Abstract: An oxide semiconductor based FRAM is provided in the present invention, including a substrate, a write electrode on the substrate, a ferroelectric dielectric layer on the write electrode, an oxide semiconductor layer on the ferroelectric dielectric layer, a source and a drain respectively on the oxide semiconductor layer and spaced apart at a distance, wherein the source and the drain are further connected to a plate line and a bit line respectively, a gate insulating layer on the source, the drain and the oxide semiconductor layer, and a word line on the gate insulating layer, wherein the word line, the oxide semiconductor layer, the ferroelectric dielectric layer and the write electrode overlapping each other in a direction vertical to the substrate.

Abstract: An oxide semiconductor based FRAM is provided in the present invention, including a substrate, a write electrode on the substrate, a ferroelectric dielectric layer on the write electrode, an oxide semiconductor layer on the ferroelectric dielectric layer, a source and a drain respectively on the oxide semiconductor layer and spaced apart at a distance, wherein the source and the drain are further connected to a plate line and a bit line respectively, a gate insulating layer on the source, the drain and the oxide semiconductor layer, and a word line on the gate insulating layer, wherein the word line, the oxide semiconductor layer, the ferroelectric dielectric layer and the write electrode overlapping each other in a direction vertical to the substrate.

Abstract: A ferroelectric memory structure including a first conductive line, a second conductive line, and a memory cell is provided. The second conductive line is disposed on the first conductive line. The memory cell is disposed between the first and second conductive lines. The memory cell includes a switch device and a ferroelectric capacitor structure. The switch device is disposed between the first and second conductive lines. The ferroelectric capacitor structure is disposed between the first conductive line and the switch device. The ferroelectric capacitor structure includes ferroelectric capacitors electrically connected. Each of the ferroelectric capacitors includes a first conductive layer, a second conductive layer, and a ferroelectric material layer. The second conductive layer is disposed on the first conductive layer. The ferroelectric material layer is disposed between the first conductive layer and the second conductive layer.

Abstract: A wafer structure and a manufacturing method thereof are provided. The wafer structure includes a substrate structure, a first dielectric layer, multiple test pads, a second dielectric layer, and multiple bond pads. The first dielectric layer is disposed on the substrate structure. The test pads are disposed in and exposed outside the first dielectric layer. Each test pad has a probe mark. The second dielectric layer is disposed on the first dielectric layer. The second dielectric layer has a top surface away from the test pads. Multiple bond pads are disposed in and exposed outside the second dielectric layer. Each bond pad is electrically connected to the corresponding test pad. The bond pads have bonding surfaces away from the test pads. The bonding surfaces are flush with the top surface. In the normal direction of the substrate structure, each bond pad does not overlap the probe mark of the corresponding test pad.

Abstract: A manufacturing method of a SRAM memory device includes forming two transistors on a substrate, forming an inner dielectric layer covering the two transistors, forming contacts in the inner dielectric layer for coupling to source nodes of the two transistors, forming a metal interconnect structure on the inner dielectric layer, wherein a portion of an n-th metal layer of the metal interconnect structure is utilized as a lower metal layer, wherein n?1. An opening is formed in the metal interconnect structure to expose the lower metal layer, and then a capacitor is formed in the opening. The capacitor includes the lower metal layer, a first electrode layer, a dielectric layer, a second electrode layer, and an upper metal layer from bottom to top. The upper metal layer is a portion of an m-th metal layer of the metal interconnect structure, wherein m?n+1.

Abstract: The invention provides a semiconductor bonding structure, the semiconductor bonding structure includes a first chip and a second chip which are bonded with each other, the first chip has a first bonding pad and the second bonding pad contacted and electrically connected to each other on a bonding interface, the first bonding pad and the second bonding pad are made of copper, and a heterogeneous contact combination in the first chip, the heterogeneous contact combination comprises a contact stack structure of a copper element, a tungsten element and an aluminum element, the tungsten element is located between the copper element and the aluminum element

Abstract: A wafer stack structure includes an interlayer, a first wafer, and a second wafer. The interlayer has a first surface and a second surface opposite to the first surface. The intermediate layer includes a dielectric material layer and a redistribution layer embedded in the dielectric material layer. The first wafer is disposed on the first surface of the interlayer. The second wafer is disposed on the second surface of the interlayer. The second wafer is electrically connected to the first wafer through the redistribution layer of the interlayer.

Abstract: A semiconductor package includes a semiconductor chip and a redistribution layer structure. The redistribution layer structure is arranged to form an antenna transmitter structure and an antenna receiver structure over the semiconductor chip, wherein patterns of the antenna receiver structure are located at different levels of the redistribution layer structure, and at least one pattern of the antenna transmitter structure is at the same level of the topmost patterns of the antenna receiver structure.

Abstract: Sensor packages and manufacturing methods thereof are disclosed. One of the sensor packages includes a semiconductor chip and a redistribution layer structure. The semiconductor chip has a sensing surface. The redistribution layer structure is arranged to form an antenna transmitter structure aside the semiconductor chip and an antenna receiver structure over the sensing surface of the semiconductor chip.

Abstract: Semiconductor devices and manufacturing and design methods thereof are disclosed. In one embodiment, a semiconductor device includes an active FinFET disposed over a workpiece comprising a first semiconductive material, the active FinFET comprising a first fin. An electrically inactive FinFET structure is disposed over the workpiece proximate the active FinFET, the electrically inactive FinFET comprising a second fin. A second semiconductive material is disposed between the first fin and the second fin.

