Patents by Inventor Shu-Hang Liao

Shu-Hang Liao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220189920
    Abstract: A package structure is provided. The package structure includes a first die and a second die, a dielectric layer, a bridge, an encapsulant, and a redistribution layer structure. The dielectric layer is disposed on the first die and the second die. The bridge is electrically connected to the first die and the second die, wherein the dielectric layer is spaced apart from the bridge. The encapsulant is disposed on the dielectric layer and laterally encapsulating the bridge. The redistribution layer structure is disposed over the encapsulant and the bridge. A top surface of the bridge is in contact with the RDL structure.
    Type: Application
    Filed: March 7, 2022
    Publication date: June 16, 2022
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Shu-Hang Liao, Chih-Wei Wu, Jing-Cheng Lin, Szu-Wei Lu, Ying-Ching Shih
  • Patent number: 11270976
    Abstract: A package structure and a method of manufacturing the same are provided. The package structure includes a first die, a second die, a first encapsulant, a bridge, an underfill layer and a RDL structure. The first die and the second die are placed side by side. The first encapsulant encapsulates sidewalls of the first die and sidewalls of the second die. The bridge electrically connects the first die and the second die through two conductive bumps. The underfill layer fills the space between the bridge and the first die, between the bridge and the second die, and between the bridge and a portion of the first encapsulant. The RDL structure is located over the bridge and electrically connected to the first die and the second die though a plurality of TIVs. The bottom surfaces of the two conductive bumps are level with a bottom surface of the underfill layer.
    Type: Grant
    Filed: June 27, 2019
    Date of Patent: March 8, 2022
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Shu-Hang Liao, Chih-Wei Wu, Jing-Cheng Lin, Szu-Wei Lu, Ying-Ching Shih
  • Publication number: 20190319008
    Abstract: A package structure and a method of manufacturing the same are provided. The package structure includes a first die, a second die, a first encapsulant, a bridge, an underfill layer and a RDL structure. The first die and the second die are placed side by side. The first encapsulant encapsulates sidewalls of the first die and sidewalls of the second die. The bridge electrically connects the first die and the second die through two conductive bumps. The underfill layer fills the space between the bridge and the first die, between the bridge and the second die, and between the bridge and a portion of the first encapsulant. The RDL structure is located over the bridge and electrically connected to the first die and the second die though a plurality of TIVs. The bottom surfaces of the two conductive bumps are level with a bottom surface of the underfill layer.
    Type: Application
    Filed: June 27, 2019
    Publication date: October 17, 2019
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Shu-Hang Liao, Chih-Wei Wu, Jing-Cheng Lin, Szu-Wei Lu, Ying-Ching Shih
  • Patent number: 10340253
    Abstract: A package structure and a method of manufacturing the same are provided. The package structure includes a first die, a second die, a first encapsulant, a bridge, an underfill layer and a RDL structure. The first die and the second die are placed side by side. The first encapsulant encapsulates sidewalls of the first die and sidewalls of the second die. The bridge electrically connects the first die and the second die through two conductive bumps. The underfill layer fills the space between the bridge and the first die, between the bridge and the second die, and between the bridge and a portion of the first encapsualnt. The RDL structure is located over the bridge and electrically connected to the first die and the second die though a plurality of TIVs. The bottom surfaces of the two conductive bumps are level with a bottom surface of the underfill layer.
    Type: Grant
    Filed: September 26, 2017
    Date of Patent: July 2, 2019
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Shu-Hang Liao, Chih-Wei Wu, Jing-Cheng Lin, Szu-Wei Lu, Ying-Ching Shih
  • Publication number: 20190096851
    Abstract: A package structure and a method of manufacturing the same are provided. The package structure includes a first die, a second die, a first encapsulant, a bridge, an underfill layer and a RDL structure. The first die and the second die are placed side by side. The first encapsulant encapsulates sidewalls of the first die and sidewalls of the second die. The bridge electrically connects the first die and the second die through two conductive bumps. The underfill layer fills the space between the bridge and the first die, between the bridge and the second die, and between the bridge and a portion of the first encapsualnt. The RDL structure is located over the bridge and electrically connected to the first die and the second die though a plurality of TIVs. The bottom surfaces of the two conductive bumps are level with a bottom surface of the underfill layer.
    Type: Application
    Filed: September 26, 2017
    Publication date: March 28, 2019
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Shu-Hang Liao, Chih-Wei Wu, Jing-Cheng Lin, Szu-Wei Lu, Ying-Ching Shih
  • Patent number: 10032662
    Abstract: Packaged semiconductor devices and methods of packaging thereof are disclosed. In some embodiments, a packaged semiconductor device includes a first device and a second device coupled to the first device. The second device includes an integrated circuit die covered by a molding compound. An over-mold structure is disposed over the second device.
