Abstract: In an embodiment, an interposer has a first side, a first integrated circuit device attached to the first side of the interposer with a first set of conductive connectors, each of the first set of conductive connectors having a first height, a first die package attached to the first side of the interposer with a second set of conductive connectors, the second set of conductive connectors including a first conductive connector and a second conductive connector, the first conductive connector having a second height, the second conductive connector having a third height, the third height being different than the second height, a first dummy conductive connector being between the first side of the interposer and the first die package, an underfill disposed beneath the first integrated circuit device and the first die package, and an encapsulant disposed around the first integrated circuit device and the first die package.

Abstract: A first FinFET device includes first fin structures that extend in a first direction in a top view. A second FinFET device includes second fin structures that extend in the first direction in the top view. The first FinFET device and the second FinFET device are different types of FinFET devices. A plurality of gate structures extend in a second direction in the top view. The second direction is different from the first direction. Each of the gate structures partially wraps around the first fin structures and the second fin structures. A dielectric structure is disposed between the first FinFET device and the second FinFET device. The dielectric structure cuts each of the gate structures into a first segment for the first FinFET device and a second segment for the second FinFET device. The dielectric structure is located closer to the first FinFET device than to the second FinFET device.

Abstract: A Carbazole-N-Benzimidazole bipolar material and organic light emitting diodes using the same is provided. The organic light emitting diodes include a substrate, a first conducting layer, a hole transporting layer, a light emitting layer, an electron transporting layer, and a second conducting layer. The first conducting layer is disposed on the substrate. The hole transporting layer is disposed on the first conducting layer. The light emitting layer having the Carbazole-N-Benzimidazole bipolar material is disposed on the hole transporting layer. The electron transporting layer is disposed on the light emitting layer. The second conducting layer is disposed on the electron transporting layer.

Abstract: The present invention includes a connecting device and a covering plate, wherein the covering plate is disposed on a top surface of the connecting device. When stop pieces located on the covering plate are made to slide into clasp grooves of the connecting device, clasp holes in the stop pieces clasp onto protruding shafts located in the clasp grooves. Moreover, a position fixing piece located on one side of the covering plate abuts against an edge of the clasp groove, thereby achieving a tight joining configuration between the covering plate and the connecting device that prevents the covering plate from coming loose and sliding out of position. Furthermore, a clamp hook piece extending from an end of the stop piece is used to clamp onto a bottom portion of the connecting device, thereby preventing signal interference when the connecting device is in contact with a device.