Patents by Inventor Shou MATSUMOTO

Shou MATSUMOTO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11936355
    Abstract: A filter allows a transmission signal in a predetermined frequency band to pass from a second input-output terminal to a first input-output terminal and allows a reception signal in the predetermined frequency band to pass from the first input-output terminal to the second input-output terminal. A first common terminal of a first switch is connected to the second input-output terminal. A second terminal and a first terminal of the first switch are exclusively connectable to the first common terminal. A second common terminal of a second switch is connected to a ground terminal of the filter. A second selection terminal and a first selection terminal of the second switch are exclusively connected to the second common terminal. Of the first selection terminal and the second selection terminal, only the first selection terminal is connected to a ground with a reactive element interposed therebetween.
    Type: Grant
    Filed: October 27, 2021
    Date of Patent: March 19, 2024
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Shou Matsumoto
  • Patent number: 11631659
    Abstract: A high-frequency module includes a mounting substrate having main surfaces 30a and 30b, a first circuit component mounted on the main surface 30a, a second circuit component mounted on the main surface 30b, an external connection terminal arranged on the main surface 30b side relative to the main surface 30a with respect to the mounting substrate, a long via conductor connected to the first circuit component, passing through the mounting substrate, and having a substantially long shape when the mounting substrate is viewed in a plan view, and a metal block arranged on the main surface 30b side relative to the main surface 30a with respect to the mounting substrate and connecting the long via conductor and the external connection terminal. When the mounting substrate is viewed in a plan view, the first circuit component overlaps the long via conductor and the metal block overlaps the long via conductor.
    Type: Grant
    Filed: February 3, 2020
    Date of Patent: April 18, 2023
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Motoji Tsuda, Takanori Uejima, Yuji Takematsu, Katsunari Nakazawa, Masahide Takebe, Shou Matsumoto, Naoya Matsumoto, Yutaka Sasaki, Yuuki Fukuda
  • Patent number: 11588217
    Abstract: Isolation characteristics of a directional coupler are improved. A high-frequency module (1) includes a substrate (2) and a directional coupler (5) provided on the substrate (2). The directional coupler (5) includes a main line (51), a sub line (52), and an impedance adjustment portion (7). The sub line (52) is electromagnetically coupled to the main line (51). The impedance adjustment portion (7) is provided in the sub line (52), and adjusts impedance of the directional coupler (5). The impedance adjustment portion (7) is electrically connected to an inductor of the substrate (2).
    Type: Grant
    Filed: March 12, 2020
    Date of Patent: February 21, 2023
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Shou Matsumoto, Isao Takenaka
  • Patent number: 11476226
    Abstract: A radio-frequency module includes: a transmitting circuit disposed on a mounting substrate to process a radio-frequency signal input from a transmission terminal and to output a resultant signal to a common terminal; a receiving circuit disposed on the mounting substrate to process a radio-frequency signal input from the common terminal and to output a resultant signal to a reception terminal; a first inductor included in a first transmitting circuit; and a bonding wire connected to the ground and bridging over the first inductor.
    Type: Grant
    Filed: December 26, 2019
    Date of Patent: October 18, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Takanori Uejima, Yuji Takematsu, Naoya Matsumoto, Shou Matsumoto, Tetsuro Harada, Dai Nakagawa, Yutaka Sasaki, Yuuki Fukuda
  • Patent number: 11323193
    Abstract: A filter circuit includes a first switch circuit that exclusively connects a first common terminal to either of a first selection terminal and a second selection terminal; a first signal terminal that is connected to the first selection terminal and that is for communicating a first communication signal belonging to a first frequency range, which is a frequency range of a first communication band; a second signal terminal that is connected to the second selection terminal and that is for communicating a second communication signal belonging to a second frequency range, which is the frequency range of a second communication band and which is at least partially overlapped with the first frequency range; and a first band pass filter one end of which is connected to the first common terminal and which uses both the first frequency range and the second frequency range as pass bands.
    Type: Grant
    Filed: March 18, 2020
    Date of Patent: May 3, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Kenji Tahara, Shou Matsumoto
  • Publication number: 20220052670
    Abstract: A filter allows a transmission signal in a predetermined frequency band to pass from a second input-output terminal to a first input-output terminal and allows a reception signal in the predetermined frequency band to pass from the first input-output terminal to the second input-output terminal. A first common terminal of a first switch is connected to the second input-output terminal. A second terminal and a first terminal of the first switch are exclusively connectable to the first common terminal. A second common terminal of a second switch is connected to a ground terminal of the filter. A second selection terminal and a first selection terminal of the second switch are exclusively connected to the second common terminal. Of the first selection terminal and the second selection terminal, only the first selection terminal is connected to a ground with a reactive element interposed therebetween.