    Type: Grant
    Filed: October 8, 2014
    Date of Patent: July 24, 2018
    Assignee: Taiwan Semiconductor Manufacturing Company
    Inventors: Shu-Hang Liao, Ying-Ching Shih, Szu-Wei Lu, Jing-Cheng Lin
  • Publication number: 20160104694
    Abstract: Packaged semiconductor devices and methods of packaging thereof are disclosed. In some embodiments, a packaged semiconductor device includes a first device and a second device coupled to the first device. The second device includes an integrated circuit die covered by a molding compound. An over-mold structure is disposed over the second device.
    Type: Application
    Filed: October 8, 2014
    Publication date: April 14, 2016
    Inventors: Shu-Hang Liao, Ying-Ching Shih, Szu-Wei Lu, Jing-Cheng Lin
  • Patent number: 9202635
    Abstract: A substrate for counter electrode of dye-sensitized solar cell is made of a composite material, which is prepared by: a) compounding vinyl ester and graphite powder to form bulk molding compound (BMC) material, the graphite powder content ranging from 60 wt % to 95 wt % based on the total weight of the graphite powder and vinyl ester, wherein 0.01-10 wt % of an electrically conductive filler, based on the weight of the vinyl ester resin, is optionally added during the compounding; b) molding the BMC material from step a) to form a substrate for the counter electrode having a desired shaped at 80-200° C. and 500-4000 psi.
    Type: Grant
    Filed: October 14, 2009
    Date of Patent: December 1, 2015
    Assignee: NATIONAL TSING HUA UNIVERSITY
    Inventors: Chen-Chi Martin Ma, Chuan-Yu Yen, Shu-Hang Liao, Ming-Yu Yen, Min-Chien Hsiao
  • Publication number: 20110315934
    Abstract: A graphite-vinyl ester resin composite conducting plate is prepared in the present invention. The conducting plate can be used as a bipolar plate for a fuel cell, counter electrode for dye-sensitized solar cell and electrode of vanadium redox battery. The conducting plate is prepared as follows: a) compounding vinyl ester resin and graphite powder to form a bulk molding compound (BMC) material, the graphite powder content ranging from 70 wt % to 95 wt % based on the total weight of the graphite powder and vinyl ester, wherein 0.01-15 wt % functionalized graphene, based on the weight of the vinyl ester resin, are added during the compounding; b) molding the BMC material from step a) to form a conducting plate having a desired shaped at 80-250° C. and 500-4000 psi.
    Type: Application
    Filed: September 28, 2010
    Publication date: December 29, 2011
    Applicant: National Tsing Hua University
    Inventors: Chen-Chi M. Ma, Min-Chien Hsiao, Shu-Hang Liao, Ming-Yu Yen, Ming-Der Ger, Chung-An Wang, Nen-Wen Pu, Yuh Sung, Chih-Chun Teng, Shie-Heng Lee, Min-Hsuan Hsiao
  • Patent number: 7910040
    Abstract: A composite bipolar plate for a polymer electrolyte membrane fuel cell (PEMFC) is prepared as follows: a) compounding vinyl ester and graphite powder to form bulk molding compound (BMC) material, the graphite powder content ranging from 60 wt % to 95 wt % based on the total weight of the graphite powder and vinyl ester, wherein carbon fiber 1-20 wt %, modified organo clay or noble metal plated modified organo clay 0.5-10 wt %, and one or more conductive fillers selected form: carbon nanotube (CNT) 0.1-5 wt %, nickel plated carbon fiber 0.5-10 wt %, nickel plated graphite 2.5-40 wt %, and carbon black 2-30 wt %, based on the weight of the vinyl ester resin, are added during the compounding; b) molding the BMC material from step a) to form a bipolar plate having a desired shaped at 80-200° C. and 500-4000 psi.
    Type: Grant
    Filed: July 7, 2005
    Date of Patent: March 22, 2011
    Assignee: National Tsing Hua University
    Inventors: Chen-Chi Martin Ma, Hsu-Chiang Kuan, Han-Lang Wu, Hsun-Yu Su, Shu-Hang Liao, Chuan-Yu Yen, Yu-Feng Lin, Ying-Ying Cheng
  • Patent number: 7883650
    Abstract: A composite bipolar plate for a polymer electrolyte membrane fuel cell (PEMFC) is prepared as follows: a) compounding vinyl ester and graphite powder to form bulk molding compound (BMC) material, the graphite powder content ranging from 60 wt % to 95 wt % based on the total weight of the graphite powder and vinyl ester, wherein carbon nanotubes together with a polyether amine dispersant or modified carbon nanotubes 0.05-10 wt %, based on the weight of the vinyl ester resin, are added during the compounding; b) molding the BMC material from step a) to form a bipolar plates having a desired shaped at 80-200° C. and 500-4000 psi.
