Abstract: A semiconductor light emitting device includes a first conductivity-type first semiconductor layer; an emission layer; a second conductivity-type second semiconductor layer; and a second conductivity-type transparent substrate transparent to light beams from the emission layer and directly bonded to the second semiconductor layer. The transparent substrate has a parallel surface almost parallel to the emission layer on an opposite side of the emission layer, and an inclined surface adjoining the parallel surface and inclined to the parallel surface. Light beams totally reflected on the parallel surface and light beams totally reflected on a side surface of the transparent substrate come incident to the inclined surface at an angle smaller than the critical angle, and emit out of the semiconductor light emitting device.

Abstract: A semiconductor light-emitting device exhibits high reflectance even with less number of pairs of light-reflecting layers, and allows light emitted from the active layer to be effectively extracted outside. This semiconductor light-emitting device is fabricated at good mass productivity by a semiconductor light-emitting device manufacturing method including the step of providing an active layer which generates light having a specified wavelength on a semiconductor substrate. On the semiconductor substrate, are stacked an AlxGa1-xAs layer and the active layer, in this order. Part of the AlxGa1-xAs layer with respect to the is changed into an AlOy layer (where y is a positive real number).

Abstract: A semiconductor light emitting device includes a first conductivity-type first semiconductor layer; an emission layer; a second conductivity-type second semiconductor layer; and a second conductivity-type transparent substrate transparent to light beams from the emission layer and directly bonded to the second semiconductor layer. The transparent substrate has a parallel surface almost parallel to the emission layer on an opposite side of the emission layer, and an inclined surface adjoining the parallel surface and inclined to the parallel surface. Light beams totally reflected on the parallel surface and light beams totally reflected on a side surface of the transparent substrate come incident to the inclined surface at an angle smaller than the critical angle, and emit out of the semiconductor light emitting device.

Abstract: A semiconductor light-emitting device exhibits high reflectance even with less number of pairs of light-reflecting layers, and allows light emitted from the active layer to be effectively extracted outside. This semiconductor light-emitting device is fabricated at good mass productivity by a semiconductor light-emitting device manufacturing method including the step of providing an active layer which generates light having a specified wavelength on a semiconductor substrate. On the semiconductor substrate, are stacked an AlxGa1-xAs layer and the active layer, in this order. Part of the AlxGa1-xAs layer with respect to the is changed into an AlOy layer (where y is a positive real number).

Abstract: A light emitting layer 4 composed of a single or a plurality of semiconductor layers is laminated on a nondope type, weak p-type, or n-type first semiconductor substrate (not shown in FIG. 1). On the light emitting layer 4, n-type semiconductor layers 5-7 composed of a single layer or a plurality of layers are laminated. On the surface of the n-type semiconductor layer 7, a second semiconductor substrate 8 transparent to the wavelength of emitted light from the light emitting layer 4 is formed. Then, the first semiconductor substrate is removed. On the plane exposed by removal of the first semiconductor substrate, a translucent electrode layer 9 transparent to the wavelength of emitted light from the light emitting layer is formed.

Abstract: A semiconductor light-emitting device exhibits high reflectance even with less number of pairs of light-reflecting layers, and allows light emitted from the active layer to be effectively extracted outside. This semiconductor light-emitting device is fabricated at good mass productivity by a semiconductor light-emitting device manufacturing method including the step of providing an active layer which generates light having a specified wavelength on a semiconductor substrate. On the semiconductor substrate, are stacked an AlxGa1−xAs layer and the active layer, in this order. Part of the AlxGa1−xAs layer with respect to the is changed into an AlOy layer (where y is a positive real number).