Patents by Inventor Shu-Hsien Chung

Shu-Hsien Chung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Packing structure
    Patent number: 10930085
    Abstract: A packing structure including a first packing component, a second packing component, and two lenses is provided. The second packing component is adapted to be combined with the first packing component detachably, such that a containing space is formed between the first packing component and the second packing component. The containing space is adapted to contain an electronic device. The two lenses are disposed on the second packing component. An image displayed by a display surface of the electronic device is adapted to be transmitted to outside of the containing space through the two lenses, so as to form a virtual reality image.
    Type: Grant
    Filed: October 29, 2019
    Date of Patent: February 23, 2021
    Assignee: Acer Incorporated
    Inventors: Shu-Hsien Chung, Jhih-Hsien Wu, Chung-Hsien Lee, Ming-Haw Wang
  • PACKING STRUCTURE
    Publication number: 20200066053
    Abstract: A packing structure including a first packing component, a second packing component, and two lenses is provided. The second packing component is adapted to be combined with the first packing component detachably, such that a containing space is formed between the first packing component and the second packing component. The containing space is adapted to contain an electronic device. The two lenses are disposed on the second packing component. An image displayed by a display surface of the electronic device is adapted to be transmitted to outside of the containing space through the two lenses, so as to form a virtual reality image.
    Type: Application
    Filed: October 29, 2019
    Publication date: February 27, 2020
    Applicant: Acer Incorporated
    Inventors: Shu-Hsien Chung, Jhih-Hsien Wu, Chung-Hsien Lee, Ming-Haw Wang
  • Packing structure
    Patent number: 10497176
    Abstract: A packing structure including a first packing casing, a second packing casing, and two lenses is provided. The second packing casing is adapted to be combined with the first packing casing detachably, such that a containing space is formed between the first packing casing and the second packing casing. The containing space is adapted to contain an electronic device. The two lenses are disposed on the second packing casing. An image displayed by a display surface of the electronic device is adapted to be transmitted to outside of the containing space through the two lenses, so as to form a virtual reality image.
    Type: Grant
    Filed: April 10, 2017
    Date of Patent: December 3, 2019
    Assignee: Acer Incorporated
    Inventors: Shu-Hsien Chung, Jhih-Hsien Wu, Chung-Hsien Lee, Ming-Haw Wang
  • PACKING STRUCTURE
    Publication number: 20170372520
    Abstract: A packing structure including a first packing component, a second packing component, and two lenses is provided. The second packing component is adapted to be combined with the first packing component detachably, such that a containing space is formed between the first packing component and the second packing component. The containing space is adapted to contain an electronic device. The two lenses are disposed on the second packing component. An image displayed by a display surface of the electronic device is adapted to be transmitted to outside of the containing space through the two lenses, so as to form a virtual reality image.
    Type: Application
    Filed: April 10, 2017
    Publication date: December 28, 2017
    Applicant: Acer Incorporated
    Inventors: Shu-Hsien Chung, Jhih-Hsien Wu, Chung-Hsien Lee, Ming-Haw Wang