Patents by Inventor Shu Deng

Shu Deng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20150015990
    Abstract: A head stack assembly includes at least one head gimbal assembly and a flexible printed circuit assembly. A flexure tail of the head gimbal assembly includes a row of first bonding pads, a first dual stage actuator pad and a first dummy pad arranged at two sides of said row of first bonding pads, and the first dual stage actuator pad and the first dummy pad are connected together via a jumping lead. The flexible printed circuit assembly includes at least one row of second bonding pads, at least one second dual stage actuator pad and at least one second dummy pad arranged for connecting with the row of first bonding pads, the first dual stage actuator pad and the first dummy pad respectively. The connection way between the head gimbal assembly and the flexible printed circuit assembly is simple, thereby less cross talk is generated on the preamplifier.
    Type: Application
    Filed: September 10, 2013
    Publication date: January 15, 2015
    Applicant: SAE Magnetics (H.K.) Ltd.
    Inventors: Sidney Shen Kuang Chou, Jackie Ka Yip Wong, Shu Deng, Xin Zhong, Lu Xiao
  • Patent number: D551671
    Type: Grant
    Filed: April 14, 2006
    Date of Patent: September 25, 2007
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Shu Deng