Abstract: An SRAM memory device includes a substrate, a first transistor, a second transistor, a metal interconnect structure, and a capacitor. The metal interconnect structure is formed on the first and second transistors. The capacitor is disposed in the metal interconnect structure and coupled between the first transistor and the second transistor. The capacitor includes a lower metal layer, a first electrode layer, a dielectric layer, a second electrode layer, and an upper metal layer from bottom to top. The lower metal layer is coupled to a source node of the first transistor and a source node of the second transistor. The lower metal layer and an n-th metal layer in the metal interconnect structure are formed of a same material, wherein n?1; the upper metal layer and an m-th metal layer in the metal interconnect structure are formed of a same material, wherein m?n+1.

Abstract: A circuit structure for testing through silicon vias (TSVs) in a 3D IC, including a TSV area with multiple TSVs formed therein, and a switch circuit with multiple column lines and row lines forming an addressable test array, wherein two ends of each TSV are connected respectively with a column line and a row line. The switch circuit applies test voltage signals through one of the row lines to the TSVs in the same row and receives current signals flowing through the TSVs in the row from the columns lines, or the switch circuit applies test voltage signals through one of the column lines to the TSVs in the same column and receives current signals flowing through the TSVs in the column from the row lines.

Abstract: A package structure include a ground plate, a semiconductor die, a molding compound, and an antenna element. The semiconductor die is located over the ground plate. The molding compound is located over the semiconductor die. The antenna element is located in the molding compound and overlaps with the ground plate along a stacking direction of the ground plate, the semiconductor die and the molding compound. The antenna element has a first side levelled with a first surface of the molding compound, and the ground plate is located between the semiconductor die and the antenna element.

Abstract: A SRAM device includes a substrate, at least one two-transistor static random access memory (2T-SRAM), an inner dielectric layer, a plurality of contacts, an inter-layer dielectric (ILD) layer, a plurality of vias, and a conductive line. The 2T-SRAM is disposed on the substrate, the inner dielectric layer covers the 2T-SRAM, and the contacts are disposed in the inner dielectric layer and coupled to the 2T-SRAM. The ILD layer covers the inner dielectric layer and the contacts, and the vias are disposed in the ILD layer and respectively coupled to the 2T-SRAM trough the corresponding contacts. The conductive line is disposed on the ILD layer and connects with the plurality of vias, wherein the thickness of the conductive line is less than or equal to one-tenth of the thickness of the via such that it can significantly reduce the coupling effect compared with the traditional bit line.

Abstract: In accordance with some embodiments, a package structure includes an RFIC chip. an insulating encapsulation, a redistribution circuit structure, an antenna and a microwave director. The insulating encapsulation encapsulates the RFIC chip. The redistribution circuit structure is disposed on the insulating encapsulation and electrically connected to the RFIC chip. The antenna is disposed on the insulating encapsulation and electrically connected to the RFIC chip through the redistribution circuit structure. The antenna is located between the microwave director and the RFIC chip. The microwave director has a microwave directivity enhancement surface located at a propagating path of a microwave received or generated by the antenna.

Abstract: A semiconductor device includes a semiconductor die having an insulative layer and a conductive feature in the insulative layer, and a shield in contact with a lateral surface of the conductive feature. In some embodiments, the lateral surface of the conductive feature is aligned with an edge of the insulating material.

Abstract: Packaged semiconductor devices and methods of packaging semiconductor devices are disclosed. In some embodiments, a packaged semiconductor device includes an integrated circuit die, a first molding material disposed around the integrated circuit die, and a through-via disposed within the first molding material. A first side of a redistribution layer (RDL) is coupled to the integrated circuit die, the through-via, and the first molding material. A second molding material is over a second side of the RDL, the second side of the RDL being opposite the first side of the RDL. The packaged semiconductor device includes an antenna over the second molding material.

Abstract: An SRAM memory device includes a substrate, a first transistor, a second transistor, a metal interconnect structure, and a capacitor. The metal interconnect structure is formed on the first and second transistors. The capacitor is disposed in the metal interconnect structure and coupled between the first transistor and the second transistor. The capacitor includes a lower metal layer, a first electrode layer, a dielectric layer, a second electrode layer, and an upper metal layer from bottom to top. The lower metal layer is coupled to a source node of the first transistor and a source node of the second transistor. The lower metal layer and an n-th metal layer in the metal interconnect structure are formed of a same material, wherein n?1; the upper metal layer and an m-th metal layer in the metal interconnect structure are formed of a same material, wherein m?n+1.

Abstract: A SRAM device includes a substrate, at least one two-transistor static random access memory (2T-SRAM), an inner dielectric layer, a plurality of contacts, an inter-layer dielectric (ILD) layer, a plurality of vias, and a conductive line. The 2T-SRAM is disposed on the substrate, the inner dielectric layer covers the 2T-SRAM, and the contacts are disposed in the inner dielectric layer and coupled to the 2T-SRAM. The ILD layer covers the inner dielectric layer and the contacts, and the vias are disposed in the ILD layer and respectively coupled to the 2T-SRAM trough the corresponding contacts. The conductive line is disposed on the ILD layer and connects with the plurality of vias, wherein the thickness of the conductive line is less than or equal to one-tenth of the thickness of the via such that it can significantly reduce the coupling effect compared with the traditional bit line.

Abstract: A package structure including a first redistribution circuit structure, a semiconductor die, first antennas and second antennas is provided. The semiconductor die is located on and electrically connected to the first redistribution circuit structure. The first antennas and the second antennas are located over the first redistribution circuit structure and electrically connected to the semiconductor die through the first redistribution circuit structure. A first group of the first antennas are located at a first position, a first group of the second antennas are located at a second position, and the first position is different from the second position in a stacking direction of the first redistribution circuit structure and the semiconductor die.