    Type: Grant
    Filed: October 20, 2008
    Date of Patent: February 8, 2011
    Assignee: National Tsing Hua University
    Inventors: Chen-Chi Martin Ma, Chih-Hung Hung, Shu-Hang Liao, Chuan-Yu Yen, Jeng-Chih Weng, Yu-Feng Lin
  • Publication number: 20100283174
    Abstract: A composite bipolar plate for a proton exchange membrane fuel cell (PEMFC) is prepared as follows: a) melt compounding a polypropylene resin and graphite powder to form a melt compounding material, the graphite powder content ranging from 50 wt % to 95 wt % based on the total weight of the melt compounding material and the polypropylene resin being a homopolymer of propylene or a random copolymer of propylene and ethylene, butylenes or hexalene, wherein 0.01-15 wt % of polymer-grafted carbon nanotubes by an acyl chlorination-amidization reaction, based on the weight of the polypropylene resin, are added during the compounding; and b) molding the melt compounding material from step a) to form a bipolar plates having a desired shaped at 100-250° C. and 500-4000 psi.
    Type: Application
    Filed: November 5, 2009
    Publication date: November 11, 2010
    Applicant: YUAN ZE UNIVERSITY
    Inventors: Chen-Chi Martin Ma, Min-Chien Hsiao, Shu-Hang Liao, Jeng-Chih Weng, Shuo-Jen Lee, Ay Su
  • Publication number: 20100269270
    Abstract: A process for preparing a photoanode of dye-sensitized solar cells (DSSCs) is disclosed, which contains nano TiO2 and functionalized carbon nanomateiral. The process includes reacting a dispersion of functionalized carbon nanomateiral and a TiO2 precursor in a liquid organic medium under sol-gel conditions to form a carbon nanomaterial/nano TiO2 composite colloidal solution; mixing with an aqueous polymer solution, and forming a paste suitable for coating by concentrating the resulting mixture; coating the paste on a conductive glass substrate and calcining the coated layer at 300-520° C. in air for 10-60 minutes to obtain a conductive glass plate having a coating of nanocomposite, which can be used to prepare a photoanode of DSSCs by immersing in a dye solution to adsorb a dye thereon.
    Type: Application
    Filed: July 23, 2009
    Publication date: October 28, 2010
    Applicant: National Tsing Hua University
    Inventors: Chen-Chi M. Ma, Chuan-Yu Yen, Yu-Feng Lin, Shu-Hang Liao
  • Publication number: 20100154871
    Abstract: A substrate for counter electrode of dye-sensitized solar cell is made of a composite material, which is prepared by: a) compounding vinyl ester and graphite powder to form bulk molding compound (BMC) material, the graphite powder content ranging from 60 wt % to 95 wt % based on the total weight of the graphite powder and vinyl ester, wherein 0.01-10 wt % of an electrically conductive filler, based on the weight of the vinyl ester resin, is optionally added during the compounding; b) molding the BMC material from step a) to form a substrate for the counter electrode having a desired shaped at 80-200° C. and 500-4000 psi.
    Type: Application
    Filed: October 14, 2009
    Publication date: June 24, 2010
    Applicant: National Tsing Hua University
    Inventors: Chen-Chi Martin Ma, Chuan-Yu Yen, Shu-Hang Liao, Ming-Yu Yen, Min-Chien Hsiao
  • Publication number: 20100127428
    Abstract: A composite bipolar plate for a polymer electrolyte membrane membrane fuel cell (PEMFC) is prepared as follows: a) melt compounding a polypropylene resin and graphite powder at 100-250° C. and 30-150 rpm to form a melt compounding material, the graphite powder content ranging from 50 wt % to 95 wt % based on the total weight of the graphite powder and the polypropylene resin, and the polypropylene resin being a homopolymer of propylene or a copolymer of propylene and ethylene, wherein 0.05-20 wt % carbon nanotubes, based on the weight of the polypropylene resin, are added during the melt compounding; and b) molding the melt compounding material from step a) to form a bipolar plate having a desired shaped at 100-250° C. and 500-4000 psi.
