Patents by Inventor Shu-Hao Chang

Shu-Hao Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210108075
    Abstract: A resin composition comprises: a vinyl-containing polyphenylene ether resin, a bis(vinylphenyl)ethane and a modification of divinylbenzene. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and achieves improvements in at least one of the properties including dielectric constant, dissipation factor, copper foil peeling strength, glass transition temperature, ratio of thermal expansion, thermal expansion coefficient, precipitation property of varnish, solder dipping thermal resistance, solder floating thermal resistance of multi-layer board, reflow thermal resistance of multi-layer board and T300 thermal resistance.
    Type: Application
    Filed: December 4, 2019
    Publication date: April 15, 2021
    Inventor: Shu-Hao CHANG
  • Patent number: 10976672
    Abstract: Systems and methods that include providing for measuring a first topographical height of a substrate at a first coordinate on the substrate and measuring a second topographical height of the substrate at a second coordinate on the substrate are provided. The measured first and second topographical heights may be provided as a wafer map. An exposure process is then performed on the substrate using the wafer map. The exposure process can include using a first focal point when exposing the first coordinate on the substrate and using a second focal plane when exposing the second coordinate on the substrate. The first focal point is determined using the first topographical height and the second focal point is determined using the second topographical height.
    Type: Grant
    Filed: April 29, 2019
    Date of Patent: April 13, 2021
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Jui-Ching Wu, Jeng-Horng Chen, Chia-Chen Chen, Shu-Hao Chang, Shang-Chieh Chien, Ming-Chin Chien, Anthony Yen
  • Publication number: 20210054151
    Abstract: A prepolymerized resin prepared by subjecting a composition to a pre-reaction in the presence of a polymerization inhibitor. The composition at least includes bis(vinylphenyl)ethane and polybutadiene. The polybutadiene has a 1,2-vinyl content of 85% or above and a number average molecular weight of less than 3000, wherein the pre-reaction has a conversion rate of between 30% and 90%. During the pre-reaction, components in the composition are partially crosslinked to leave residual vinyl groups. The composition further includes vinyl-containing polyphenylene ether and has a number average molecular weight of between 4,000 and 12,000.
    Type: Application
    Filed: November 10, 2020
    Publication date: February 25, 2021
    Inventor: Shu-Hao CHANG
  • Publication number: 20210018848
    Abstract: Embodiments of the present disclosure relate to methods for defect inspection. After pattern features are formed in a structure layer, a dummy filling material having dissimilar optical properties from the structure layer is filled in the pattern features. The dissimilar optical properties between materials in the pattern features and the structure layer increase contrast in images captured by an inspection tool, thus increasing the defect capture rate.
    Type: Application
    Filed: October 5, 2020
    Publication date: January 21, 2021
    Inventors: Ta-Ching YU, Shih-Che WANG, Shu-Hao CHANG, Yi-Hao CHEN, Chen-Yen KAO, Te-Chih HUANG, Yuan-Fu HSU
  • Patent number: 10894865
    Abstract: A prepolymerized resin and a preparation method thereof are provided, the method comprising a step of pre-reacting bis(vinylphenyl)ethane and polybutadiene. Bis(vinylphenyl)ethane may include 1,2-bis(4-vinylphenyl)ethane, 1,2-(3-vinylphenyl-4-vinylphenyl)ethane, 1,2-bis(3-vinylphenyl) ethane or a combination thereof. Polybutadiene has a 1,2-vinyl content of 85% or above and a number average molecular weight of less than 3000. A resin composition comprising the prepolymerized resin and an article made from the resin composition are also provided.
    Type: Grant
    Filed: May 21, 2018
    Date of Patent: January 19, 2021
    Assignee: Elite Material Co., Ltd.
    Inventor: Shu-Hao Chang
  • Publication number: 20210011383
    Abstract: A method is described for stabilizing organometallic coating interfaces through the use of multilayer structures that incorporate an underlayer coating. The underlayer is composed of an organic polymer that has crosslinking and adhesion-promoting functional groups. The underlayer composition may include photoacid generators. Multilayer structures for patterning are described based on organometallic radiation sensitive patterning compositions, such as alkyl tin oxo hydroxo compositions, which are placed over a polymer underlayer.
    Type: Application
    Filed: July 10, 2020
    Publication date: January 14, 2021
    Inventors: Brian J. Cardineau, Shu-Hao Chang, Jason K. Stowers, Michael Kocsis, Peter de Schepper
  • Patent number: 10865221
    Abstract: A phosphorus-containing flame retardant, a preparation method thereof, a resin composition comprising the phosphorus-containing flame retardant and an article made therefrom are disclosed. The phosphorus-containing flame retardant is characterized by having the advantages of high phosphorus content, high resin compatibility, not increasing gel time of varnish and low water absorption rate, and is therefore suitable for use as a flame retardant of various resin materials.
