Abstract: An electrical contact material includes an electroconductive substrate, and a silver-containing layer including silver provided to at least part of a surface of the electroconductive substrate. An average CI value of the silver-containing layer is 0.6 or more in a cross section of the electrical contact material.

Abstract: An electrical contact material includes an electroconductive substrate, and a silver-containing layer including silver provided to at least part of a surface of the electroconductive substrate. An average KAM value of the silver-containing layer is 0.20° or more and 2.00° or less in a cross section of the electrical contact material.

Abstract: An electrical contact material includes an electroconductive substrate, and a silver-containing layer including silver provided to at least part of a surface of the electroconductive substrate. An average GOS value of the silver-containing layer is 1.00° or less and a proportion of KAM value of 1.00° or more in the silver-containing layer is 20% or more in a cross section of the electrical contact material.

Abstract: A surface-treated material of the present disclosure has a conductive substrate, and a surface treatment film which includes at least one layer of metal layers and is formed on the conductive substrate. The surface treatment film is a plating film. The surface treatment film is formed on a whole surface or a part of the conductive substrate through a zinc-containing layer that contains zinc as a main component and has a thickness of 50 nm or less, or is formed on the conductive substrate without through the zinc-containing layer. The surface-treated material has a ratio of a contact area to a test area of 85% or more as measured according to a tape test method defined in JIS H 8504: 1999.

Abstract: A metallic material for an electrical electronic includes a CU—Sun alloy layer (2) provided on a conductive base (1). A Cu concentration of the Cu—Sn alloy layer gradually decreases from the base side to the surface (3) side.

Abstract: A connector terminal, fabricated from a metallic material for connector which material has a tin or tin alloy layer, formed on a copper or copper alloy base material, wherein the thickness of the tin or tin alloy layer at a contact site on the surface of the terminal is smaller than the thickness of the tin or tin alloy layer in the areas other than the contact site, and a copper-tin alloy layer is formed as an under layer of the tin or tin alloy layer at the contact site; and a connector terminal, fabricated from a metallic material for connector which material has a copper or copper alloy base material, wherein a copper-tin alloy layer is formed in a spot shape at a contact site on the surface of the terminal, and a tin or tin alloy layer is formed in the remaining areas on the surface.

Abstract: A connector includes a male terminal and a female terminal. At least one of the male terminal and the female terminal has an outermost surface layer formed of a metallic material as an alloy layer of Cu—Sn. The alloy layer of Cu—Sn has a concentration of Cu decreasing gradually toward a surface thereof. The metallic material for the connector includes the outermost surface layer formed of the alloy layer of Cu—Sn. The alloy layer of Cu—Sn has the concentration of Cu decreasing gradually toward the surface thereof.

Abstract: A composite material for an electric/electronic part, having a metal base, a resin film on at least a part of the metal base, and a layer of Sn or a Sn alloy on at least a part of the metal base at a site where the resin film is not provided, the layer of Sn or a Sn alloy including a solidified structure, and the resin film having a residual solvent quantity adjusted to 5% to 25% by mass.

Abstract: A metallic material for a connecting part, having a rectangular wire material of copper or a copper alloy as a base material, and formed at an outermost surface thereof, a copper-tin alloy layer substantially composed of copper and tin, wherein the copper-tin alloy layer of the outermost surface further contains at least one selected from the group consisting of zinc, indium, antimony, gallium, lead, bismuth, cadmium, magnesium, silver, gold, and aluminum, in a total amount of 0.01% or more and 1% or less in terms of mass ratio with respect to the content of the tin.

Abstract: A composite material for an electric/electronic part, having a metal base, a resin film on at least a part of the metal base, and a layer of Sn or a Sn alloy on at least a part of the metal base at a site where the resin film is not provided, the layer of Sn or a Sn alloy including a solidified structure, and the resin film having a residual solvent quantity adjusted to 5% to 25% by mass.

Abstract: A metallic material for a connecting part, having a rectangular wire material of copper or a copper alloy as a base material, and formed at an outermost surface thereof, a copper-tin alloy layer substantially composed of copper and tin, wherein the copper-tin alloy layer of the outermost surface further contains at least one selected from the group consisting of zinc, indium, antimony, gallium, lead, bismuth, cadmium, magnesium, silver, gold, and aluminum, in a total amount of 0.01% or more and 1% or less in terms of mass ratio with respect to the content of the tin.

Abstract: A connector terminal, fabricated from a metallic material for connector which material has a tin or tin alloy layer, formed on a copper or copper alloy base material, wherein the thickness of the tin or tin alloy layer at a contact site on the surface of the terminal is smaller than the thickness of the tin or tin alloy layer in the areas other than the contact site, and a copper-tin alloy layer is formed as an under layer of the tin or tin alloy layer at the contact site; and a connector terminal, fabricated from a metallic material for connector which material has a copper or copper alloy base material, wherein a copper-tin alloy layer is formed in a spot shape at a contact site on the surface of the terminal, and a tin or tin alloy layer is formed in the remaining areas on the surface.

Abstract: A metallic material for a connector, having a base material of a bar material or a rectangular wire material formed of copper or a copper alloy, in which a striped copper-tin alloy layer is formed in the longitudinal direction of the metallic material on a part of the surface of the metallic material, and in which a tin layer or a tin alloy layer is formed on the remaining part of the surface of the metallic material; and, a method of producing a metallic material for a connector, containing: providing a bar material or a rectangular wire material of copper or a copper alloy as a base material; forming a tin plating layer or a tin alloy plating layer on the base material, to obtain an intermediate material; and subjecting the intermediate material to reflow treatment in a stripe form in the longitudinal direction of the intermediate material.

Abstract: A metallic material for an electrical electronic includes a CU-Sun alloy layer (2) provided on a conductive base (1). A Cu concentration of the Cu—Sn alloy layer gradually decreases from the base side to the surface (3) side.

Abstract: A connector includes a male terminal and a female terminal. At least one of the male terminal and the female terminal has an outermost surface layer formed of a metallic material as an alloy layer of Cu—Sn. The alloy layer of Cu—Sn has a concentration of Cu decreasing gradually toward a surface thereof. The metallic material for the connector includes the outermost surface layer formed of the alloy layer of Cu—Sn. The alloy layer of Cu—Sn has the concentration of Cu decreasing gradually toward the surface thereof.