    Type: Application
    Filed: July 20, 2009
    Publication date: May 27, 2010
    Applicant: YUAN ZE UNIVERSITY
    Inventors: Chen-Chi M. Ma, Shu-Hang Liao, Chuan-Yu Yen, Cheng-Chih Weng, Ching-Hung Yang, Ming-Yu Yen, Min-Chien Hsiao, Shuo-Jen Lee, Yi-Hsiu Hsiao
  • Publication number: 20100127424
    Abstract: A reinforced mesh structure containing bipolar plate for a polymer electrolyte membrane fuel cell (PEMFC) is prepared as follows: a) compounding vinyl ester and graphite powder to form bulk molding compound (BMC) material, the graphite powder content ranging from 60 wt % to 95 wt % based on the total weight of the graphite powder and vinyl ester, wherein 0.05-10 wt % reactive carbon nanotubes modified by acyl chlorination-amidization reaction, based on the weight of the vinyl ester resin, are added during the compounding; b) molding the BMC material from step a) with a metallic net being embedded in the molded BMC material to form a bipolar plates having a desired shaped at 80-200° C. and 500-4000 psi.
    Type: Application
    Filed: June 9, 2009
    Publication date: May 27, 2010
    Applicant: YUAN ZE UNIVERSITY
    Inventors: Chen-Chi Martin Ma, Min-Chien Hsiao, Shu-Hang Liao, Ming-Yu Yen, Chaun-Yu Yen, Jeng-Chin Weng, Shuo-Jen Lee
  • Publication number: 20100059718
    Abstract: A composite bipolar plate for a polymer electrolyte membrane fuel cell (PEMFC) is prepared as follows: a) compounding vinyl ester and graphite powder to form bulk molding compound (BMC) material, the graphite powder content ranging from 60 wt % to 95 wt % based on the total weight of the graphite powder and vinyl ester, wherein carbon nanotubes together with a polyether amine dispersant or modified carbon nanotubes 0.05-10 wt %, based on the weight of the vinyl ester resin, are added during the compounding; b) molding the BMC material from step a) to form a bipolar plates having a desired shaped at 80-200° C. and 500-4000 psi.
    Type: Application
    Filed: October 20, 2008
    Publication date: March 11, 2010
    Applicant: National Tsing Hua University
    Inventors: Chen-Chi Martin Ma, Chih-Hung Hung, Shu-Hang Liao, Chuan-Yu Yen, Jeng-Chih Weng, Yu-Feng Lin
  • Publication number: 20070241475
    Abstract: A composite bipolar plate for a polymer electrolyte membrane fuel cell (PEMFC) is prepared as follows: a) compounding vinyl ester and graphite powder to form bulk molding compound (BMC) material, the graphite powder content ranging from 60 wt % to 95 wt % based on the total weight of the graphite powder and vinyl ester, wherein 0.5-10 wt % modified organo clay by intercalating with a polyether amine, based on the weight of the vinyl ester resin, is added during the compounding; b) molding the BMC material from step a) to form a bipolar plates having a desired shaped at 80-200° C. and 500-4000 psi.
    Type: Application
    Filed: May 23, 2006
    Publication date: October 18, 2007
    Applicant: National Tsing Hua University
    Inventors: Chen-Chi Ma, Shu-Hang Liao, Chiaun-Iou Yen, Yu-Feng Lin, Chih-Hung Hung
  • Publication number: 20060267235
    Abstract: A composite bipolar plate for a polymer electrolyte membrane fuel cell (PEMFC) is prepared as follows: a) compounding vinyl ester and graphite powder to form bulk molding compound (BMC) material, the graphite powder content ranging from 60 wt % to 95 wt % based on the total weight of the graphite powder and vinyl ester, wherein carbon fiber 1-20 wt %, modified organo clay or noble metal plated modified organo clay 0.5-10 wt %, and one or more conductive fillers selected form: carbon nanotube (CNT) 0.1-5 wt %, nickel plated carbon fiber 0.5-10 wt %, nickel plated graphite 2.5-40 wt %, and carbon black 2-30 wt %, based on the weight of the vinyl ester resin, are added during the compounding; b) molding the BMC material from step a) to form a bipolar plate having a desired shaped at 80-200° C. and 500-4000 psi.
    Type: Application
    Filed: July 7, 2005
    Publication date: November 30, 2006
    Applicant: National Tsing Hua University
    Inventors: Chen-Chi Ma, Hsu-Chiang Kuan, Han-Lang Wu, Hsun-Yu Su, Shu-Hang Liao, Chuan-Yu Yen, Yu-Feng Lin, Ying-Ying Cheng