Abstract: An electronic device including a panel is provided. The panel includes a first substrate, a second substrate opposite to the first substrate, a medium layer disposed between the first substrate and the second substrate, a sealant disposed between the first substrate and the second substrate and surrounding the medium layer, a plurality of first electrodes disposed between the first substrate and the medium layer, and a plurality of connecting lines disposed between the second substrate and the first electrodes. The sealant includes a plurality of conductive particles. The first electrodes are electrically connected to the connection lines through the conductive particles. There is a first space S1 between two adjacent connecting lines of the connecting lines. One of the conductive particles has a width of W. The first space S1 and the width W conform to the following formula: 3<S1/W<20.

Abstract: A method for dynamically resizing an instruction memory and a data memory in a system includes: defining, by a memory control circuit, a plurality of memory selection modes; selecting a memory selection mode from the plurality of memory selection modes, and writing the memory selection mode into a firmware control register; and redistributing, by the memory control circuit, a plurality of memory cells in the instruction memory and a plurality of memory cells in the data memory according to the memory selection mode stored in the firmware control register.

Abstract: The present disclosure provides a semiconductor structure. The semiconductor structure includes an insulation layer. A bottom electrode via is disposed in the insulation layer. The bottom electrode via includes a conductive portion and a capping layer over the conductive portion. A barrier layer surrounds the bottom electrode via. A magnetic tunneling junction (MTJ) is disposed over the bottom electrode via.

Abstract: A method of forming integrated circuits includes forming Magnetic Tunnel Junction (MTJ) stack layers, depositing a conductive etch stop layer over the MTJ stack layers, depositing a conductive hard mask over the conductive etch stop layer, and patterning the conductive hard mask to form etching masks. The patterning is stopped by the conductive etch stop layer. The method further includes etching the conducive etch stop layer using the etching masks to define patterns, and etching the MTJ stack layers to form MTJ stacks.

Abstract: A permeable spraying device for making drug tablets mainly comprises a carrying platform, a spraying equipment, a flattening device and a control equipment, the carrying platform defines a powder dropping area and a flattened spraying area, and a moving device combined with the carrying platform is capable of moving vertically. The spraying equipment is mounted above the carrying platform, and the spraying equipment comprises a powder box, a colloid spraying equipment, a driving device and a placement platform. The placement platform is disposed with a plurality of supplementary colloid carriers. The flattening device is installed on the carrying platform and moves horizontally back and forth in the flattened spraying area. The control equipment is equipped with a storage unit and an execution control unit. A multi-layer drug body structure can be formed by deposition, stacking and bonding.

Abstract: Embodiments of this application provide a method and apparatus, a terminal and a medium. The method includes the following steps. A target terminal displays, in a video session, a video session interface including an image display region for displaying images associated with one or more users participating in the video session. The target terminal displays a target virtual image of a user of the target terminal in the image display region. The target terminal acquires movement information of the user and controls the target virtual image displayed in the image display region to perform a target interaction action corresponding to the movement information of the user. Finally, the target terminal transmits movement data of the target virtual image performing the target interaction action, to terminals of the other users of the video session to render the target virtual image to perform the target interaction action on the corresponding terminals.

Abstract: A semiconductor structure and forming method thereof are provided. A substrate includes a first region, a second region, and a boundary region defined between the first region and the second region. An isolation structure is disposed in the boundary region. An upper surface of the isolation structure has a stepped profile. A first boundary dielectric layer and a second boundary dielectric layer are disposed over the isolation structure. The first boundary dielectric layer is substantially conformal with respect to the stepped profile of the isolation structure.

Abstract: The present invention relates to a network connection system. The network connection system includes a gateway, an extender, and a wireless access point. Wherein, the gateway can be used as one of the enrollee router and the registrar router, and the extender can be used as the other of the enrollee router and the registrar router, and the extender can send authentication information to the gateway. After the gateway confirms that the extender is a model supported by the gateway according to the authentication information, the gateway sends a credential to the extender, allowing the extender to establish a wireless mesh network through the wireless access point. In this way, the purpose of seamless connection is achieved. In addition, the network connection system of the present invention has functions such as high security and convenience.

Abstract: A method and apparatus for video coding. According to the method, a set of candidates associated with coding modes or mode parameters are determined. Boundary matching costs associated with the set of candidates are determined, where each of the boundary matching costs is determined for one target candidate of the set of candidates. The costs are calculated by using reconstructed or predicted samples of the current block and one or more neighboring blocks of the current block. Each of the boundary matching costs is calculated using one target configuration selected from a plurality of configurations. A final candidate is selected from the set of candidates based on the boundary matching costs. The current block is encoded or decoded using the final candidate.

Abstract: The present disclosure relates to the technical field of Gastrodia elata planting, in particular to an organic planting method of G. elata, including the process of mycelia colonized material preparation: cutting a branch of Quercus acutissima into bars; cutting out fish scale openings on the bars to obtain bars with the fish scale openings; successively soaking the bars with the fish scale openings in boiling water and a growth-promoting solution to obtain bars after growth promotion treatment; and putting Amillariella mellea spawns and an inoculation substrate into each fish scale opening of the bars after the growth promotion treatment to obtain a mycelia colonized material. The growth-promoting solution and the inoculation substrate are prepared by treatment of fresh G. elata stalks with Bacillus pumilus and hot-dip extraction treatment in ethanol.

