Abstract: A pattern forming method including: a process of forming a film using an actinic ray-sensitive or radiation-sensitive resin composition containing a resin including a Repeating Unit (a1) having a group capable of being decomposed by acid and generating a carboxyl group, and a compound capable of generating acid through irradiation of actinic rays or radiation; a process of exposing the film; and a process of developing the exposed film using a developer including an organic solvent to form a negative tone pattern, wherein the value X obtained by substituting the number of each atom included in the Repeating Unit (a1) after being decomposed by acid and generating a carboxyl group in the following formula is 0<X?5.

Abstract: An actinic ray-sensitive or radiation-sensitive resin composition capable of forming a hole pattern which has an ultrafine pore diameter (for example, 60 nm or less) and has an excellent cross-sectional shape with excellent local pattern dimensional uniformity; and a resist film, a pattern forming method, a method for preparing an electronic device, and an electronic device, each using the same, are provided.

Abstract: Assuming that a direction in which a first member and a second member are arranged is a first direction and a direction orthogonal to the first direction is a second direction, a welding structure includes: a pressure fit portion; a first cavity; a second cavity; a first weld bead formed between the first cavity and an end of a joining part of the first member and the second member on one side in the second direction by welding the first member and second member while the second cavity is communicated with outside; a second weld bead formed between the second cavity and an end of the joining part on the other side in the second direction; and a cutout groove communicating between the first cavity and the second cavity.

Abstract: A pattern forming method, includes: (i) a step of forming a film from an actinic ray-sensitive or radiation-sensitive resin composition containing (P) a resin having (a1) a repeating unit represented by the following formula (I) or (II) as defined in the specification in an amount of 20 mol % or more based on all repeating units in the resin (P) and (B) a compound capable of generating an acid upon irradiation with an actinic ray or radiation; (ii) a step of exposing the film, so as to form an exposed film; and (iii) a step of developing the exposed film by using a developer containing an organic solvent to form a negative pattern.

Abstract: A pattern forming method, includes: (i) a step of forming a film from an actinic ray-sensitive or radiation-sensitive resin composition containing (P) a resin having (a1) a repeating unit capable of decomposing by an action of an acid to produce a carboxyl group, represented by the following formula (I) as defined in the specification and (B) a compound capable of generating an acid upon irradiation with an actinic ray or radiation; (ii) a step of exposing the film; and (iii) a step of performing a development by using a developer containing an organic solvent to form a negative pattern.

Abstract: A pattern forming method contains (i) a step of forming a film by an actinic ray-sensitive or radiation-sensitive resin composition containing (P) a resin having (a) a repeating unit represented by the specific formula, and (B) a compound capable of generating an organic acid upon irradiation with an actinic ray or radiation; (ii) a step of exposing the film, and (iii) a step of developing the film by using an organic solvent-containing developer to form a negative pattern.

Abstract: An actinic ray-sensitive or radiation-sensitive resin composition includes: (A) a compound capable of generating an acid upon irradiation with an actinic ray or radiation; (B) a resin capable of increasing a dissolution rate of the resin (B) in an alkali developer by an action of an acid, the resin (B) containing a specific repeating unit having a lactone structure; and (D) a low molecular compound having a group capable of leaving by an action of an acid, and a pattern forming method uses the composition.

Abstract: An actinic ray-sensitive or radiation-sensitive resin composition, wherein when a film having a film thickness of 100 nm is formed from the actinic ray-sensitive or radiation-sensitive resin composition, the film has a transmittance of 55 to 80% for light at a wavelength of 193 nm, and a pattern forming method using the composition are provided.

Abstract: An actinic ray-sensitive or radiation-sensitive resin composition includes: (A) a compound capable of generating an acid upon irradiation with an actinic ray or radiation; (B) a resin capable of increasing a dissolution rate of the resin (B) in an alkali developer by an action of an acid, the resin (B) containing a specific repeating unit having a lactone structure; and (D) a low molecular compound having a group capable of leaving by an action of an acid, and a pattern forming method uses the composition.

Abstract: When welding from both sides of a weld part where a first member and a second member, which are the objects being joined, face each other is performed by first welding performed from one side and second welding performed from the other opposite side from that first welding, heat quantity adjustment, that adjusts the quantity of heat input to the weld part for the second welding, which is performed after the first welding, is carried out such that an amount of welding distortion that is the objective arises.

