Abstract: A method for forming a semiconductor device is provided. The method includes forming first bonding features and a first alignment mark including first patterns in a top die and forming second bonding features and a second alignment mark in a bottom wafer. The method also includes determining a first benchmark and a second benchmark. The method further includes aligning the top die with the bottom wafer using the first alignment mark and the second alignment mark. In a top view, at least two of the first patterns are oriented along a first direction, and at least two of the first patterns are oriented along a second direction that is different from the first direction. The top die is aligned with the bottom wafer by adjusting a virtual axis passing through the first benchmark and the second benchmark to be substantially parallel with the first direction.

Abstract: Embodiments of the present disclosure provide systems and methods for transforming a text file with an existing syntax format to a syntax tree structure with a syntax convention extension based on defined field types and field characteristics. Embodiments of the present disclosure transform existing syntax knowledge to an extended convention syntax knowledge, creating the syntax tree structure with the syntax convention extension, to provide automated support for different applications and programs, and enabling programmatic querying, override and other use functions.