro SAKUMOTO, Toshihiro IWASAKI, Michiaki TAMAKAWA
  • Publication number: 20150371934
    Abstract: A semiconductor package includes a support substrate arranged with a first aperture reaching a semiconductor device on a rear side, the semiconductor device is bonded via an adhesive to a surface of the support substrate, an insulating layer covering the semiconductor device, and wiring for connecting the semiconductor device and an external terminal through the insulating layer. The adhesive may form a part of the first aperture. In addition, a heat dissipation part may be arranged in the first aperture and a metal material may be filled in the first aperture.
    Type: Application
    Filed: June 19, 2015
    Publication date: December 24, 2015
    Inventors: Hirokazu HONDA, Shinji WATANABE, Toshihiro IWASAKI, Kiminori ISHIDO, Koichiro NIWA, Takeshi MIYAKOSHI, Sumikazu HOSOYAMADA, Yoshikazu KUMAGAYA, Tomoshige CHIKAI, Shingo NAKAMURA, Shotaro SAKUMOTO, Hiroaki MATSUBARA
  • Publication number: 20150279759
    Abstract: A stacked semiconductor package in an embodiment includes a first semiconductor package including a first circuit board and a first semiconductor element mounted on the first circuit board; and a second semiconductor package including a second circuit board and a second semiconductor element mounted on the second circuit board, the second semiconductor package being stacked on the first semiconductor package. The first semiconductor package further includes a sealing resin sealing the first semiconductor element; a conductive layer located in contact with the sealing resin; and a thermal via connected to the conductive layer and located on the first circuit board.
    Type: Application
    Filed: March 26, 2015
    Publication date: October 1, 2015
    Applicant: J-DEVICES CORPORATION
    Inventors: Takeshi Miyakoshi, Sumikazu HOSOYAMADA, Yoshikazu KUMAGAYA, Tomoshige CHIKAI, Shingo NAKAMURA, Hiroaki MATSUBARA, Shotaro SAKUMOTO