Patents by Inventor Shuhei ICHIKAWA

Shuhei ICHIKAWA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200308725
    Abstract: A sputtering equipment configured to grow a gallium oxide film on a substrate is proposed, and the sputtering equipment may include: a chamber; a stage located in the chamber and configured to secure the substrate thereon; a gallium target located in the chamber and including gallium elements; a first power supply configured to apply voltage to the gallium target; and an oxygen element supplier configured to supply oxygen elements into the chamber.
    Type: Application
    Filed: March 6, 2020
    Publication date: October 1, 2020
    Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventor: Shuhei ICHIKAWA
  • Publication number: 20200303225
    Abstract: A method of manufacturing a semiconductor device may include: exposing a surface of a gallium oxide substrate to an acidic or alkaline chemical solution so as to increase a surface roughness of the surface; and forming an electrode on the surface having the increased surface roughness.
    Type: Application
    Filed: February 19, 2020
    Publication date: September 24, 2020
    Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventor: Shuhei ICHIKAWA
  • Patent number: 10720329
    Abstract: A method of manufacturing a semiconductor apparatus includes preparing a semiconductor substrate, and forming a Schottky electrode that is in Schottky contact with a surface of the semiconductor substrate. The Schottky electrode is made of a metal material containing a predetermined concentration of oxygen atoms.
    Type: Grant
    Filed: September 14, 2018
    Date of Patent: July 21, 2020
    Assignee: DENSO CORPORATION
    Inventor: Shuhei Ichikawa
  • Publication number: 20190109005
    Abstract: A method of manufacturing a semiconductor apparatus includes preparing a semiconductor substrate, and forming a Schottky electrode that is in Schottky contact with a surface of the semiconductor substrate. The Schottky electrode is made of a metal material containing a predetermined concentration of oxygen atoms.
    Type: Application
    Filed: September 14, 2018
    Publication date: April 11, 2019
    Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventor: Shuhei ICHIKAWA
  • Patent number: 9363900
    Abstract: A mounting device in which a conductive film that is not separated is formed on a resin substrate. Alloy thin films, which contain more than 50% by atom of Cu, 5% by atom or more and 30% by atom or less of Ni, and 3% by atom or more and 10% by atom or less of Al, are formed on a base consisting of a resin so as to be brought into contact with a surface of the base by sputtering. Conductive films consisting of copper are formed on surfaces of the alloy thin films so as to obtain a wiring film having a two-layer structure and a metal plug filled in a connection hole. The alloy thin films have high adhesion to a resin; and hence, the wiring film and the metal plug are not separated.
    Type: Grant
    Filed: April 22, 2015
    Date of Patent: June 7, 2016
    Assignee: ULVAC, INC.
    Inventors: Satoru Takasawa, Shuhei Ichikawa, Isao Sugiura, Satoru Ishibashi, Junichi Nitta
  • Publication number: 20150230343
    Abstract: A mounting device in which a conductive film that is not separated is formed on a resin substrate. Alloy thin films, which contain more than 50% by atom of Cu, 5% by atom or more and 30% by atom or less of Ni, and 3% by atom or more and 10% by atom or less of Al, are formed on a base consisting of a resin so as to be brought into contact with a surface of the base by sputtering. Conductive films consisting of copper are formed on surfaces of the alloy thin films so as to obtain a wiring film having a two-layer structure and a metal plug filled in a connection hole. The alloy thin films have high adhesion to a resin; and hence, the wiring film and the metal plug are not separated.
    Type: Application
    Filed: April 22, 2015
    Publication date: August 13, 2015
    Applicant: ULVAC, INC.
    Inventors: Satoru TAKASAWA, Shuhei ICHIKAWA, Isao SUGIURA, Satoru ISHIBASHI, Junichi NITTA