    Type: Grant
    Filed: May 11, 2018
    Date of Patent: December 15, 2020
    Assignee: ELITE MATERIAL CO., LTD.
    Inventors: Shu-Hao Chang, Zhilong Hu, Ching-Hsien Hsu
  • Patent number: 10825684
    Abstract: Provided is a material composition and method for that includes providing a substrate and forming a resist layer over the substrate. In various embodiments, the resist layer includes a multi-metal complex including an extreme ultraviolet (EUV) absorption element and a bridging element. By way of example, the EUV absorption element includes a first metal type and the bridging element includes a second metal type. In some embodiments, an exposure process is performed to the resist layer. After performing the exposure process, the exposed resist layer is developed to form a patterned resist layer.
    Type: Grant
    Filed: January 6, 2017
    Date of Patent: November 3, 2020
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Shu-Hao Chang, Chien-Chih Chen, Kuo-Chang Kau, Jeng-Horng Chen, Pi-Yeh Chia, Chi-Ren Chen, Ying-Chih Lin
  • Patent number: 10795270
    Abstract: Embodiments of the present disclosure relate to methods for defect inspection. After pattern features are formed in a structure layer, a dummy filling material having dissimilar optical properties from the structure layer is filled in the pattern features. The dissimilar optical properties between materials in the pattern features and the structure layer increase contrast in images captured by an inspection tool, thus increasing the defect capture rate.
    Type: Grant
    Filed: December 6, 2017
    Date of Patent: October 6, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Ta-Ching Yu, Shih-Che Wang, Shu-Hao Chang, Yi-Hao Chen, Chen-Yen Kao, Te-Chih Huang, Yuan-Fu Hsu
  • Patent number: 10685846
    Abstract: A method of fabricating a semiconductor integrated circuit (IC) is disclosed. An inverse mask is provided. A sacrificial layer is deposited over a substrate. A patterned photoresist layer is formed over the sacrificial layer using the inverse mask. The sacrificial layer is then etched through the patterned photoresist layer to form a patterned sacrificial layer. A hard mask layer is deposited over the patterned sacrificial layer. The patterned sacrificial layer is then removed to form a second pattern on the hard mask layer.
    Type: Grant
    Filed: May 16, 2014
    Date of Patent: June 16, 2020
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ming-Chin Chien, Jui-Ching Wu, Shu-Hao Chang, Shang-Chieh Chien, Jen-Yang Chung, Kuo-Chang Kau, Jeng-Horng Chen
  • Publication number: 20200124970
    Abstract: A rinse process is described for processing an initially patterned structure formed with an organometallic radiation sensitive material, in which the rinse process can remove portions of the composition remaining after pattern development to make the patterned structure more uniform such that a greater fraction of patterned structures can meet specifications. The radiation sensitive material can comprise alkyl tin oxide hydroxide compositions. The rinsing process can be effectively used to improve patterning of fine structures using extreme ultraviolet light.
    Type: Application
    Filed: October 16, 2019
    Publication date: April 23, 2020
    Inventors: Michael Kocsis, Peter De Schepper, Michael Greer, Shu-Hao Chang
  • Publication number: 20200050118
    Abstract: A lithography system includes a load lock chamber comprising an opening configured to receive a mask, an exposure module configured to expose a semiconductor wafer to a light source through use of the mask, and a cleaning module embedded inside the lithography tool, the cleaning module being configured to clean carbon particles from the mask.
    Type: Application
    Filed: October 22, 2019
    Publication date: February 13, 2020
    Inventors: Shu-Hao Chang, Norman Chen, Jeng-Horng Chen, Kuo-Chang Kau, Ming-Chin Chien, Shang-Chieh Chien, Anthony Yen, Kevin Huang
  • Patent number: 10557033
    Abstract: The disclosure relates to a resin composition, comprising an epoxy resin, a high molecular weight polyetheramine and an amine-terminated acrylonitrile rubber. Various products can be made from the resin composition, such as prepregs, laminates, printed circuit boards or rigid-flex boards, in which one, multiple or all of the following properties can be met: low resin flow, low dust weight loss, high peel strength at room temperature and at high temperature, low moisture absorption rate, and better varnish stability.
    Type: Grant
    Filed: December 9, 2016
    Date of Patent: February 11, 2020
    Assignee: ELITE MATERIAL CO., LTD.
    Inventor: Shu-Hao Chang
  • Patent number: 10514610
    Abstract: Disclosed is an apparatus for lithography patterning. The apparatus includes a substrate stage configured to hold a substrate coated with a deposition enhancement layer (DEL), a radiation source for generating a patterned radiation towards a surface of the DEL, and a supply pipe for flowing an organic gas near the surface of the DEL, wherein elements of the organic gas polymerize upon the patterned radiation, thereby forming a resist pattern over the DEL.