Abstract: According to one embodiment, an actinic-ray- or radiation-sensitive resin composition includes a compound (A) that when exposed to actinic rays or radiation, generates any of the acids of general formula (II) below and a resin (B) whose rate of dissolution into an alkali developer is increased by the action of an acid. (The characters used in general formula (I) have the meanings mentioned in the description.

Abstract: Provided is a composite nanometal paste which, when a layer of the paste interposed between upper and lower bodies is sintered in an inert gas under no load until the layer turns to a metal layer, attains a shear bond strength between the upper and lower bodies of 10 MPa or higher. The composite nanometal paste contains, as metallic components, composite metallic nanoparticles comprising metal cores with an average particle diameter of X (nm) and an organic coating layer formed around the circumference, metallic nanofiller particles having an average particle diameter of d (nm), and metallic filler particles having an average particle diameter of D (nm), and satisfies the first relation X<d<D and the second relation X<d<100 (nm).

Abstract: An actinic ray-sensitive or radiation-sensitive resin composition includes (A) a resin having at least two of repeating units represented by general formula (1) below and exhibiting increased solubility in an alkali developer when acted on by an acid, and (B) a compound that generates an acid when exposed to actinic rays or radiation. In the formula, each of R, A, R0, Z, L and n represents the same as defined in the claims and in the specification.

Abstract: An actinic ray-sensitive or radiation-sensitive resin composition includes (A) a compound capable of generating a specific acid having a norbornyl structure upon irradiation with an actinic ray or radiation, and (B) a resin capable of increasing the dissolution rate of the resin (B) in an alkali developer by an action of an acid, the resin (B) containing a specific repeating unit having a lactone structure on the resin side chain through a linking group, and a pattern forming method uses the composition.

Abstract: Provided is an actinic-ray- or radiation-sensitive resin composition including (A) a compound that when exposed to actinic rays or radiation, generates an acid, (B) a resin that when acted on by an acid, increases its rate of dissolution in an alkali developer, and (C) a hydrophobic resin, wherein the hydrophobic resin (C) contains a repeating unit derived from any of monomers of general formula (1) below.

Abstract: An adhesive composition for medical use of the present invention includes an acrylic copolymer, a medicament having a carboxyl group, and a base, the acrylic copolymer is prepared by copolymerization of a monomer mixture containing 0.1 to 2 mass % of an ethylenically unsaturated carboxylic acid monomer as a monomer A, 58 to 99.9 mass % of an alkyl(meth)acrylate ester having an alkyl group of 4 to 12 carbon atoms as a monomer B, 30 mass % or less of an alkyl(meth)acrylate ester having 1 to 3 carbon atoms as a monomer C, and 30 mass % or less of a monomer having an ethylenically unsaturated group other than those of the monomers A to C (the total of monomers A to D is taken as 100 mass %) as a monomer D, and the content of sulfuric acid in the acrylic copolymer is 700 ppm by mass or less.

Abstract: An actinic ray-sensitive or radiation-sensitive resin composition of the present invention includes a resin (P) having a repeating unit (a) represented by following General Formula (I), a compound (B) generating organic acid by irradiation of actinic ray or radiation, and 1% by mass or more of a resin (C) which has at least one of a fluorine atom and a silicon atom and is different from the resin (P) with regard to total solids of the actinic ray-sensitive or radiation-sensitive resin composition, wherein, in General Formula (I), R0 represents a hydrogen atom or a methyl group, and each of R1, R2, and R3 independently represents a straight chain or branched alkyl group.

Abstract: The pattern forming method of the invention includes (i) forming a film using an actinic ray-sensitive or radiation-sensitive resin composition containing a resin (P) having a repeating unit (a) represented by the following general formula (I), a compound (B) capable of generating an organic acid upon irradiation with actinic rays or radiation, and a nitrogen-containing organic compound (NA) having a group capable of leaving by the action of an acid, (ii) exposing the film, and (iii) developing the film after the exposure using a developer including an organic solvent to form a negative type pattern, in the general formula (I), R0 represents a hydrogen atom or a methyl group, and each of R1, R2, and R3 independently represents a linear or branched alkyl group.