    Type: Application
    Filed: October 27, 2021
    Publication date: February 17, 2022
    Inventor: Shou MATSUMOTO
  • Publication number: 20210050876
    Abstract: A radio frequency module includes a power amplification element, a transmission filter, and a transmission matching element, which are transmission-only components for processing only a transmission signal, a low noise amplification element, a reception filter, and a reception matching element, which are reception-only components for processing only a reception signal, an antenna switch, which is a transmission-reception dual-use component for processing both a transmission signal and a reception signal, and a first module board and a second module board, which are arranged to face each other. The transmission-only components are mounted on a main surface of the first module board, and the reception-only components and the transmission-reception dual-use component are mounted on respective main surfaces of the second module board.
    Type: Application
    Filed: November 4, 2020
    Publication date: February 18, 2021
    Inventor: Shou MATSUMOTO
  • Publication number: 20200251459
    Abstract: A high-frequency module includes a mounting substrate having main surfaces 30a and 30b, a first circuit component mounted on the main surface 30a, a second circuit component mounted on the main surface 30b, an external connection terminal arranged on the main surface 30b side relative to the main surface 30a with respect to the mounting substrate, a long via conductor connected to the first circuit component, passing through the mounting substrate, and having a substantially long shape when the mounting substrate is viewed in a plan view, and a metal block arranged on the main surface 30b side relative to the main surface 30a with respect to the mounting substrate and connecting the long via conductor and the external connection terminal. When the mounting substrate is viewed in a plan view, the first circuit component overlaps the long via conductor and the metal block overlaps the long via conductor.
    Type: Application
    Filed: February 3, 2020
    Publication date: August 6, 2020
    Inventors: Motoji TSUDA, Takanori UEJIMA, Yuji TAKEMATSU, Katsunari NAKAZAWA, Masahide TAKEBE, Shou MATSUMOTO, Naoya MATSUMOTO, Yutaka SASAKI, Yuuki FUKUDA
  • Publication number: 20200220635
    Abstract: A filter circuit includes a first switch circuit that exclusively connects a first common terminal to either of a first selection terminal and a second selection terminal; a first signal terminal that is connected to the first selection terminal and that is for communicating a first communication signal belonging to a first frequency range, which is a frequency range of a first communication band; a second signal terminal that is connected to the second selection terminal and that is for communicating a second communication signal belonging to a second frequency range, which is the frequency range of a second communication band and which is at least partially overlapped with the first frequency range; and a first band pass filter one end of which is connected to the first common terminal and which uses both the first frequency range and the second frequency range as pass bands.
    Type: Application
    Filed: March 18, 2020
    Publication date: July 9, 2020
    Inventors: Kenji TAHARA, Shou MATSUMOTO
  • Publication number: 20200211998
    Abstract: A radio-frequency module includes: a transmitting circuit disposed on a mounting substrate to process a radio-frequency signal input from a transmission terminal and to output a resultant signal to a common terminal; a receiving circuit disposed on the mounting substrate to process a radio-frequency signal input from the common terminal and to output a resultant signal to a reception terminal; a first inductor included in a first transmitting circuit; and a bonding wire connected to the ground and bridging over the first inductor.
    Type: Application
    Filed: December 26, 2019
    Publication date: July 2, 2020
    Inventors: Takanori UEJIMA, Yuji TAKEMATSU, Naoya MATSUMOTO, Shou MATSUMOTO, Tetsuro HARADA, Dai NAKAGAWA, Yutaka SASAKI, Yuuki FUKUDA
  • Publication number: 20200212529
    Abstract: Isolation characteristics of a directional coupler are improved. A high-frequency module (1) includes a substrate (2) and a directional coupler (5) provided on the substrate (2). The directional coupler (5) includes a main line (51), a sub line (52), and an impedance adjustment portion (7). The sub line (52) is electromagnetically coupled to the main line (51). The impedance adjustment portion (7) is provided in the sub line (52), and adjusts impedance of the directional coupler (5). The impedance adjustment portion (7) is electrically connected to an inductor of the substrate (2).
    Type: Application
    Filed: March 12, 2020
    Publication date: July 2, 2020
    Inventors: Shou MATSUMOTO, Isao TAKENAKA