    Type: Grant
    Filed: July 9, 2018
    Date of Patent: December 24, 2019
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Shu-Hao Chang, Kuo-Chang Kau, Kevin Huang, Jeng-Horng Chen
  • Patent number: 10459352
    Abstract: A lithography system includes a load lock chamber comprising an opening configured to receive a mask, an exposure module configured to expose a semiconductor wafer to a light source through use of the mask, and a cleaning module embedded inside the lithography tool, the cleaning module being configured to clean carbon particles from the mask.
    Type: Grant
    Filed: August 31, 2015
    Date of Patent: October 29, 2019
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Shu-Hao Chang, Norman Chen, Jeng-Horng Chen, Kuo-Chang Kau, Ming-Chin Chien, Shang-Chieh Chien, Anthony Yen, Kevin Huang
  • Publication number: 20190300556
    Abstract: A phosphorus-containing flame retardant, a preparation method thereof, a resin composition comprising the phosphorus-containing flame retardant and an article made therefrom are disclosed. The phosphorus-containing flame retardant is characterized by having the advantages of high phosphorus content, high resin compatibility, not increasing gel time of varnish and low water absorption rate, and is therefore suitable for use as a flame retardant of various resin materials.
    Type: Application
    Filed: May 11, 2018
    Publication date: October 3, 2019
    Inventors: Shu-Hao CHANG, Zhilong HU, Ching-Hsien HSU
  • Publication number: 20190292326
    Abstract: A prepolymerized resin and a preparation method thereof are provided, the method comprising a step of pre-reacting bis(vinylphenyl)ethane and polybutadiene. Bis(vinylphenyl)ethane may include 1,2-bis(4-vinylphenyl)ethane, 1,2-(3-vinylphenyl-4-vinylphenyl)ethane, 1,2-bis(3-vinylphenyl) ethane or a combination thereof. Polybutadiene has a 1,2-vinyl content of 85% or above and a number average molecular weight of less than 3000. A resin composition comprising the prepolymerized resin and an article made from the resin composition are also provided.
    Type: Application
    Filed: May 21, 2018
    Publication date: September 26, 2019
    Inventor: Shu-Hao CHANG
  • Publication number: 20190250522
    Abstract: Systems and methods that include providing for measuring a first topographical height of a substrate at a first coordinate on the substrate and measuring a second topographical height of the substrate at a second coordinate on the substrate are provided. The measured first and second topographical heights may be provided as a wafer map. An exposure process is then performed on the substrate using the wafer map. The exposure process can include using a first focal point when exposing the first coordinate on the substrate and using a second focal plane when exposing the second coordinate on the substrate. The first focal point is determined using the first topographical height and the second focal point is determined using the second topographical height.
    Type: Application
    Filed: April 29, 2019
    Publication date: August 15, 2019
    Inventors: Jui-Ching WU, Jeng-Horng CHEN, Chia-Chen CHEN, Shu-Hao CHANG, Shang-Chieh CHIEN, Ming-Chin CHIEN, Anthony YEN
  • Patent number: 10274838
    Abstract: Systems and methods that include providing for measuring a first topographical height of a substrate at a first coordinate on the substrate and measuring a second topographical height of the substrate at a second coordinate on the substrate are provided. The measured first and second topographical heights may be provided as a wafer map. An exposure process is then performed on the substrate using the wafer map. The exposure process can include using a first focal point when exposing the first coordinate on the substrate and using a second focal plane when exposing the second coordinate on the substrate. The first focal point is determined using the first topographical height and the second focal point is determined using the second topographical height.
    Type: Grant
    Filed: May 22, 2013
    Date of Patent: April 30, 2019
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Jui-Ching Wu, Jeng-Horng Chen, Chia-Chen Chen, Shu-Hao Chang, Shang-Chieh Chien, Ming-Chin Chien, Anthony Yen
  • Publication number: 20190064675
    Abstract: Embodiments of the present disclosure relate to methods for defect inspection. After pattern features are formed in a structure layer, a dummy filling material having dissimilar optical properties from the structure layer is filled in the pattern features. The dissimilar optical properties between materials in the pattern features and the structure layer increase contrast in images captured by an inspection tool, thus increasing the defect capture rate.
    Type: Application
    Filed: December 6, 2017
    Publication date: February 28, 2019
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Ta-Ching YU, Shih-Che WANG, Shu-Hao CHANG, Yi-Hao CHEN, Chen-Yen KAO, Te-Chih HUANG, Yuan-Fu HSU