Abstract: This disclosure describes processes for performing direct memory access (“DMA”) between memory of a host and memory of a smart network interface controller (“SNIC”) connected to a bus of the host. The host runs a host thread in a processor of the host and the SNIC runs a SNIC thread in a processor of the SNIC. The host thread and the SNIC thread facilitate direct access of the SNIC thread to memory locations in the memory of the host. The SNIC thread can fetch data directly from and/or write data directly to the memory locations of the memory of the host over the bus.

Abstract: A method for organically planting Dendrobium, including using a planting medium in the epiphytic planting step of Dendrobium. The raw materials of planting medium include fermented powder of Dendrobium candidum leaves and sawdust; a method for preparing the fermented powder of Dendrobium candidum leaves is as follows: cutting Dendrobium candidum leaves into small pieces and mashing the small pieces of Dendrobium candidum leaves to obtain materials to be fermented, and then adding liquid medium to the materials to be fermented to obtain fermentation system; sterilizing the fermentation system, adding fermentation bacteria to the fermentation system to obtain a mixture, fermenting and filtering the mixture to obtain post-culturing fermentation broth and fermented products of Dendrobium candidum leaves, dewatering and crushing the fermented products of Dendrobium candidum leaves to obtain fermented powder of Dendrobium candidum leaves.

Abstract: A package structure includes a semiconductor device and an adhesive pattern. The adhesive pattern surrounds the semiconductor device, wherein an angle ? is formed between a sidewall of the semiconductor device and a sidewall of the adhesive pattern, 0°<?<90° wherein the adhesive layer has a first opening misaligned with a corner of the semiconductor device closest to the first opening.

Abstract: This disclosure is directed to processes and systems for generating data packets in a smart network interface controller (“SNIC”) of a host server computer. A smart packet generator (“spktgen”) controller receives a user command that contains directions for how packets are generated in the SNIC. The command is sent to a spktgen daemon that runs in a control core of the multicore processor. The spktgen daemon extracts the type of packet generator and packet parameters recorded in the command and sends the type of packet generator and packet parameters to a spktgen engine that also runs in the control core. The spktgen engine creates threads in each of one or more data cores of the multicore processor. Each thread comprises instructions for generating data packets from the data generated by data generating sources of the host in accordance with the type of packet generator and the packet parameters.

Abstract: A video encoder receives raw pixel data to be encoded as a current block of a current picture of a video into a bitstream. The video encoder identifies multiple candidate bi-prediction positions for the current block, including a center position, a first set of offset positions, and a second set of offset positions. The first set of offset positions and the second set of offset positions interleave each other. The encoder computes distortion values for each of the candidate bi-prediction positions based on several possible weighting parameter values. The distortion values for the center position are based on each of the several possible weighting parameter values. The distortion values for the first set of offset positions are based on a first subset of the possible weighting parameter values. The distortion values for the second set of offset positions are based on a second subset of the possible weighting parameter values.

Abstract: A video coding system generating candidates for Merge Mode with Motion Vector Difference (MMVD) with reduced resource usage is provided. The system receives data to be encoded or decoded as a current block of a current picture of a video. The system identifies multiple MMVD candidates for different offset positions based on a merge candidate of the current block. The system generates reference samples for the identified MMVD candidates. The system reconstructs the current block or encodes the current block into a bitstream by using the generated reference samples. The system processes the MMVD candidates in separate groups: a first group of vertical MMVD candidates and a second group of horizontal MMVD candidates. The system generates the reference samples for the identified MMVD candidates by applying a vertical filter to source reference samples of horizontal MMVD candidates and then applying a horizontal filter to outputs of the vertical filter.

Abstract: A mouse device includes a wheel control mechanism and a control unit. The control unit is electrically connected with a magnetic force module and a rotating speed detector of the wheel control mechanism. Under control of the control unit, a first direction current or a second direction current is selectively provided to drive the magnetic force module. The flowing directions of the first direction current and the second direction current are opposite. Consequently, the rotating mode of the wheel control mechanism can be switched between different modes.

Abstract: The present disclosure provides a method for manufacturing semiconductor structure, including forming an insulation layer, forming a first via trench in the insulation layer, forming a barrier layer in the first via trench, forming a bottom electrode via in the first via trench, forming a magnetic tunneling junction (MTJ) layer above the bottom electrode via, and performing an ion beam etching operation, including patterning the MTJ layer to form an MTJ and removing a portion of the insulation layer from a top surface.

Abstract: A coolant distribution unit providing reliant circulation of coolant in a liquid cooling system for a heat-generating component such as a computer server is disclosed. The coolant distribution unit includes a manifold unit having a supply connector to supply coolant to the heat-generating component and a collection connector to collect coolant from a heat exchanger. A first pump has an inlet coupled to the manifold unit and an outlet coupled to the manifold unit. The first pump circulates coolant from the inlet to the outlet. A second pump has an inlet coupled to the manifold unit and an outlet coupled to the manifold. The second pump circulates coolant from the inlet to the outlet. The second pump may be disconnected from the manifold unit, while the first pump continues to circulate coolant through the manifold unit.

Abstract: A semiconductor structure includes a first die, second dies coupled to and on the first die, a dielectric layer on the first die and covering each second die, and through dielectric vias (TDVs) coupled to and on the first die. The first die includes a bonding dielectric layer and bonding features embedded in and leveled with the bonding dielectric layer. An array of second dies is arranged in a first region of the first die. Each second die includes a bonding dielectric layer and a bonding feature embedded in and leveled with the bonding dielectric layer. The bonding dielectric layer and the bonding feature of each second die are respectively bonded to those of the first die. The TDVs are laterally covered by the dielectric layer in a second region of the first die which is connected to the first region and arranged along a periphery of the first die.